JP2009158751A5 - - Google Patents
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- Publication number
- JP2009158751A5 JP2009158751A5 JP2007335819A JP2007335819A JP2009158751A5 JP 2009158751 A5 JP2009158751 A5 JP 2009158751A5 JP 2007335819 A JP2007335819 A JP 2007335819A JP 2007335819 A JP2007335819 A JP 2007335819A JP 2009158751 A5 JP2009158751 A5 JP 2009158751A5
- Authority
- JP
- Japan
- Prior art keywords
- protruding
- electrode
- resin layer
- insulating resin
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims 13
- 229920005989 resin Polymers 0.000 claims 13
- 239000002184 metal Substances 0.000 claims 9
- 230000008878 coupling Effects 0.000 claims 7
- 238000010168 coupling process Methods 0.000 claims 7
- 238000005859 coupling reaction Methods 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 5
- 238000004904 shortening Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007335819A JP2009158751A (ja) | 2007-12-27 | 2007-12-27 | 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 |
| CN200810191061.5A CN101494213A (zh) | 2007-12-27 | 2008-12-26 | 元件安装用基板、半导体组件及其制造方法及便携式设备 |
| US12/345,019 US20090168391A1 (en) | 2007-12-27 | 2008-12-29 | Substrate for mounting device and method for producing the same, semiconductor module and method for producing the same, and portable apparatus provided with the same |
| US12/900,175 US8438724B2 (en) | 2007-12-27 | 2010-10-07 | Method for producing substrate for mounting device and method for producing a semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007335819A JP2009158751A (ja) | 2007-12-27 | 2007-12-27 | 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009158751A JP2009158751A (ja) | 2009-07-16 |
| JP2009158751A5 true JP2009158751A5 (enExample) | 2010-05-13 |
Family
ID=40924721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007335819A Pending JP2009158751A (ja) | 2007-12-27 | 2007-12-27 | 素子搭載用基板およびその製造方法、半導体モジュールおよびその製造方法、ならびに携帯機器 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2009158751A (enExample) |
| CN (1) | CN101494213A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087229A (ja) * | 2008-09-30 | 2010-04-15 | Sanyo Electric Co Ltd | 半導体モジュール、半導体モジュールの製造方法および携帯機器 |
| US8592957B2 (en) * | 2009-08-18 | 2013-11-26 | Nec Corporation | Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247483A (ja) * | 2003-02-13 | 2004-09-02 | Fujitsu Ltd | 回路基板の製造方法 |
| JP2004349361A (ja) * | 2003-05-21 | 2004-12-09 | Casio Comput Co Ltd | 半導体装置およびその製造方法 |
| JP2005197532A (ja) * | 2004-01-08 | 2005-07-21 | Nippon Mektron Ltd | 多層回路基板およびその製造方法ならびに回路基材 |
| JP4772424B2 (ja) * | 2005-08-23 | 2011-09-14 | 日本メクトロン株式会社 | 回路基板の製造方法 |
| JP2007123798A (ja) * | 2005-09-28 | 2007-05-17 | Kyocera Corp | 配線基板および電子装置 |
| JP4568215B2 (ja) * | 2005-11-30 | 2010-10-27 | 三洋電機株式会社 | 回路装置および回路装置の製造方法 |
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2007
- 2007-12-27 JP JP2007335819A patent/JP2009158751A/ja active Pending
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2008
- 2008-12-26 CN CN200810191061.5A patent/CN101494213A/zh active Pending