JP2005094009A5 - - Google Patents

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Publication number
JP2005094009A5
JP2005094009A5 JP2004268066A JP2004268066A JP2005094009A5 JP 2005094009 A5 JP2005094009 A5 JP 2005094009A5 JP 2004268066 A JP2004268066 A JP 2004268066A JP 2004268066 A JP2004268066 A JP 2004268066A JP 2005094009 A5 JP2005094009 A5 JP 2005094009A5
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JP
Japan
Prior art keywords
die
submount
wafer
lens
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004268066A
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English (en)
Japanese (ja)
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JP5086521B2 (ja
JP2005094009A (ja
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Publication date
Priority claimed from US10/665,660 external-priority patent/US6900509B2/en
Application filed filed Critical
Publication of JP2005094009A publication Critical patent/JP2005094009A/ja
Publication of JP2005094009A5 publication Critical patent/JP2005094009A5/ja
Application granted granted Critical
Publication of JP5086521B2 publication Critical patent/JP5086521B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004268066A 2003-09-19 2004-09-15 光受信機パッケージ Expired - Fee Related JP5086521B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/665660 2003-09-19
US10/665,660 US6900509B2 (en) 2003-09-19 2003-09-19 Optical receiver package

Publications (3)

Publication Number Publication Date
JP2005094009A JP2005094009A (ja) 2005-04-07
JP2005094009A5 true JP2005094009A5 (https=) 2007-07-12
JP5086521B2 JP5086521B2 (ja) 2012-11-28

Family

ID=34312918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004268066A Expired - Fee Related JP5086521B2 (ja) 2003-09-19 2004-09-15 光受信機パッケージ

Country Status (4)

Country Link
US (2) US6900509B2 (https=)
JP (1) JP5086521B2 (https=)
CN (1) CN100479197C (https=)
DE (2) DE102004025735B4 (https=)

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US8596886B2 (en) 2011-09-07 2013-12-03 The Boeing Company Hermetic small form factor optical device packaging for plastic optical fiber networks
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US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
US9285554B2 (en) 2012-02-10 2016-03-15 International Business Machines Corporation Through-substrate optical coupling to photonics chips
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US8934745B2 (en) * 2012-07-31 2015-01-13 Hewlett-Packard Development Company, L.P. Apparatus for use in optoelectronics having a sandwiched lens
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CN103852832A (zh) * 2012-11-30 2014-06-11 鸿富锦精密工业（深圳）有限公司 光通讯模组
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RU2698945C2 (ru) * 2014-05-23 2019-09-02 Нанопресижен Продактс, Инк. Основанная на визуальном наблюдении пассивная юстировка оптоволоконного узла относительно оптоэлектронного устройства
US10290993B2 (en) * 2016-06-03 2019-05-14 Princeton Optronics, Inc. VCSEL illuminator package
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