JP4247623B2 - 半導体装置及びその製造方法、回路基板並びに電子機器 - Google Patents

半導体装置及びその製造方法、回路基板並びに電子機器 Download PDF

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Publication number
JP4247623B2
JP4247623B2 JP2004356786A JP2004356786A JP4247623B2 JP 4247623 B2 JP4247623 B2 JP 4247623B2 JP 2004356786 A JP2004356786 A JP 2004356786A JP 2004356786 A JP2004356786 A JP 2004356786A JP 4247623 B2 JP4247623 B2 JP 4247623B2
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JP
Japan
Prior art keywords
substrate
semiconductor device
semiconductor
electrode
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004356786A
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English (en)
Japanese (ja)
Other versions
JP2005123643A5 (enExample
JP2005123643A (ja
Inventor
伸晃 橋元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2004356786A priority Critical patent/JP4247623B2/ja
Publication of JP2005123643A publication Critical patent/JP2005123643A/ja
Publication of JP2005123643A5 publication Critical patent/JP2005123643A5/ja
Application granted granted Critical
Publication of JP4247623B2 publication Critical patent/JP4247623B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Wire Bonding (AREA)
JP2004356786A 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器 Expired - Fee Related JP4247623B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP27261398 1998-09-09
JP2004356786A JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000-569448A Division JPWO2000014802A1 (ja) 1998-09-09 1999-09-03 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (3)

Publication Number Publication Date
JP2005123643A JP2005123643A (ja) 2005-05-12
JP2005123643A5 JP2005123643A5 (enExample) 2006-10-12
JP4247623B2 true JP4247623B2 (ja) 2009-04-02

Family

ID=34621720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004356786A Expired - Fee Related JP4247623B2 (ja) 1998-09-09 2004-12-09 半導体装置及びその製造方法、回路基板並びに電子機器

Country Status (1)

Country Link
JP (1) JP4247623B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295763A (ja) * 2008-06-05 2009-12-17 Fujitsu Ltd 半導体実装装置及び電子機器
EP3907769A1 (en) * 2020-05-08 2021-11-10 Koninklijke Philips N.V. Sensor comprising an interconnect and an interventional medical device using the same

Also Published As

Publication number Publication date
JP2005123643A (ja) 2005-05-12

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