JP2005044773A5 - - Google Patents

Download PDF

Info

Publication number
JP2005044773A5
JP2005044773A5 JP2003413653A JP2003413653A JP2005044773A5 JP 2005044773 A5 JP2005044773 A5 JP 2005044773A5 JP 2003413653 A JP2003413653 A JP 2003413653A JP 2003413653 A JP2003413653 A JP 2003413653A JP 2005044773 A5 JP2005044773 A5 JP 2005044773A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003413653A
Other languages
Japanese (ja)
Other versions
JP2005044773A (en
JP4387175B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2003413653A priority Critical patent/JP4387175B2/en
Priority claimed from JP2003413653A external-priority patent/JP4387175B2/en
Priority to PCT/JP2004/008969 priority patent/WO2005004172A1/en
Priority to KR1020067000325A priority patent/KR100766205B1/en
Priority to TW093120189A priority patent/TWI293764B/en
Publication of JP2005044773A publication Critical patent/JP2005044773A/en
Publication of JP2005044773A5 publication Critical patent/JP2005044773A5/ja
Application granted granted Critical
Publication of JP4387175B2 publication Critical patent/JP4387175B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2003413653A 2003-07-07 2003-12-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure Expired - Lifetime JP4387175B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003413653A JP4387175B2 (en) 2003-07-07 2003-12-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure
PCT/JP2004/008969 WO2005004172A1 (en) 2003-07-07 2004-06-25 Coated conductive particle, anisotropic conductive material, and conductive connection structure
KR1020067000325A KR100766205B1 (en) 2003-07-07 2004-06-25 Coated conductive particle, anisotropic conductive material, and conductive connection structure
TW093120189A TWI293764B (en) 2003-07-07 2004-07-06 Coated conductive particles, anisotropic conductive material and conductive connection structure

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003271540 2003-07-07
JP2003413653A JP4387175B2 (en) 2003-07-07 2003-12-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

Publications (3)

Publication Number Publication Date
JP2005044773A JP2005044773A (en) 2005-02-17
JP2005044773A5 true JP2005044773A5 (en) 2006-07-20
JP4387175B2 JP4387175B2 (en) 2009-12-16

Family

ID=33566812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003413653A Expired - Lifetime JP4387175B2 (en) 2003-07-07 2003-12-11 Coated conductive particles, anisotropic conductive material, and conductive connection structure

Country Status (4)

Country Link
JP (1) JP4387175B2 (en)
KR (1) KR100766205B1 (en)
TW (1) TWI293764B (en)
WO (1) WO2005004172A1 (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4563110B2 (en) 2004-08-20 2010-10-13 積水化学工業株式会社 Method for producing conductive fine particles
JP2006269296A (en) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd Manufacturing method of particle with protrusions, particle with protrusions, conductive particle with protrusions, and anisotropic conductive material
JP4532321B2 (en) * 2005-03-30 2010-08-25 株式会社日立製作所 Conductive pattern forming device
JP4936678B2 (en) * 2005-04-21 2012-05-23 積水化学工業株式会社 Conductive particles and anisotropic conductive materials
JP2006331714A (en) * 2005-05-24 2006-12-07 Sekisui Chem Co Ltd Conductive fine particle and anisotropic conductive material
JP4589810B2 (en) * 2005-06-07 2010-12-01 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP2006351464A (en) * 2005-06-20 2006-12-28 Sekisui Chem Co Ltd Conductive particle, its manufacturing method, and anisotropic conductive material
JP4950451B2 (en) * 2005-07-29 2012-06-13 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and connection structure
JP2007035574A (en) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd Conductive particulates, anisotropic conductive material, and connection structural body
KR100719807B1 (en) 2005-12-30 2007-05-18 제일모직주식회사 Insulated conductive particle composition with anisotropic conduction and anisotropic conductive film using the same
JP2007207665A (en) * 2006-02-03 2007-08-16 Sekisui Chem Co Ltd Manufacturing method of conductive particle, conductive particle and anisotropic conductive material
TW200739612A (en) * 2006-02-27 2007-10-16 Hitachi Chemical Co Ltd Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure
KR100879450B1 (en) * 2006-10-30 2009-01-20 이계영 Electricity Connection Device
JP4897344B2 (en) * 2006-04-28 2012-03-14 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
CN101523513B (en) * 2006-10-17 2012-01-11 日立化成工业株式会社 Coated particle and method for producing the same, composition and adhesive film formed therefor
JP5074082B2 (en) * 2007-04-16 2012-11-14 ソニーケミカル＆インフォメーションデバイス株式会社 Conductive particle body, anisotropic conductive connecting material using the same, and method for producing conductive particle body
KR20100119830A (en) * 2007-05-15 2010-11-10 히다치 가세고교 가부시끼가이샤 Circuit-connecting material, and connection structure for circuit member
CN101836265B (en) * 2007-10-22 2012-07-25 日本化学工业株式会社 Coated conductive powder and conductive adhesive using the same
WO2009078469A1 (en) * 2007-12-18 2009-06-25 Hitachi Chemical Company, Ltd. Insulator-covered conductive particle, anisotropic conductive adhesive film, and methods for producing those
JP5626288B2 (en) * 2008-02-05 2014-11-19 日立化成株式会社 Conductive particle, anisotropic conductive adhesive, connection structure, and manufacturing method of connection structure
JP5151920B2 (en) * 2008-02-05 2013-02-27 日立化成工業株式会社 Conductive particles and method for producing conductive particles
JP5395482B2 (en) * 2008-03-25 2014-01-22 積水化学工業株式会社 Coated conductive fine particles, anisotropic conductive material, and conductive connection structure
WO2010001900A1 (en) * 2008-07-01 2010-01-07 日立化成工業株式会社 Circuit connection material and circuit connection structure
JP5368760B2 (en) * 2008-09-29 2013-12-18 積水化学工業株式会社 Insulating coating conductive particles, anisotropic conductive material, and connection structure
JP4758470B2 (en) * 2008-12-18 2011-08-31 シャープ株式会社 Method for forming protruding electrode and displacement gold plating solution
KR101261184B1 (en) * 2009-07-01 2013-05-09 히타치가세이가부시끼가이샤 Coated conductive particles and method for producing same
JP5554077B2 (en) * 2009-09-15 2014-07-23 株式会社日本触媒 Insulating fine particle-coated conductive fine particle, anisotropic conductive adhesive composition, and anisotropic conductive molded body
JP5534891B2 (en) * 2010-03-26 2014-07-02 積水化学工業株式会社 Conductive particle, method for producing conductive particle, anisotropic conductive material, and connection structure
JP5051553B2 (en) * 2010-04-19 2012-10-17 住友金属鉱山株式会社 Method for producing conductive paste
JP2012003917A (en) * 2010-06-16 2012-01-05 Sekisui Chem Co Ltd Conductive particle, anisotropic conductive material and connection structure
WO2012115076A1 (en) * 2011-02-23 2012-08-30 積水化学工業株式会社 Conductive particle, conductive particle manufacturing method, anisotropic conductive material, and connective structure
JP5703149B2 (en) * 2011-07-06 2015-04-15 積水化学工業株式会社 Conductive particles with insulating particles, anisotropic conductive material, and connection structure
JP5803393B2 (en) * 2011-08-02 2015-11-04 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive film
JP5421982B2 (en) * 2011-12-22 2014-02-19 積水化学工業株式会社 Conductive fine particles, anisotropic conductive material, and connection structure
CN104380392B (en) * 2012-07-03 2016-11-23 积水化学工业株式会社 The electroconductive particle of tape insulation particle, conductive material and connection structural bodies
JP5973257B2 (en) * 2012-07-03 2016-08-23 日本化学工業株式会社 Conductive particles and conductive material containing the same
JP5939063B2 (en) * 2012-07-11 2016-06-22 日立化成株式会社 Insulating coated conductive particles and anisotropic conductive adhesive using the same
KR101534841B1 (en) * 2012-11-07 2015-07-07 제일모직주식회사 Bump-type conductive microspheres and an anisotropic conductive film comprising the same
JP6302336B2 (en) * 2013-04-16 2018-03-28 積水化学工業株式会社 Conductive particles for photocurable conductive material, photocurable conductive material, method for producing connection structure, and connection structure
JP2015110743A (en) * 2013-10-28 2015-06-18 積水化学工業株式会社 Method of producing organic inorganic hybrid particle, conductive particle, conductive material and connection structure
JP6450154B2 (en) * 2013-11-12 2019-01-09 積水化学工業株式会社 Conductive particles, conductive materials, and connection structures
JP6577723B2 (en) * 2014-03-10 2019-09-18 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6431411B2 (en) * 2014-03-10 2018-11-28 積水化学工業株式会社 Conductive particles with insulating particles, conductive material, and connection structure
JP6592235B2 (en) * 2014-10-02 2019-10-16 積水化学工業株式会社 Conductive particles with insulating particles, method for producing conductive particles with insulating particles, conductive material, and connection structure
JP2017111883A (en) * 2015-12-14 2017-06-22 日立金属株式会社 Crimp terminal and wire with terminal
JP7028641B2 (en) * 2016-05-19 2022-03-02 積水化学工業株式会社 Conductive materials and connection structures
WO2017222010A1 (en) * 2016-06-22 2017-12-28 積水化学工業株式会社 Connection structure, metal atom-containing particles and bonding composition
JP2020514964A (en) * 2016-12-21 2020-05-21 スリーエム イノベイティブ プロパティズ カンパニー Conductive particles, articles, and methods
JP7328856B2 (en) * 2019-09-26 2023-08-17 積水化学工業株式会社 Conductive particles, conductive materials and connecting structures

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2546262B2 (en) * 1987-03-25 1996-10-23 日立化成工業株式会社 Circuit connecting member and method of manufacturing the same
JPH0371570A (en) * 1989-08-10 1991-03-27 Casio Comput Co Ltd Binder for conduction and conductive connection structure
JP3083535B2 (en) * 1990-06-01 2000-09-04 積水化学工業株式会社 Conductive fine particles and conductive adhesive
JP2970720B2 (en) * 1992-10-23 1999-11-02 富士通株式会社 Microcapsule type conductive adhesive and method for producing the same
JP3608214B2 (en) * 1994-01-27 2005-01-05 日立化成工業株式会社 Method for producing anisotropic conductive sheet
JP5060692B2 (en) * 2001-07-13 2012-10-31 株式会社日本触媒 Anisotropic conductive material
JP3898510B2 (en) * 2002-01-11 2007-03-28 積水化学工業株式会社 Conductive fine particles and anisotropic conductive materials
JP3902963B2 (en) * 2002-02-28 2007-04-11 積水化学工業株式会社 Metal-containing resin particles
JP4050086B2 (en) * 2002-04-24 2008-02-20 ナトコ株式会社 Conductive particles, conductive materials, and anisotropic conductive films

Similar Documents

Publication Publication Date Title
BE2015C007I2 (en)
BE2014C055I2 (en)
BE2014C027I2 (en)
BE2014C003I2 (en)
BE2013C075I2 (en)
BE2013C069I2 (en)
IN2005KO02345A (en)
JP2004127242A5 (en)
IN2008CH00387A (en)
BE2015C005I2 (en)
JP2004222006A5 (en)
JP2004223241A5 (en)
BE2015C024I2 (en)
AU2001282632A1 (en)
AU2002253451A1 (en)
AU2002324323A1 (en)
AU2002327042A1 (en)
AU2002327736A1 (en)
AU2002329412A1 (en)
AU2002331433A1 (en)
AU2001256599A1 (en)
AU2002332887A1 (en)
AU2003210772A1 (en)
AU2002239060A1 (en)
AU2002333044A1 (en)