JP2005039067A - 不揮発性半導体記憶装置 - Google Patents

不揮発性半導体記憶装置 Download PDF

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Publication number
JP2005039067A
JP2005039067A JP2003274728A JP2003274728A JP2005039067A JP 2005039067 A JP2005039067 A JP 2005039067A JP 2003274728 A JP2003274728 A JP 2003274728A JP 2003274728 A JP2003274728 A JP 2003274728A JP 2005039067 A JP2005039067 A JP 2005039067A
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JP
Japan
Prior art keywords
impurity diffusion
floating gate
region
semiconductor substrate
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003274728A
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English (en)
Japanese (ja)
Other versions
JP2005039067A5 (enExample
Inventor
Seiichi Endo
誠一 遠藤
Motoharu Ishii
元治 石井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003274728A priority Critical patent/JP2005039067A/ja
Priority to TW092136678A priority patent/TWI239640B/zh
Priority to US10/757,438 priority patent/US20050012138A1/en
Priority to DE102004003597A priority patent/DE102004003597A1/de
Priority to KR1020040016375A priority patent/KR20050008459A/ko
Priority to CNA2004100304643A priority patent/CN1577868A/zh
Publication of JP2005039067A publication Critical patent/JP2005039067A/ja
Publication of JP2005039067A5 publication Critical patent/JP2005039067A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/14—Bracing or strutting arrangements for formwalls; Devices for aligning forms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/60—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the control gate being a doped region, e.g. single-poly memory cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H10D30/681—Floating-gate IGFETs having only two programming levels
    • H10D30/683—Floating-gate IGFETs having only two programming levels programmed by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
JP2003274728A 2003-07-15 2003-07-15 不揮発性半導体記憶装置 Withdrawn JP2005039067A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2003274728A JP2005039067A (ja) 2003-07-15 2003-07-15 不揮発性半導体記憶装置
TW092136678A TWI239640B (en) 2003-07-15 2003-12-24 Nonvolatile semiconductor memory device
US10/757,438 US20050012138A1 (en) 2003-07-15 2004-01-15 Nonvolatile semiconductor memory device
DE102004003597A DE102004003597A1 (de) 2003-07-15 2004-01-23 Nichtflüchtige Halbleiterspeichervorrichtung
KR1020040016375A KR20050008459A (ko) 2003-07-15 2004-03-11 불휘발성 반도체 기억장치
CNA2004100304643A CN1577868A (zh) 2003-07-15 2004-03-15 非易失性半导体存储器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003274728A JP2005039067A (ja) 2003-07-15 2003-07-15 不揮発性半導体記憶装置

Publications (2)

Publication Number Publication Date
JP2005039067A true JP2005039067A (ja) 2005-02-10
JP2005039067A5 JP2005039067A5 (enExample) 2006-08-17

Family

ID=34056086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003274728A Withdrawn JP2005039067A (ja) 2003-07-15 2003-07-15 不揮発性半導体記憶装置

Country Status (6)

Country Link
US (1) US20050012138A1 (enExample)
JP (1) JP2005039067A (enExample)
KR (1) KR20050008459A (enExample)
CN (1) CN1577868A (enExample)
DE (1) DE102004003597A1 (enExample)
TW (1) TWI239640B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252267A (ja) * 2004-03-05 2005-09-15 Programmable Microelectron Corp シングルポリ・ｐフラッシュ技術を使用した不揮発性メモリソリューション
JP2006344735A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 半導体装置
JP2006344736A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 半導体装置
JP2006344668A (ja) * 2005-06-07 2006-12-21 Seiko Epson Corp 半導体装置
JP2007149943A (ja) * 2005-11-28 2007-06-14 Nec Electronics Corp 不揮発性メモリセル及びｅｅｐｒｏｍ
JP2007250948A (ja) * 2006-03-17 2007-09-27 Seiko Epson Corp 半導体装置
JP2008085230A (ja) * 2006-09-28 2008-04-10 Toshiba Corp エージングデバイス及びその製造方法
JP2013191826A (ja) * 2012-03-12 2013-09-26 Ememory Technology Inc 消去可能なプログラマブル単一ポリ不揮発性メモリの製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7709307B2 (en) 2006-08-24 2010-05-04 Kovio, Inc. Printed non-volatile memory
CN108257963A (zh) * 2016-12-29 2018-07-06 北京同方微电子有限公司 一种闪存存储单元

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3919711A (en) * 1973-02-26 1975-11-11 Intel Corp Erasable floating gate device
NL7500550A (nl) * 1975-01-17 1976-07-20 Philips Nv Halfgeleider-geheugeninrichting.
US4035820A (en) * 1975-12-29 1977-07-12 Texas Instruments Incorporated Adjustment of avalanche voltage in DIFMOS memory devices by control of impurity doping
WO1994000881A1 (en) * 1992-06-19 1994-01-06 Lattice Semiconductor Corporation Single polysilicon layer flash e2prom cell
US5761121A (en) * 1996-10-31 1998-06-02 Programmable Microelectronics Corporation PMOS single-poly non-volatile memory structure
US5841165A (en) * 1995-11-21 1998-11-24 Programmable Microelectronics Corporation PMOS flash EEPROM cell with single poly
US6628544B2 (en) * 1999-09-30 2003-09-30 Infineon Technologies Ag Flash memory cell and method to achieve multiple bits per cell
EP1091408A1 (en) * 1999-10-07 2001-04-11 STMicroelectronics S.r.l. Non-volatile memory cell with a single level of polysilicon
US6329240B1 (en) * 1999-10-07 2001-12-11 Monolithic System Technology, Inc. Non-volatile memory cell and methods of fabricating and operating same
US6617637B1 (en) * 2002-11-13 2003-09-09 Ememory Technology Inc. Electrically erasable programmable logic device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005252267A (ja) * 2004-03-05 2005-09-15 Programmable Microelectron Corp シングルポリ・ｐフラッシュ技術を使用した不揮発性メモリソリューション
JP2006344668A (ja) * 2005-06-07 2006-12-21 Seiko Epson Corp 半導体装置
US7626225B2 (en) 2005-06-07 2009-12-01 Seiko Epson Corporation Semiconductor device including nonvolatile memory having a floating gate electrode
JP2006344735A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 半導体装置
JP2006344736A (ja) * 2005-06-08 2006-12-21 Seiko Epson Corp 半導体装置
JP2007149943A (ja) * 2005-11-28 2007-06-14 Nec Electronics Corp 不揮発性メモリセル及びｅｅｐｒｏｍ
JP2007250948A (ja) * 2006-03-17 2007-09-27 Seiko Epson Corp 半導体装置
JP2008085230A (ja) * 2006-09-28 2008-04-10 Toshiba Corp エージングデバイス及びその製造方法
JP2013191826A (ja) * 2012-03-12 2013-09-26 Ememory Technology Inc 消去可能なプログラマブル単一ポリ不揮発性メモリの製造方法

Also Published As

Publication number Publication date
KR20050008459A (ko) 2005-01-21
TWI239640B (en) 2005-09-11
DE102004003597A1 (de) 2005-02-17
US20050012138A1 (en) 2005-01-20
TW200503251A (en) 2005-01-16
CN1577868A (zh) 2005-02-09

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