DE102004044149B4 - Hochleistungs-Leuchtdiodenvorrichtung - Google Patents

Hochleistungs-Leuchtdiodenvorrichtung Download PDF

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Publication number
DE102004044149B4
DE102004044149B4 DE102004044149A DE102004044149A DE102004044149B4 DE 102004044149 B4 DE102004044149 B4 DE 102004044149B4 DE 102004044149 A DE102004044149 A DE 102004044149A DE 102004044149 A DE102004044149 A DE 102004044149A DE 102004044149 B4 DE102004044149 B4 DE 102004044149B4
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DE
Germany
Prior art keywords
circuit element
heat
element according
chip
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102004044149A
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German (de)
English (en)
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DE102004044149A1 (de
Inventor
Kee Yean Ng
Cheng Why Tan
Ji Kin Tham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intellectual Discovery Co Ltd
Original Assignee
Avago Technologies ECBU IP Singapore Pte Ltd
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Publication of DE102004044149A1 publication Critical patent/DE102004044149A1/de
Application granted granted Critical
Publication of DE102004044149B4 publication Critical patent/DE102004044149B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
DE102004044149A 2003-10-09 2004-09-13 Hochleistungs-Leuchtdiodenvorrichtung Expired - Fee Related DE102004044149B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/683,489 US20050077616A1 (en) 2003-10-09 2003-10-09 High power light emitting diode device
US10/683,489 2003-10-09

Publications (2)

Publication Number Publication Date
DE102004044149A1 DE102004044149A1 (de) 2005-06-02
DE102004044149B4 true DE102004044149B4 (de) 2011-02-17

Family

ID=33160036

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004044149A Expired - Fee Related DE102004044149B4 (de) 2003-10-09 2004-09-13 Hochleistungs-Leuchtdiodenvorrichtung

Country Status (4)

Country Link
US (2) US20050077616A1 (https=)
JP (1) JP2005117041A (https=)
DE (1) DE102004044149B4 (https=)
GB (1) GB2406969B (https=)

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JP4632426B2 (ja) * 2004-03-31 2011-02-16 シーアイ化成株式会社 発光ダイオード組立体の組立方法および発光ダイオード組立体
TWM271255U (en) * 2004-10-08 2005-07-21 Bright Led Electronics Corp High-power surface-mounted light-emitting diode with high heat dissipation property
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US7348604B2 (en) * 2005-05-20 2008-03-25 Tir Technology Lp Light-emitting module
EP1890343A4 (en) * 2005-06-07 2014-04-23 Fujikura Ltd SUBSTRATE ON ILLUMINATING ELEMENT INSTALLATION, ILLUMINATING ELEMENT MODULE, ILLUMINATION DEVICE, DISPLAY AND TRAFFIC SIGNALING DEVICE
KR100592508B1 (ko) * 2005-07-15 2006-06-26 한국광기술원 비콘 모양의 기판을 구비한 고출력 발광 다이오드 패키지
JP5155539B2 (ja) * 2005-09-20 2013-03-06 パナソニック株式会社 発光装置
JP5155540B2 (ja) * 2005-09-20 2013-03-06 パナソニック株式会社 発光装置
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US20080068807A1 (en) * 2006-09-20 2008-03-20 Sunonwealth Electric Machine Industry Co., Ltd. Heat-dissipating device for back light source for flat panel display
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US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
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US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
JP4238907B2 (ja) * 2006-10-18 2009-03-18 セイコーエプソン株式会社 インクジェット記録装置
EP1914470B1 (en) * 2006-10-20 2016-05-18 OSRAM GmbH Semiconductor lamp
TW200904316A (en) * 2007-07-13 2009-01-16 Kai-Yu Lin Heat-dissipation structure of luminous device
JP5149601B2 (ja) * 2007-11-27 2013-02-20 パナソニック株式会社 発光装置
CN101465395A (zh) * 2007-12-21 2009-06-24 富士迈半导体精密工业（上海）有限公司 发光二极管
JP5416975B2 (ja) 2008-03-11 2014-02-12 ローム株式会社 半導体発光装置
US7923746B2 (en) * 2008-03-12 2011-04-12 Industrial Technology Research Institute Light emitting diode package structure and method for fabricating the same
CN101539282B (zh) * 2008-03-19 2011-06-29 富准精密工业(深圳)有限公司 发光二极管模组
JP2009239036A (ja) * 2008-03-27 2009-10-15 Hitachi Aic Inc Ｌｅｄ基板
US20100037463A1 (en) * 2008-08-18 2010-02-18 Michael Maichel Combination Shaving and Trimming Device
DE102008039364A1 (de) * 2008-08-22 2010-03-04 Osram Gesellschaft mit beschränkter Haftung Halbleiter-Leuchtvorrichtung
US20100110684A1 (en) * 2008-10-28 2010-05-06 Abl Ip Holding Llc Light emitting diode luminaires and applications thereof
JP2010130001A (ja) * 2008-12-01 2010-06-10 Kuei-Fang Chen 放熱台
EP2413392A4 (en) * 2009-03-24 2013-12-18 Kang Kim LIGHT-EMITTING DIODE PACKAGE
US20100305448A1 (en) * 2009-05-26 2010-12-02 Anne Cecile Dagonneau Apparatus and method for indicating ultrasound probe orientation and activation status
CN201803156U (zh) * 2009-08-23 2011-04-20 彭云滔 一种组合式大功率led灯
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JP5645392B2 (ja) * 2009-11-30 2014-12-24 京セラ株式会社 光電変換装置用部品および光電変換装置
US8399267B2 (en) * 2009-12-26 2013-03-19 Achrolux Inc Methods for packaging light emitting devices and related microelectronic devices
KR101677105B1 (ko) * 2010-08-30 2016-11-17 삼성디스플레이 주식회사 전자 부품 및 그 제조 방법
US8354684B2 (en) * 2011-01-09 2013-01-15 Bridgelux, Inc. Packaging photon building blocks having only top side connections in an interconnect structure
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CN102683507A (zh) * 2011-03-09 2012-09-19 神基科技股份有限公司 光源模块构造及其制造方法
CN102691921A (zh) * 2011-03-22 2012-09-26 展晶科技(深圳)有限公司 发光二极管灯条及其制造方法
EP2810308B1 (en) * 2012-02-02 2021-06-23 Bridgelux, Inc. Packaging photon building blocks having only top side connections in a molded interconnect structure
US9538582B2 (en) * 2012-07-26 2017-01-03 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in the packaging of integrated circuits
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DE20117987U1 (de) * 2001-10-23 2002-02-14 LITE-ON ELECTRONICS, INC., Chung Ho, Taipeh/T'ai-pei Licht-emittierende Dioden-Vorrichtung mit geringem Wärmewiderstand
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US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same

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JPH11298048A (ja) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Ｌｅｄ実装基板
US5910686A (en) * 1998-07-23 1999-06-08 Vlsi Technology, Inc. Cavity down HBGA package structure
US20030189830A1 (en) * 2001-04-12 2003-10-09 Masaru Sugimoto Light source device using led, and method of producing same
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Also Published As

Publication number Publication date
GB0419641D0 (en) 2004-10-06
DE102004044149A1 (de) 2005-06-02
US20050077616A1 (en) 2005-04-14
US20060138645A1 (en) 2006-06-29
US7612386B2 (en) 2009-11-03
GB2406969B (en) 2008-04-23
JP2005117041A (ja) 2005-04-28
GB2406969A (en) 2005-04-13

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