JP2005117041A - 高出力発光ダイオードデバイス - Google Patents

高出力発光ダイオードデバイス Download PDF

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Publication number
JP2005117041A
JP2005117041A JP2004291171A JP2004291171A JP2005117041A JP 2005117041 A JP2005117041 A JP 2005117041A JP 2004291171 A JP2004291171 A JP 2004291171A JP 2004291171 A JP2004291171 A JP 2004291171A JP 2005117041 A JP2005117041 A JP 2005117041A
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JP
Japan
Prior art keywords
led
heat
trace
pcb
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004291171A
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English (en)
Japanese (ja)
Other versions
JP2005117041A5 (https=
Inventor
Kee Yean Ng
イーン ウン キー
Cheng Why Tan
ワイ タン チェン
Ji Kin Tham
キン タム ジ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JP2005117041A publication Critical patent/JP2005117041A/ja
Publication of JP2005117041A5 publication Critical patent/JP2005117041A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
JP2004291171A 2003-10-09 2004-10-04 高出力発光ダイオードデバイス Pending JP2005117041A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/683,489 US20050077616A1 (en) 2003-10-09 2003-10-09 High power light emitting diode device

Publications (2)

Publication Number Publication Date
JP2005117041A true JP2005117041A (ja) 2005-04-28
JP2005117041A5 JP2005117041A5 (https=) 2007-07-12

Family

ID=33160036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004291171A Pending JP2005117041A (ja) 2003-10-09 2004-10-04 高出力発光ダイオードデバイス

Country Status (4)

Country Link
US (2) US20050077616A1 (https=)
JP (1) JP2005117041A (https=)
DE (1) DE102004044149B4 (https=)
GB (1) GB2406969B (https=)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317950A (ja) * 2004-03-31 2005-11-10 C I Kasei Co Ltd 発光ダイオード組立体の組立方法および発光ダイオード組立体
JP2005317951A (ja) * 2004-03-31 2005-11-10 C I Kasei Co Ltd 発光ダイオード組立体の組立方法および発光ダイオード組立体
JP2007116128A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
JP2007116126A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
WO2007072919A1 (ja) * 2005-12-22 2007-06-28 Matsushita Electric Works, Ltd. Ｌｅｄを用いた照明器具
JP2007300106A (ja) * 2006-04-28 2007-11-15 Taida Electronic Ind Co Ltd 発光装置
JP2009130299A (ja) * 2007-11-27 2009-06-11 Panasonic Electric Works Co Ltd 発光装置
JP2009239036A (ja) * 2008-03-27 2009-10-15 Hitachi Aic Inc Ｌｅｄ基板
JP2010130001A (ja) * 2008-12-01 2010-06-10 Kuei-Fang Chen 放熱台
JP2011114280A (ja) * 2009-11-30 2011-06-09 Kyocera Corp 光電変換装置用部品および光電変換装置
JP2014502062A (ja) * 2011-01-09 2014-01-23 ブリッジラックス・インコーポレーテッド 上面接続部のみを有するフォトン構成デバイス
US9653437B2 (en) 2011-01-09 2017-05-16 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate

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TWM271255U (en) * 2004-10-08 2005-07-21 Bright Led Electronics Corp High-power surface-mounted light-emitting diode with high heat dissipation property
US7262438B2 (en) 2005-03-08 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED mounting having increased heat dissipation
KR100593937B1 (ko) * 2005-03-30 2006-06-30 삼성전기주식회사 Ｓｉ기판을 이용한 ＬＥＤ 패키지 및 그 제조방법
US7348604B2 (en) * 2005-05-20 2008-03-25 Tir Technology Lp Light-emitting module
EP1890343A4 (en) * 2005-06-07 2014-04-23 Fujikura Ltd SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
US20080099777A1 (en) * 2005-10-19 2008-05-01 Luminus Devices, Inc. Light-emitting devices and related systems
KR101210090B1 (ko) 2006-03-03 2012-12-07 엘지이노텍 주식회사 금속 코어 인쇄회로기판 및 이를 이용한 발광 다이오드패키징 방법
US20070247852A1 (en) * 2006-04-21 2007-10-25 Xiaoping Wang Multi chip LED lamp
WO2007141827A1 (ja) 2006-05-30 2007-12-13 Fujikura Ltd. 発光素子実装用基板、光源、照明装置、表示装置、交通信号機、及び発光素子実装用基板の製造方法
US20080068807A1 (en) * 2006-09-20 2008-03-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating device for back light source for flat panel display
US20090086491A1 (en) 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
JP4238907B2 (ja) * 2006-10-18 2009-03-18 セイコーエプソン株式会社 インクジェット記録装置
EP1914470B1 (en) * 2006-10-20 2016-05-18 OSRAM GmbH Semiconductor lamp
TW200904316A (en) * 2007-07-13 2009-01-16 Kai-Yu Lin Heat-dissipation structure of luminous device
CN101465395A (zh) * 2007-12-21 2009-06-24 富士迈半导体精密工业（上海）有限公司 发光二极管
JP5416975B2 (ja) 2008-03-11 2014-02-12 ローム株式会社 半導体発光装置
US7923746B2 (en) * 2008-03-12 2011-04-12 Industrial Technology Research Institute Light emitting diode package structure and method for fabricating the same
CN101539282B (zh) * 2008-03-19 2011-06-29 富准精密工业(深圳)有限公司 发光二极管模组
US20100037463A1 (en) * 2008-08-18 2010-02-18 Michael Maichel Combination Shaving and Trimming Device
DE102008039364A1 (de) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Halbleiter-Leuchtvorrichtung
US20100110684A1 (en) * 2008-10-28 2010-05-06 Abl Ip Holding Llc Light emitting diode luminaires and applications thereof
EP2413392A4 (en) * 2009-03-24 2013-12-18 Kang Kim LIGHT-EMITTING DIODE PACKAGE
US20100305448A1 (en) * 2009-05-26 2010-12-02 Anne Cecile Dagonneau Apparatus and method for indicating ultrasound probe orientation and activation status
CN201803156U (zh) * 2009-08-23 2011-04-20 彭云滔 一种组合式大功率led灯
US8602593B2 (en) * 2009-10-15 2013-12-10 Cree, Inc. Lamp assemblies and methods of making the same
US8089086B2 (en) * 2009-10-19 2012-01-03 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
US8399267B2 (en) * 2009-12-26 2013-03-19 Achrolux Inc Methods for packaging light emitting devices and related microelectronic devices
KR101677105B1 (ko) * 2010-08-30 2016-11-17 삼성디스플레이 주식회사 전자 부품 및 그 제조 방법
CN102683507A (zh) * 2011-03-09 2012-09-19 神基科技股份有限公司 光源模块构造及其制造方法
CN102691921A (zh) * 2011-03-22 2012-09-26 展晶科技(深圳)有限公司 发光二极管灯条及其制造方法
EP2810308B1 (en) * 2012-02-02 2021-06-23 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9538582B2 (en) * 2012-07-26 2017-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in the packaging of integrated circuits
TWI571598B (zh) * 2015-01-15 2017-02-21 旭德科技股份有限公司 照明裝置
US9865528B2 (en) * 2015-12-11 2018-01-09 Ubotic Company Limited High power and high frequency plastic pre-molded cavity package
US10794561B2 (en) * 2015-12-15 2020-10-06 Koito Manufacturing Co., Ltd. Vehicle lamp

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Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317951A (ja) * 2004-03-31 2005-11-10 C I Kasei Co Ltd 発光ダイオード組立体の組立方法および発光ダイオード組立体
JP2005317950A (ja) * 2004-03-31 2005-11-10 C I Kasei Co Ltd 発光ダイオード組立体の組立方法および発光ダイオード組立体
JP2007116128A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
JP2007116126A (ja) * 2005-09-20 2007-05-10 Matsushita Electric Works Ltd 発光装置
US8070316B2 (en) 2005-12-22 2011-12-06 Panasonic Electric Works Co., Ltd. Lighting apparatus with LEDs
WO2007072919A1 (ja) * 2005-12-22 2007-06-28 Matsushita Electric Works, Ltd. Ｌｅｄを用いた照明器具
JP2007300106A (ja) * 2006-04-28 2007-11-15 Taida Electronic Ind Co Ltd 発光装置
JP2009130299A (ja) * 2007-11-27 2009-06-11 Panasonic Electric Works Co Ltd 発光装置
JP2009239036A (ja) * 2008-03-27 2009-10-15 Hitachi Aic Inc Ｌｅｄ基板
JP2010130001A (ja) * 2008-12-01 2010-06-10 Kuei-Fang Chen 放熱台
JP2012089869A (ja) * 2008-12-01 2012-05-10 Kuei-Fang Chen 放熱台
JP2011114280A (ja) * 2009-11-30 2011-06-09 Kyocera Corp 光電変換装置用部品および光電変換装置
US9653437B2 (en) 2011-01-09 2017-05-16 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
JP2014502062A (ja) * 2011-01-09 2014-01-23 ブリッジラックス・インコーポレーテッド 上面接続部のみを有するフォトン構成デバイス
US9893039B2 (en) 2011-01-09 2018-02-13 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US9985004B2 (en) 2011-01-09 2018-05-29 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US10325890B2 (en) 2011-01-09 2019-06-18 Bridgelux, Inc. Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
US10347807B2 (en) 2011-01-09 2019-07-09 Bridgelux Inc. Packaging photon building blocks with top side connections and interconnect structure
US10840424B2 (en) 2011-01-09 2020-11-17 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure
US11411152B2 (en) 2011-01-09 2022-08-09 Bridgelux, Inc. Packaging photon building blocks with top side connections and interconnect structure

Also Published As

Publication number Publication date
GB0419641D0 (en) 2004-10-06
DE102004044149A1 (de) 2005-06-02
US20050077616A1 (en) 2005-04-14
US20060138645A1 (en) 2006-06-29
US7612386B2 (en) 2009-11-03
GB2406969B (en) 2008-04-23
DE102004044149B4 (de) 2011-02-17
GB2406969A (en) 2005-04-13

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