JP2007134618A5 - - Google Patents

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Publication number
JP2007134618A5
JP2007134618A5 JP2005328380A JP2005328380A JP2007134618A5 JP 2007134618 A5 JP2007134618 A5 JP 2007134618A5 JP 2005328380 A JP2005328380 A JP 2005328380A JP 2005328380 A JP2005328380 A JP 2005328380A JP 2007134618 A5 JP2007134618 A5 JP 2007134618A5
Authority
JP
Japan
Prior art keywords
resin layer
insulating resin
sheet
circuit module
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005328380A
Other languages
English (en)
Japanese (ja)
Other versions
JP4635836B2 (ja
JP2007134618A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005328380A priority Critical patent/JP4635836B2/ja
Priority claimed from JP2005328380A external-priority patent/JP4635836B2/ja
Publication of JP2007134618A publication Critical patent/JP2007134618A/ja
Publication of JP2007134618A5 publication Critical patent/JP2007134618A5/ja
Application granted granted Critical
Publication of JP4635836B2 publication Critical patent/JP4635836B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005328380A 2005-11-14 2005-11-14 シート状電子回路モジュール Expired - Fee Related JP4635836B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005328380A JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Publications (3)

Publication Number Publication Date
JP2007134618A JP2007134618A (ja) 2007-05-31
JP2007134618A5 true JP2007134618A5 (enExample) 2008-09-25
JP4635836B2 JP4635836B2 (ja) 2011-02-23

Family

ID=38156003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005328380A Expired - Fee Related JP4635836B2 (ja) 2005-11-14 2005-11-14 シート状電子回路モジュール

Country Status (1)

Country Link
JP (1) JP4635836B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102034798B (zh) * 2009-09-28 2013-09-04 日月光半导体制造股份有限公司 封装结构以及封装制程
JP6864009B2 (ja) * 2016-05-06 2021-04-21 スモルテク アクティエボラーグ 組立プラットフォーム
CN106793707B (zh) * 2017-01-17 2023-03-14 扬州扬杰电子科技股份有限公司 一种二极管模块的框架及其加工方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3714286B2 (ja) * 2002-05-28 2005-11-09 松下電器産業株式会社 回路部品モジュールおよびその製造方法
JP2004363406A (ja) * 2003-06-06 2004-12-24 Honda Motor Co Ltd 樹脂封止電子部品ユニット及びその製造方法

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