JP2004535306A5 - - Google Patents

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Publication number
JP2004535306A5
JP2004535306A5 JP2003513743A JP2003513743A JP2004535306A5 JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5 JP 2003513743 A JP2003513743 A JP 2003513743A JP 2003513743 A JP2003513743 A JP 2003513743A JP 2004535306 A5 JP2004535306 A5 JP 2004535306A5
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JP
Japan
Prior art keywords
abrasive article
wear indicator
abrasive
fixed abrasive
composite element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003513743A
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English (en)
Japanese (ja)
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JP2004535306A (ja
Filing date
Publication date
Priority claimed from US09/910,425 external-priority patent/US20020077037A1/en
Application filed filed Critical
Publication of JP2004535306A publication Critical patent/JP2004535306A/ja
Publication of JP2004535306A5 publication Critical patent/JP2004535306A5/ja
Withdrawn legal-status Critical Current

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JP2003513743A 2001-07-20 2002-07-12 摩耗インジケータを有する固定研磨物品 Withdrawn JP2004535306A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/910,425 US20020077037A1 (en) 1999-05-03 2001-07-20 Fixed abrasive articles
PCT/US2002/021940 WO2003008151A1 (en) 2001-07-20 2002-07-12 Fixed abrasive articles with wear indicators

Publications (2)

Publication Number Publication Date
JP2004535306A JP2004535306A (ja) 2004-11-25
JP2004535306A5 true JP2004535306A5 (enExample) 2006-01-05

Family

ID=25428766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003513743A Withdrawn JP2004535306A (ja) 2001-07-20 2002-07-12 摩耗インジケータを有する固定研磨物品

Country Status (7)

Country Link
US (1) US20020077037A1 (enExample)
EP (1) EP1409201A1 (enExample)
JP (1) JP2004535306A (enExample)
KR (1) KR20040017328A (enExample)
CN (1) CN1535197A (enExample)
TW (1) TW565488B (enExample)
WO (1) WO2003008151A1 (enExample)

Families Citing this family (96)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US20030213703A1 (en) * 2002-05-16 2003-11-20 Applied Materials, Inc. Method and apparatus for substrate polishing
US7059948B2 (en) 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US20040182721A1 (en) * 2003-03-18 2004-09-23 Applied Materials, Inc. Process control in electro-chemical mechanical polishing
US7066800B2 (en) 2000-02-17 2006-06-27 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US6991526B2 (en) 2002-09-16 2006-01-31 Applied Materials, Inc. Control of removal profile in electrochemically assisted CMP
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US6896776B2 (en) 2000-12-18 2005-05-24 Applied Materials Inc. Method and apparatus for electro-chemical processing
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20030072639A1 (en) * 2001-10-17 2003-04-17 Applied Materials, Inc. Substrate support
US6837983B2 (en) * 2002-01-22 2005-01-04 Applied Materials, Inc. Endpoint detection for electro chemical mechanical polishing and electropolishing processes
US20040072445A1 (en) * 2002-07-11 2004-04-15 Applied Materials, Inc. Effective method to improve surface finish in electrochemically assisted CMP
US7112270B2 (en) * 2002-09-16 2006-09-26 Applied Materials, Inc. Algorithm for real-time process control of electro-polishing
US20050061674A1 (en) * 2002-09-16 2005-03-24 Yan Wang Endpoint compensation in electroprocessing
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
KR100590202B1 (ko) * 2003-08-29 2006-06-15 삼성전자주식회사 연마 패드 및 그 형성방법
US20050121141A1 (en) * 2003-11-13 2005-06-09 Manens Antoine P. Real time process control for a polishing process
US7186164B2 (en) 2003-12-03 2007-03-06 Applied Materials, Inc. Processing pad assembly with zone control
US7390744B2 (en) 2004-01-29 2008-06-24 Applied Materials, Inc. Method and composition for polishing a substrate
US20050176251A1 (en) * 2004-02-05 2005-08-11 Duong Chau H. Polishing pad with releasable slick particles
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7084064B2 (en) 2004-09-14 2006-08-01 Applied Materials, Inc. Full sequence metal and barrier layer electrochemical mechanical processing
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
KR101165114B1 (ko) * 2004-10-06 2012-07-12 라지브 바자즈 향상된 화학 기계적 평탄화 작업용 장치 및 방법
CN105904335B (zh) * 2004-11-01 2019-04-30 株式会社荏原制作所 抛光设备
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
US7524345B2 (en) * 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
US20140120807A1 (en) * 2005-05-16 2014-05-01 Chien-Min Sung Cmp pad conditioners with mosaic abrasive segments and associated methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
MY142245A (en) * 2005-06-29 2010-11-15 Saint Gobain Abrasives Inc High-performance resin for abrasive products
US7494519B2 (en) 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US7169031B1 (en) * 2005-07-28 2007-01-30 3M Innovative Properties Company Self-contained conditioning abrasive article
JP4756583B2 (ja) * 2005-08-30 2011-08-24 株式会社東京精密 研磨パッド、パッドドレッシング評価方法、及び研磨装置
MX2008012939A (es) * 2006-04-04 2009-01-16 Saint Gobain Abrasives Inc Articulos abrasivos curados con radiacion infrarroja, y metodo de fabricacion de los mismos.
US20070243798A1 (en) * 2006-04-18 2007-10-18 3M Innovative Properties Company Embossed structured abrasive article and method of making and using the same
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US7422982B2 (en) * 2006-07-07 2008-09-09 Applied Materials, Inc. Method and apparatus for electroprocessing a substrate with edge profile control
EP2193009B1 (en) * 2007-07-27 2011-10-12 Saint-Gobain Abrasives, Inc. Abrasive products with splice marks and automated splice detection
US20090110890A1 (en) * 2007-10-30 2009-04-30 3M Innovative Properties Company Color changing wear indicator
CN101990483B (zh) * 2008-04-01 2013-10-16 音诺帕德股份有限公司 具有经控制的孔隙形态的抛光垫
US20090307986A1 (en) * 2008-06-12 2009-12-17 Hung-Hui Huang Polishing composition and making method thereof for polishing a substrate
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US20100227141A1 (en) * 2009-03-05 2010-09-09 Gm Global Technology Operations, Inc. Protective coating for industrial parts
US20110021114A1 (en) * 2009-07-27 2011-01-27 Mcardle James L Abrasive article with preconditioning and persistent indicators
CN106057218B (zh) * 2010-08-31 2018-02-06 Hoya株式会社 磁盘用玻璃基板的制造方法以及磁盘的制造方法
CN102229099A (zh) * 2011-05-22 2011-11-02 浙江省天台祥和实业有限公司 密封件研磨清洗机
CN102499604A (zh) * 2011-11-01 2012-06-20 常熟新诚鑫织造有限公司 带使用提示装置的毛巾面料
US9746129B2 (en) 2012-09-28 2017-08-29 Momentive Performance Materials Inc. Puck wear detection
JP5373171B1 (ja) * 2012-10-20 2013-12-18 株式会社ナノテム 砥石およびそれを用いた研削・研磨装置
KR101506613B1 (ko) 2013-05-13 2015-03-27 이화다이아몬드공업 주식회사 와이어 절삭공구 및 그 제조방법
KR200478500Y1 (ko) 2013-10-01 2015-10-14 김도영 양면 연마장치용 연마패드
GB2537161B (en) 2015-04-10 2019-06-19 Reckitt Benckiser Brands Ltd Novel material
AU2017256171A1 (en) * 2016-04-29 2018-11-22 3M Innovative Properties Company Cleaning articles including scouring bodies that form printed instructions
DE102016115770A1 (de) * 2016-08-25 2018-03-01 Smiths Heimann Gmbh Strahlenschutzelement mit integrierter Austauschanzeige
JP6732381B2 (ja) * 2016-10-03 2020-07-29 株式会社ディスコ 切削装置
US10344993B2 (en) * 2017-06-29 2019-07-09 Deere & Company Extractor fan with wear indicator
EP3651935A4 (en) * 2017-07-10 2020-12-23 Osborn, LLC ABRASIVE POLISHING OR BUFFLING ARTICLE WITHOUT COMPOUND
CN109420973B (zh) 2017-09-05 2020-11-17 联华电子股份有限公司 晶片研磨盘与其使用方法
CN107685288B (zh) * 2017-09-05 2019-05-10 南京航空航天大学 一种游离磨粒轨迹检测方法
US11325221B2 (en) * 2017-11-16 2022-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with multipurpose composite window
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
CN108127582B (zh) * 2017-12-13 2019-12-31 湖北鼎汇微电子材料有限公司 一种制备抛光层的模具及制备方法
CN109108800A (zh) * 2018-08-13 2019-01-01 芜湖九鼎电子科技有限公司 一种全自动仪表镜面磨光机
EP3616840B1 (en) * 2018-09-03 2024-10-30 3M Innovative Properties Company Abrasive article
US11911871B2 (en) * 2018-10-31 2024-02-27 Taiwan Semiconductor Manufacturing Company Ltd. Method of manufacturing composite article
US11992918B2 (en) 2018-12-18 2024-05-28 3M Innovative Properties Company Abrasive article maker with differential tooling speed
EP3898093B1 (en) 2018-12-18 2024-08-21 3M Innovative Properties Company Tooling splice accommodation for abrasive article production
EP3898086A1 (en) 2018-12-18 2021-10-27 3M Innovative Properties Company Shaped abrasive particle transfer assembly
CN113260486A (zh) 2018-12-18 2021-08-13 3M创新有限公司 具有间隔颗粒的涂层磨料制品及其制备方法和设备
CN113226648A (zh) 2018-12-18 2021-08-06 3M创新有限公司 磨料制品产生中改善的颗粒接收
WO2020128858A1 (en) 2018-12-18 2020-06-25 3M Innovative Properties Company Camouflage for abrasive articles
EP3898087A1 (en) * 2018-12-18 2021-10-27 3M Innovative Properties Company Patterned abrasive substrate and method
CN109454547A (zh) * 2018-12-27 2019-03-12 杭州众硅电子科技有限公司 一种用于cmp抛光垫寿命在线检测的系统和方法
CN111896407A (zh) * 2020-06-09 2020-11-06 河北招岳聚氨酯制品有限公司 一种筛板磨损监测系统
US11673429B2 (en) * 2020-08-24 2023-06-13 Evident Canada, Inc. Shoe interface wear indicator
CN113635216A (zh) * 2021-08-26 2021-11-12 业成科技（成都）有限公司 砂纸、金相研磨方法和装置
JP2025520622A (ja) * 2022-06-22 2025-07-03 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品、システム及び使用方法
EP4364945A1 (en) * 2022-11-01 2024-05-08 Roller Bearing Company of America, Inc. Machinable molded fretting buffer
CN116690441A (zh) * 2023-07-04 2023-09-05 江苏友和工具有限公司 一种磨轮及其制备工艺

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014468A (en) * 1989-05-05 1991-05-14 Norton Company Patterned coated abrasive for fine surface finishing
AT396213B (de) * 1990-04-11 1993-07-26 Swarovski Tyrolit Schleif Schleifscheibe
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
JP3286941B2 (ja) * 1991-07-09 2002-05-27 株式会社日立製作所 ダイヤモンド研削砥石のツルーイング法
US5437754A (en) * 1992-01-13 1995-08-01 Minnesota Mining And Manufacturing Company Abrasive article having precise lateral spacing between abrasive composite members
US5243790A (en) * 1992-06-25 1993-09-14 Abrasifs Vega, Inc. Abrasive member
US6022264A (en) * 1997-02-10 2000-02-08 Rodel Inc. Polishing pad and methods relating thereto
US6069080A (en) * 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5454844A (en) * 1993-10-29 1995-10-03 Minnesota Mining And Manufacturing Company Abrasive article, a process of making same, and a method of using same to finish a workpiece surface
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
JP3438383B2 (ja) * 1995-03-03 2003-08-18 ソニー株式会社 研磨方法およびこれに用いる研磨装置
JP3708167B2 (ja) * 1995-05-17 2005-10-19 株式会社荏原製作所 研磨布及び該研磨布を備えたポリッシング装置
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
JP2830907B2 (ja) * 1995-12-06 1998-12-02 日本電気株式会社 半導体基板研磨装置
US5743784A (en) * 1995-12-19 1998-04-28 Applied Materials, Inc. Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process
US5624303A (en) * 1996-01-22 1997-04-29 Micron Technology, Inc. Polishing pad and a method for making a polishing pad with covalently bonded particles
US6090475A (en) * 1996-05-24 2000-07-18 Micron Technology Inc. Polishing pad, methods of manufacturing and use
US5733176A (en) * 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
JPH106218A (ja) * 1996-06-27 1998-01-13 Minnesota Mining & Mfg Co <3M> ドレッシング用研磨材製品
JPH1015807A (ja) * 1996-07-01 1998-01-20 Canon Inc 研磨システム
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6080215A (en) * 1996-08-12 2000-06-27 3M Innovative Properties Company Abrasive article and method of making such article
US5725417A (en) * 1996-11-05 1998-03-10 Micron Technology, Inc. Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates
KR100210840B1 (ko) * 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
US5842910A (en) * 1997-03-10 1998-12-01 International Business Machines Corporation Off-center grooved polish pad for CMP
US5944583A (en) * 1997-03-17 1999-08-31 International Business Machines Corporation Composite polish pad for CMP
US5899745A (en) * 1997-07-03 1999-05-04 Motorola, Inc. Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor
US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
US5913713A (en) * 1997-07-31 1999-06-22 International Business Machines Corporation CMP polishing pad backside modifications for advantageous polishing results
US6168508B1 (en) * 1997-08-25 2001-01-02 Lsi Logic Corporation Polishing pad surface for improved process control
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US5916010A (en) * 1997-10-30 1999-06-29 International Business Machines Corporation CMP pad maintenance apparatus and method
JP3295888B2 (ja) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
US6106661A (en) * 1998-05-08 2000-08-22 Advanced Micro Devices, Inc. Polishing pad having a wear level indicator and system using the same
JPH11347919A (ja) * 1998-06-09 1999-12-21 Oki Electric Ind Co Ltd 半導体素子の研磨平坦化装置及び研磨平坦化方法
US6012968A (en) * 1998-07-31 2000-01-11 International Business Machines Corporation Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle
US6093085A (en) * 1998-09-08 2000-07-25 Advanced Micro Devices, Inc. Apparatuses and methods for polishing semiconductor wafers
GB2345657B (en) * 1999-01-13 2001-08-15 United Microelectronics Corp Lifetime self-indicated polishing pad
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6241583B1 (en) * 1999-02-04 2001-06-05 Applied Materials, Inc. Chemical mechanical polishing with a plurality of polishing sheets
US6238592B1 (en) * 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication
US6264533B1 (en) * 1999-05-28 2001-07-24 3M Innovative Properties Company Abrasive processing apparatus and method employing encoded abrasive product

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