JP2009158751A5 - - Google Patents

Download PDF

Info

Publication number
JP2009158751A5
JP2009158751A5 JP2007335819A JP2007335819A JP2009158751A5 JP 2009158751 A5 JP2009158751 A5 JP 2009158751A5 JP 2007335819 A JP2007335819 A JP 2007335819A JP 2007335819 A JP2007335819 A JP 2007335819A JP 2009158751 A5 JP2009158751 A5 JP 2009158751A5
Authority
JP
Japan
Prior art keywords
protruding
electrode
resin layer
insulating resin
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007335819A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009158751A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007335819A priority Critical patent/JP2009158751A/ja
Priority claimed from JP2007335819A external-priority patent/JP2009158751A/ja
Priority to CN200810191061.5A priority patent/CN101494213A/zh
Priority to US12/345,019 priority patent/US20090168391A1/en
Publication of JP2009158751A publication Critical patent/JP2009158751A/ja
Publication of JP2009158751A5 publication Critical patent/JP2009158751A5/ja
Priority to US12/900,175 priority patent/US8438724B2/en
Pending legal-status Critical Current

Links

JP2007335819A 2007-12-27 2007-12-27 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 Pending JP2009158751A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007335819A JP2009158751A (ja) 2007-12-27 2007-12-27 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器
CN200810191061.5A CN101494213A (zh) 2007-12-27 2008-12-26 元件安装用基板、半导体组件及其制造方法及便携式设备
US12/345,019 US20090168391A1 (en) 2007-12-27 2008-12-29 Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same
US12/900,175 US8438724B2 (en) 2007-12-27 2010-10-07 Method for producing substrate for mounting device and method for producing a semiconductor module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007335819A JP2009158751A (ja) 2007-12-27 2007-12-27 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器

Publications (2)

Publication Number Publication Date
JP2009158751A JP2009158751A (ja) 2009-07-16
JP2009158751A5 true JP2009158751A5 (enExample) 2010-05-13

Family

ID=40924721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007335819A Pending JP2009158751A (ja) 2007-12-27 2007-12-27 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器

Country Status (2)

Country Link
JP (1) JP2009158751A (enExample)
CN (1) CN101494213A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087229A (ja) * 2008-09-30 2010-04-15 Sanyo Electric Co Ltd 半導体モジュール、半導体モジュールの製造方法および携帯機器
CN102473690B (zh) * 2009-08-18 2014-10-08 日本电气株式会社 具有屏蔽层和电容耦合芯片侧电源端子的半导体器件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004247483A (ja) * 2003-02-13 2004-09-02 Fujitsu Ltd 回路基板の製造方法
JP2004349361A (ja) * 2003-05-21 2004-12-09 Casio Comput Co Ltd 半導体装置およびその製造方法
JP2005197532A (ja) * 2004-01-08 2005-07-21 Nippon Mektron Ltd 多層回路基板およびその製造方法ならびに回路基材
JP4772424B2 (ja) * 2005-08-23 2011-09-14 日本メクトロン株式会社 回路基板の製造方法
JP2007123798A (ja) * 2005-09-28 2007-05-17 Kyocera Corp 配線基板および電子装置
JP4568215B2 (ja) * 2005-11-30 2010-10-27 三洋電機株式会社 回路装置および回路装置の製造方法

Similar Documents

Publication Publication Date Title
JP2009130104A5 (enExample)
WO2009002381A3 (en) Mold compound circuit structure for enhanced electrical and thermal performance
JP2008021987A5 (enExample)
JP2008028361A5 (enExample)
WO2009057332A1 (ja) 回路接続方法
JP2007506273A5 (enExample)
JP2008193097A5 (enExample)
JP2008160160A5 (enExample)
JP2009194322A5 (enExample)
WO2009066504A1 (ja) 部品内蔵モジュール
JP2011009514A5 (enExample)
RU2009138474A (ru) Сенсорная панель и способ ее производства
JP2010073893A5 (enExample)
JP2009182272A5 (enExample)
JP2010087221A5 (enExample)
JP2009147165A5 (enExample)
JP2014127706A5 (ja) 半導体装置の製造方法
KR101434039B1 (ko) 전력 반도체 모듈 및 전력 반도체 제조 방법
US20140117525A1 (en) Power module package and method of manufacturing the same
WO2009072493A1 (ja) 感光性接着剤、半導体装置及び半導体装置の製造方法
JP2008078367A5 (enExample)
JP2009246174A5 (enExample)
JP2009158751A5 (enExample)
JP2010109180A5 (enExample)
JP2009231815A5 (enExample)