JP5086521B2 - 光受信機パッケージ - Google Patents

光受信機パッケージ Download PDF

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Publication number
JP5086521B2
JP5086521B2 JP2004268066A JP2004268066A JP5086521B2 JP 5086521 B2 JP5086521 B2 JP 5086521B2 JP 2004268066 A JP2004268066 A JP 2004268066A JP 2004268066 A JP2004268066 A JP 2004268066A JP 5086521 B2 JP5086521 B2 JP 5086521B2
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JP
Japan
Prior art keywords
cap
die
wafer
submount
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004268066A
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English (en)
Japanese (ja)
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JP2005094009A5 (https=
JP2005094009A (ja
Inventor
ギャラップ ケンドゥラ
エイ． ボー ブレントン
イー． ウィルソン ロバート
エイ． マシューズ ジェイムズ
エイチ． ウィリアムズ ジェイムズ
Original Assignee
アバゴ・テクノロジーズ・ファイバー・アイピー（シンガポール）プライベート・リミテッド
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Application filed by アバゴ・テクノロジーズ・ファイバー・アイピー（シンガポール）プライベート・リミテッド filed Critical アバゴ・テクノロジーズ・ファイバー・アイピー（シンガポール）プライベート・リミテッド
Publication of JP2005094009A publication Critical patent/JP2005094009A/ja
Publication of JP2005094009A5 publication Critical patent/JP2005094009A5/ja
Application granted granted Critical
Publication of JP5086521B2 publication Critical patent/JP5086521B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)
JP2004268066A 2003-09-19 2004-09-15 光受信機パッケージ Expired - Fee Related JP5086521B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/665660 2003-09-19
US10/665,660 US6900509B2 (en) 2003-09-19 2003-09-19 Optical receiver package

Publications (3)

Publication Number Publication Date
JP2005094009A JP2005094009A (ja) 2005-04-07
JP2005094009A5 JP2005094009A5 (https=) 2007-07-12
JP5086521B2 true JP5086521B2 (ja) 2012-11-28

Family

ID=34312918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004268066A Expired - Fee Related JP5086521B2 (ja) 2003-09-19 2004-09-15 光受信機パッケージ

Country Status (4)

Country Link
US (2) US6900509B2 (https=)
JP (1) JP5086521B2 (https=)
CN (1) CN100479197C (https=)
DE (2) DE102004025735B4 (https=)

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US8579434B2 (en) 2007-11-07 2013-11-12 University Of Washington Through Its Center For Commercialization Free-standing two-sided device fabrication
US8394660B2 (en) 2007-11-07 2013-03-12 University of Washington its Center for Commercialization Free-standing two-sided device fabrication
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US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
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US8260097B2 (en) * 2010-06-16 2012-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Opto-electronic alignment system and method
US8596886B2 (en) 2011-09-07 2013-12-03 The Boeing Company Hermetic small form factor optical device packaging for plastic optical fiber networks
KR101690237B1 (ko) * 2011-12-14 2016-12-27 피니사 코포레이숀 플렉스 광학 서브어셈블리 상의 칩
US8901576B2 (en) 2012-01-18 2014-12-02 International Business Machines Corporation Silicon photonics wafer using standard silicon-on-insulator processes through substrate removal or transfer
US9285554B2 (en) 2012-02-10 2016-03-15 International Business Machines Corporation Through-substrate optical coupling to photonics chips
US9971088B2 (en) * 2012-04-16 2018-05-15 Hewlett Packard Enterprise Development Lp Integrated optical sub-assembly
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US8934745B2 (en) * 2012-07-31 2015-01-13 Hewlett-Packard Development Company, L.P. Apparatus for use in optoelectronics having a sandwiched lens
US8938136B2 (en) * 2012-08-08 2015-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Opto-electronic system having flip-chip substrate mounting
CN103852832A (zh) * 2012-11-30 2014-06-11 鸿富锦精密工业（深圳）有限公司 光通讯模组
TWI572922B (zh) * 2013-01-31 2017-03-01 鴻海精密工業股份有限公司 光纖連接器
TWI527166B (zh) * 2013-07-25 2016-03-21 菱生精密工業股份有限公司 The package structure of the optical module
GB2523841A (en) * 2014-03-07 2015-09-09 Melexis Technologies Nv Infrared sensor module
JP6294113B2 (ja) * 2014-03-17 2018-03-14 新光電気工業株式会社 キャップ及びその製造方法、半導体装置及びその製造方法
RU2698945C2 (ru) * 2014-05-23 2019-09-02 Нанопресижен Продактс, Инк. Основанная на визуальном наблюдении пассивная юстировка оптоволоконного узла относительно оптоэлектронного устройства
US10290993B2 (en) * 2016-06-03 2019-05-14 Princeton Optronics, Inc. VCSEL illuminator package
KR101968292B1 (ko) * 2016-10-19 2019-04-11 아이오솔루션(주) 적층구조를 적용한 파장 다중화 어레이 광수신 모듈의 패키지 구조
US10123597B1 (en) * 2018-01-11 2018-11-13 Joy Tong Vertical luggage
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CN112513691A (zh) * 2018-07-30 2021-03-16 ams传感器新加坡私人有限公司 低高度光电模块和封装
US11251228B2 (en) * 2018-12-19 2022-02-15 Intel Corporation Optical receiver package with backside lens-integrated photodetector die
GB2575204B (en) * 2019-10-08 2020-08-19 Hilight Semiconductor Ltd Opto-electronic assembly
GB2575205B (en) * 2019-10-08 2020-09-09 Hilight Semiconductor Ltd Opto-electronic assembly
CN118015744A (zh) * 2024-03-05 2024-05-10 杭州海康威视数字技术股份有限公司 门禁设备

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Also Published As

Publication number Publication date
DE102004064081B4 (de) 2008-12-18
DE102004025735B4 (de) 2008-10-23
US6900509B2 (en) 2005-05-31
CN1599059A (zh) 2005-03-23
DE102004025735A1 (de) 2005-04-21
US20050062117A1 (en) 2005-03-24
JP2005094009A (ja) 2005-04-07
CN100479197C (zh) 2009-04-15
US6955934B2 (en) 2005-10-18
US20050062119A1 (en) 2005-03-24
DE102004064081B9 (de) 2009-06-04

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