DE102004025735B4 - Optischer-Empfänger-Gehäuse und Verfahren zu dessen Herstellung - Google Patents

Optischer-Empfänger-Gehäuse und Verfahren zu dessen Herstellung Download PDF

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Publication number
DE102004025735B4
DE102004025735B4 DE102004025735A DE102004025735A DE102004025735B4 DE 102004025735 B4 DE102004025735 B4 DE 102004025735B4 DE 102004025735 A DE102004025735 A DE 102004025735A DE 102004025735 A DE102004025735 A DE 102004025735A DE 102004025735 B4 DE102004025735 B4 DE 102004025735B4
Authority
DE
Germany
Prior art keywords
mounting base
chip
wafer
sensor
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE102004025735A
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German (de)
English (en)
Other versions
DE102004025735A1 (de
Inventor
Kendra Marina Del Rey Gallup
Brenton A. Palo Alto Baugh
Robert E. Palo Alto Wilson
James A. Milpitas Matthews
James H. Walnut Creek Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Broadcom International Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Priority to DE102004064081A priority Critical patent/DE102004064081B9/de
Publication of DE102004025735A1 publication Critical patent/DE102004025735A1/de
Application granted granted Critical
Publication of DE102004025735B4 publication Critical patent/DE102004025735B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE102004025735A 2003-09-19 2004-05-26 Optischer-Empfänger-Gehäuse und Verfahren zu dessen Herstellung Expired - Fee Related DE102004025735B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004064081A DE102004064081B9 (de) 2003-09-19 2004-05-26 Gehäuse für einen optischen Empfänger

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/665,660 2003-09-19
US10/665,660 US6900509B2 (en) 2003-09-19 2003-09-19 Optical receiver package
DE102004064081A DE102004064081B9 (de) 2003-09-19 2004-05-26 Gehäuse für einen optischen Empfänger

Publications (2)

Publication Number Publication Date
DE102004025735A1 DE102004025735A1 (de) 2005-04-21
DE102004025735B4 true DE102004025735B4 (de) 2008-10-23

Family

ID=34312918

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102004025735A Expired - Fee Related DE102004025735B4 (de) 2003-09-19 2004-05-26 Optischer-Empfänger-Gehäuse und Verfahren zu dessen Herstellung
DE102004064081A Expired - Fee Related DE102004064081B9 (de) 2003-09-19 2004-05-26 Gehäuse für einen optischen Empfänger

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE102004064081A Expired - Fee Related DE102004064081B9 (de) 2003-09-19 2004-05-26 Gehäuse für einen optischen Empfänger

Country Status (4)

Country Link
US (2) US6900509B2 (https=)
JP (1) JP5086521B2 (https=)
CN (1) CN100479197C (https=)
DE (2) DE102004025735B4 (https=)

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US8154414B2 (en) * 2005-03-31 2012-04-10 Finisar Corporation Systems and methods for collecting data with sensors
US7482682B2 (en) * 2005-04-12 2009-01-27 Hewlett-Packard Development Company, L.P. Micro-device packaging
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US7667324B2 (en) * 2006-10-31 2010-02-23 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Systems, devices, components and methods for hermetically sealing electronic modules and packages
US20080181558A1 (en) * 2007-01-31 2008-07-31 Hartwell Peter G Electronic and optical circuit integration through wafer bonding
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US8579434B2 (en) 2007-11-07 2013-11-12 University Of Washington Through Its Center For Commercialization Free-standing two-sided device fabrication
US8394660B2 (en) 2007-11-07 2013-03-12 University of Washington its Center for Commercialization Free-standing two-sided device fabrication
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TWI402979B (zh) * 2007-12-13 2013-07-21 夏普股份有限公司 電子元件晶圓模組、電子元件模組、感測器晶圓模組、感測器模組、透鏡陣列盤、感測器模組之製造方法、及電子資訊裝置
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US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
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US8260097B2 (en) * 2010-06-16 2012-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Opto-electronic alignment system and method
US8596886B2 (en) 2011-09-07 2013-12-03 The Boeing Company Hermetic small form factor optical device packaging for plastic optical fiber networks
KR101690237B1 (ko) * 2011-12-14 2016-12-27 피니사 코포레이숀 플렉스 광학 서브어셈블리 상의 칩
US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
US9285554B2 (en) 2012-02-10 2016-03-15 International Business Machines Corporation Through-substrate optical coupling to photonics chips
US9971088B2 (en) * 2012-04-16 2018-05-15 Hewlett Packard Enterprise Development Lp Integrated optical sub-assembly
US9500808B2 (en) 2012-05-09 2016-11-22 The Boeing Company Ruggedized photonic crystal sensor packaging
US8934745B2 (en) * 2012-07-31 2015-01-13 Hewlett-Packard Development Company, L.P. Apparatus for use in optoelectronics having a sandwiched lens
US8938136B2 (en) * 2012-08-08 2015-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-electronic system having flip-chip substrate mounting
CN103852832A (zh) * 2012-11-30 2014-06-11 鸿富锦精密工业（深圳）有限公司 光通讯模组
TWI572922B (zh) * 2013-01-31 2017-03-01 鴻海精密工業股份有限公司 光纖連接器
TWI527166B (zh) * 2013-07-25 2016-03-21 菱生精密工業股份有限公司 The package structure of the optical module
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RU2698945C2 (ru) * 2014-05-23 2019-09-02 Нанопресижен Продактс, Инк. Основанная на визуальном наблюдении пассивная юстировка оптоволоконного узла относительно оптоэлектронного устройства
US10290993B2 (en) * 2016-06-03 2019-05-14 Princeton Optronics, Inc. VCSEL illuminator package
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US5981945A (en) * 1995-03-08 1999-11-09 Siemens Aktiengesellschaft Optoelectronic transducer formed of a semiconductor component and a lens system
US6234687B1 (en) * 1999-08-27 2001-05-22 International Business Machines Corporation Self-aligning method and interlocking assembly for attaching an optoelectronic device to a coupler
US6243508B1 (en) * 1999-06-01 2001-06-05 Picolight Incorporated Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide

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Also Published As

Publication number Publication date
DE102004064081B4 (de) 2008-12-18
US6900509B2 (en) 2005-05-31
CN1599059A (zh) 2005-03-23
DE102004025735A1 (de) 2005-04-21
US20050062117A1 (en) 2005-03-24
JP5086521B2 (ja) 2012-11-28
JP2005094009A (ja) 2005-04-07
CN100479197C (zh) 2009-04-15
US6955934B2 (en) 2005-10-18
US20050062119A1 (en) 2005-03-24
DE102004064081B9 (de) 2009-06-04

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