CN1535197A - 具有磨损指示的固定式磨具 - Google Patents
具有磨损指示的固定式磨具 Download PDFInfo
- Publication number
- CN1535197A CN1535197A CNA028147529A CN02814752A CN1535197A CN 1535197 A CN1535197 A CN 1535197A CN A028147529 A CNA028147529 A CN A028147529A CN 02814752 A CN02814752 A CN 02814752A CN 1535197 A CN1535197 A CN 1535197A
- Authority
- CN
- China
- Prior art keywords
- abrasive article
- fixed abrasive
- wearing
- tearing
- indication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/910,425 US20020077037A1 (en) | 1999-05-03 | 2001-07-20 | Fixed abrasive articles |
| US09/910,425 | 2001-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1535197A true CN1535197A (zh) | 2004-10-06 |
Family
ID=25428766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA028147529A Pending CN1535197A (zh) | 2001-07-20 | 2002-07-12 | 具有磨损指示的固定式磨具 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020077037A1 (enExample) |
| EP (1) | EP1409201A1 (enExample) |
| JP (1) | JP2004535306A (enExample) |
| KR (1) | KR20040017328A (enExample) |
| CN (1) | CN1535197A (enExample) |
| TW (1) | TW565488B (enExample) |
| WO (1) | WO2003008151A1 (enExample) |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101232968B (zh) * | 2005-07-28 | 2010-05-19 | 3M创新有限公司 | 自修整的磨料制品、方法及抛光体系 |
| CN101990483A (zh) * | 2008-04-01 | 2011-03-23 | 音诺帕德股份有限公司 | 具有经控制的孔隙形态的抛光垫 |
| CN101232969B (zh) * | 2005-07-28 | 2011-05-11 | 3M创新有限公司 | 磨料团聚体抛光方法 |
| CN102229099A (zh) * | 2011-05-22 | 2011-11-02 | 浙江省天台祥和实业有限公司 | 密封件研磨清洗机 |
| CN102499604A (zh) * | 2011-11-01 | 2012-06-20 | 常熟新诚鑫织造有限公司 | 带使用提示装置的毛巾面料 |
| CN101743094B (zh) * | 2007-07-27 | 2013-02-27 | 圣戈班磨料磨具有限公司 | 磨料产品在使用过程中的特征的自动化检测 |
| CN105904335A (zh) * | 2004-11-01 | 2016-08-31 | 株式会社荏原制作所 | 抛光设备 |
| CN106057218A (zh) * | 2010-08-31 | 2016-10-26 | Hoya株式会社 | 磁盘用玻璃基板的制造方法以及磁盘的制造方法 |
| CN107685288A (zh) * | 2017-09-05 | 2018-02-13 | 南京航空航天大学 | 一种游离磨粒轨迹检测方法 |
| CN108127582A (zh) * | 2017-12-13 | 2018-06-08 | 湖北鼎汇微电子材料有限公司 | 一种制备抛光层的模具及制备方法 |
| CN109108800A (zh) * | 2018-08-13 | 2019-01-01 | 芜湖九鼎电子科技有限公司 | 一种全自动仪表镜面磨光机 |
| CN109209963A (zh) * | 2017-06-29 | 2019-01-15 | 迪尔公司 | 具有磨损指示器的抽风机风扇 |
| CN109420973A (zh) * | 2017-09-05 | 2019-03-05 | 联华电子股份有限公司 | 晶片研磨盘与其使用方法 |
| CN110026885A (zh) * | 2018-12-27 | 2019-07-19 | 杭州众硅电子科技有限公司 | 一种抛光垫寿命在线检测的系统和方法 |
| CN111896407A (zh) * | 2020-06-09 | 2020-11-06 | 河北招岳聚氨酯制品有限公司 | 一种筛板磨损监测系统 |
| CN113195162A (zh) * | 2018-12-18 | 2021-07-30 | 3M创新有限公司 | 图案化磨料基底和方法 |
| CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
| CN115997120A (zh) * | 2020-08-24 | 2023-04-21 | 加拿大埃维登特有限公司 | 底座接口磨损指示器 |
| CN116690441A (zh) * | 2023-07-04 | 2023-09-05 | 江苏友和工具有限公司 | 一种磨轮及其制备工艺 |
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| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
| US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
| US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
| US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
| US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
| US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
| US7066800B2 (en) | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6991526B2 (en) | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
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| US6896776B2 (en) | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
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| US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
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| US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
| KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
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| US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| KR101165114B1 (ko) * | 2004-10-06 | 2012-07-12 | 라지브 바자즈 | 향상된 화학 기계적 평탄화 작업용 장치 및 방법 |
| US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
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| US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
| US20140120807A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
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| JPH11347919A (ja) * | 1998-06-09 | 1999-12-21 | Oki Electric Ind Co Ltd | 半導体素子の研磨平坦化装置及び研磨平坦化方法 |
| US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
| US6093085A (en) * | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
| GB2345657B (en) * | 1999-01-13 | 2001-08-15 | United Microelectronics Corp | Lifetime self-indicated polishing pad |
| US6244935B1 (en) * | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
| US6238592B1 (en) * | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| US6264533B1 (en) * | 1999-05-28 | 2001-07-24 | 3M Innovative Properties Company | Abrasive processing apparatus and method employing encoded abrasive product |
-
2001
- 2001-07-20 US US09/910,425 patent/US20020077037A1/en not_active Abandoned
-
2002
- 2002-07-12 CN CNA028147529A patent/CN1535197A/zh active Pending
- 2002-07-12 EP EP02746972A patent/EP1409201A1/en not_active Withdrawn
- 2002-07-12 WO PCT/US2002/021940 patent/WO2003008151A1/en not_active Ceased
- 2002-07-12 KR KR10-2004-7000826A patent/KR20040017328A/ko not_active Withdrawn
- 2002-07-12 JP JP2003513743A patent/JP2004535306A/ja not_active Withdrawn
- 2002-07-19 TW TW091116153A patent/TW565488B/zh active
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| CN105904335B (zh) * | 2004-11-01 | 2019-04-30 | 株式会社荏原制作所 | 抛光设备 |
| CN105904335A (zh) * | 2004-11-01 | 2016-08-31 | 株式会社荏原制作所 | 抛光设备 |
| CN101232969B (zh) * | 2005-07-28 | 2011-05-11 | 3M创新有限公司 | 磨料团聚体抛光方法 |
| CN101232968B (zh) * | 2005-07-28 | 2010-05-19 | 3M创新有限公司 | 自修整的磨料制品、方法及抛光体系 |
| CN101743094B (zh) * | 2007-07-27 | 2013-02-27 | 圣戈班磨料磨具有限公司 | 磨料产品在使用过程中的特征的自动化检测 |
| CN101990483A (zh) * | 2008-04-01 | 2011-03-23 | 音诺帕德股份有限公司 | 具有经控制的孔隙形态的抛光垫 |
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| US10722998B2 (en) | 2017-09-05 | 2020-07-28 | United Microelectronics Corp. | Wafer polishing pad and using method thereof |
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| CN111896407A (zh) * | 2020-06-09 | 2020-11-06 | 河北招岳聚氨酯制品有限公司 | 一种筛板磨损监测系统 |
| CN115997120A (zh) * | 2020-08-24 | 2023-04-21 | 加拿大埃维登特有限公司 | 底座接口磨损指示器 |
| CN115997120B (zh) * | 2020-08-24 | 2025-10-10 | 加拿大埃维登特有限公司 | 底座接口磨损指示器 |
| CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20020077037A1 (en) | 2002-06-20 |
| JP2004535306A (ja) | 2004-11-25 |
| WO2003008151A1 (en) | 2003-01-30 |
| EP1409201A1 (en) | 2004-04-21 |
| KR20040017328A (ko) | 2004-02-26 |
| TW565488B (en) | 2003-12-11 |
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