TW565488B - Fixed abrasive articles - Google Patents
Fixed abrasive articles Download PDFInfo
- Publication number
- TW565488B TW565488B TW091116153A TW91116153A TW565488B TW 565488 B TW565488 B TW 565488B TW 091116153 A TW091116153 A TW 091116153A TW 91116153 A TW91116153 A TW 91116153A TW 565488 B TW565488 B TW 565488B
- Authority
- TW
- Taiwan
- Prior art keywords
- abrasive
- shaped abrasive
- shaped
- wear indicator
- wear
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/910,425 US20020077037A1 (en) | 1999-05-03 | 2001-07-20 | Fixed abrasive articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW565488B true TW565488B (en) | 2003-12-11 |
Family
ID=25428766
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091116153A TW565488B (en) | 2001-07-20 | 2002-07-19 | Fixed abrasive articles |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20020077037A1 (enExample) |
| EP (1) | EP1409201A1 (enExample) |
| JP (1) | JP2004535306A (enExample) |
| KR (1) | KR20040017328A (enExample) |
| CN (1) | CN1535197A (enExample) |
| TW (1) | TW565488B (enExample) |
| WO (1) | WO2003008151A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI399260B (zh) * | 2005-07-28 | 2013-06-21 | 3M Innovative Properties Co | 自含式修整研磨物件,製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統 |
| TWI402136B (zh) * | 2005-07-28 | 2013-07-21 | 3M Innovative Properties Co | 研磨附聚物拋光方法 |
| TWI784082B (zh) * | 2017-11-16 | 2022-11-21 | 美商羅門哈斯電子材料Cmp控股公司 | 具有多用途複合窗口的拋光墊 |
| TWI800557B (zh) * | 2017-11-16 | 2023-05-01 | 美商羅門哈斯電子材料Cmp控股公司 | 具有墊磨損指示器的拋光墊 |
Families Citing this family (92)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US6979248B2 (en) | 2002-05-07 | 2005-12-27 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7670468B2 (en) | 2000-02-17 | 2010-03-02 | Applied Materials, Inc. | Contact assembly and method for electrochemical mechanical processing |
| US7029365B2 (en) | 2000-02-17 | 2006-04-18 | Applied Materials Inc. | Pad assembly for electrochemical mechanical processing |
| US6991528B2 (en) | 2000-02-17 | 2006-01-31 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7125477B2 (en) | 2000-02-17 | 2006-10-24 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US7303462B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Edge bead removal by an electro polishing process |
| US7374644B2 (en) | 2000-02-17 | 2008-05-20 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7678245B2 (en) | 2000-02-17 | 2010-03-16 | Applied Materials, Inc. | Method and apparatus for electrochemical mechanical processing |
| US7303662B2 (en) | 2000-02-17 | 2007-12-04 | Applied Materials, Inc. | Contacts for electrochemical processing |
| US20030213703A1 (en) * | 2002-05-16 | 2003-11-20 | Applied Materials, Inc. | Method and apparatus for substrate polishing |
| US7059948B2 (en) | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
| US7077721B2 (en) | 2000-02-17 | 2006-07-18 | Applied Materials, Inc. | Pad assembly for electrochemical mechanical processing |
| US6962524B2 (en) | 2000-02-17 | 2005-11-08 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US20040182721A1 (en) * | 2003-03-18 | 2004-09-23 | Applied Materials, Inc. | Process control in electro-chemical mechanical polishing |
| US7066800B2 (en) | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US6991526B2 (en) | 2002-09-16 | 2006-01-31 | Applied Materials, Inc. | Control of removal profile in electrochemically assisted CMP |
| US6848970B2 (en) * | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
| US6896776B2 (en) | 2000-12-18 | 2005-05-24 | Applied Materials Inc. | Method and apparatus for electro-chemical processing |
| US7137879B2 (en) | 2001-04-24 | 2006-11-21 | Applied Materials, Inc. | Conductive polishing article for electrochemical mechanical polishing |
| US7344432B2 (en) | 2001-04-24 | 2008-03-18 | Applied Materials, Inc. | Conductive pad with ion exchange membrane for electrochemical mechanical polishing |
| US7070480B2 (en) * | 2001-10-11 | 2006-07-04 | Applied Materials, Inc. | Method and apparatus for polishing substrates |
| US20030072639A1 (en) * | 2001-10-17 | 2003-04-17 | Applied Materials, Inc. | Substrate support |
| US6837983B2 (en) * | 2002-01-22 | 2005-01-04 | Applied Materials, Inc. | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US20040072445A1 (en) * | 2002-07-11 | 2004-04-15 | Applied Materials, Inc. | Effective method to improve surface finish in electrochemically assisted CMP |
| US7112270B2 (en) * | 2002-09-16 | 2006-09-26 | Applied Materials, Inc. | Algorithm for real-time process control of electro-polishing |
| US20050061674A1 (en) * | 2002-09-16 | 2005-03-24 | Yan Wang | Endpoint compensation in electroprocessing |
| US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
| US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
| US7160178B2 (en) * | 2003-08-07 | 2007-01-09 | 3M Innovative Properties Company | In situ activation of a three-dimensional fixed abrasive article |
| KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
| US20050121141A1 (en) * | 2003-11-13 | 2005-06-09 | Manens Antoine P. | Real time process control for a polishing process |
| US7186164B2 (en) | 2003-12-03 | 2007-03-06 | Applied Materials, Inc. | Processing pad assembly with zone control |
| US7390744B2 (en) | 2004-01-29 | 2008-06-24 | Applied Materials, Inc. | Method and composition for polishing a substrate |
| US20050176251A1 (en) * | 2004-02-05 | 2005-08-11 | Duong Chau H. | Polishing pad with releasable slick particles |
| US6951509B1 (en) * | 2004-03-09 | 2005-10-04 | 3M Innovative Properties Company | Undulated pad conditioner and method of using same |
| US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US7084064B2 (en) | 2004-09-14 | 2006-08-01 | Applied Materials, Inc. | Full sequence metal and barrier layer electrochemical mechanical processing |
| US7520968B2 (en) | 2004-10-05 | 2009-04-21 | Applied Materials, Inc. | Conductive pad design modification for better wafer-pad contact |
| KR101165114B1 (ko) * | 2004-10-06 | 2012-07-12 | 라지브 바자즈 | 향상된 화학 기계적 평탄화 작업용 장치 및 방법 |
| CN105904335B (zh) * | 2004-11-01 | 2019-04-30 | 株式会社荏原制作所 | 抛光设备 |
| US7655565B2 (en) * | 2005-01-26 | 2010-02-02 | Applied Materials, Inc. | Electroprocessing profile control |
| US7524345B2 (en) * | 2005-02-22 | 2009-04-28 | Saint-Gobain Abrasives, Inc. | Rapid tooling system and methods for manufacturing abrasive articles |
| US7427340B2 (en) | 2005-04-08 | 2008-09-23 | Applied Materials, Inc. | Conductive pad |
| US20140120807A1 (en) * | 2005-05-16 | 2014-05-01 | Chien-Min Sung | Cmp pad conditioners with mosaic abrasive segments and associated methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| MY142245A (en) * | 2005-06-29 | 2010-11-15 | Saint Gobain Abrasives Inc | High-performance resin for abrasive products |
| JP4756583B2 (ja) * | 2005-08-30 | 2011-08-24 | 株式会社東京精密 | 研磨パッド、パッドドレッシング評価方法、及び研磨装置 |
| MX2008012939A (es) * | 2006-04-04 | 2009-01-16 | Saint Gobain Abrasives Inc | Articulos abrasivos curados con radiacion infrarroja, y metodo de fabricacion de los mismos. |
| US20070243798A1 (en) * | 2006-04-18 | 2007-10-18 | 3M Innovative Properties Company | Embossed structured abrasive article and method of making and using the same |
| US7410413B2 (en) * | 2006-04-27 | 2008-08-12 | 3M Innovative Properties Company | Structured abrasive article and method of making and using the same |
| US7422982B2 (en) * | 2006-07-07 | 2008-09-09 | Applied Materials, Inc. | Method and apparatus for electroprocessing a substrate with edge profile control |
| EP2193009B1 (en) * | 2007-07-27 | 2011-10-12 | Saint-Gobain Abrasives, Inc. | Abrasive products with splice marks and automated splice detection |
| US20090110890A1 (en) * | 2007-10-30 | 2009-04-30 | 3M Innovative Properties Company | Color changing wear indicator |
| CN101990483B (zh) * | 2008-04-01 | 2013-10-16 | 音诺帕德股份有限公司 | 具有经控制的孔隙形态的抛光垫 |
| US20090307986A1 (en) * | 2008-06-12 | 2009-12-17 | Hung-Hui Huang | Polishing composition and making method thereof for polishing a substrate |
| US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
| US20100227141A1 (en) * | 2009-03-05 | 2010-09-09 | Gm Global Technology Operations, Inc. | Protective coating for industrial parts |
| US20110021114A1 (en) * | 2009-07-27 | 2011-01-27 | Mcardle James L | Abrasive article with preconditioning and persistent indicators |
| CN106057218B (zh) * | 2010-08-31 | 2018-02-06 | Hoya株式会社 | 磁盘用玻璃基板的制造方法以及磁盘的制造方法 |
| CN102229099A (zh) * | 2011-05-22 | 2011-11-02 | 浙江省天台祥和实业有限公司 | 密封件研磨清洗机 |
| CN102499604A (zh) * | 2011-11-01 | 2012-06-20 | 常熟新诚鑫织造有限公司 | 带使用提示装置的毛巾面料 |
| US9746129B2 (en) | 2012-09-28 | 2017-08-29 | Momentive Performance Materials Inc. | Puck wear detection |
| JP5373171B1 (ja) * | 2012-10-20 | 2013-12-18 | 株式会社ナノテム | 砥石およびそれを用いた研削・研磨装置 |
| KR101506613B1 (ko) | 2013-05-13 | 2015-03-27 | 이화다이아몬드공업 주식회사 | 와이어 절삭공구 및 그 제조방법 |
| KR200478500Y1 (ko) | 2013-10-01 | 2015-10-14 | 김도영 | 양면 연마장치용 연마패드 |
| GB2537161B (en) | 2015-04-10 | 2019-06-19 | Reckitt Benckiser Brands Ltd | Novel material |
| AU2017256171A1 (en) * | 2016-04-29 | 2018-11-22 | 3M Innovative Properties Company | Cleaning articles including scouring bodies that form printed instructions |
| DE102016115770A1 (de) * | 2016-08-25 | 2018-03-01 | Smiths Heimann Gmbh | Strahlenschutzelement mit integrierter Austauschanzeige |
| JP6732381B2 (ja) * | 2016-10-03 | 2020-07-29 | 株式会社ディスコ | 切削装置 |
| US10344993B2 (en) * | 2017-06-29 | 2019-07-09 | Deere & Company | Extractor fan with wear indicator |
| EP3651935A4 (en) * | 2017-07-10 | 2020-12-23 | Osborn, LLC | ABRASIVE POLISHING OR BUFFLING ARTICLE WITHOUT COMPOUND |
| CN109420973B (zh) | 2017-09-05 | 2020-11-17 | 联华电子股份有限公司 | 晶片研磨盘与其使用方法 |
| CN107685288B (zh) * | 2017-09-05 | 2019-05-10 | 南京航空航天大学 | 一种游离磨粒轨迹检测方法 |
| CN108127582B (zh) * | 2017-12-13 | 2019-12-31 | 湖北鼎汇微电子材料有限公司 | 一种制备抛光层的模具及制备方法 |
| CN109108800A (zh) * | 2018-08-13 | 2019-01-01 | 芜湖九鼎电子科技有限公司 | 一种全自动仪表镜面磨光机 |
| EP3616840B1 (en) * | 2018-09-03 | 2024-10-30 | 3M Innovative Properties Company | Abrasive article |
| US11911871B2 (en) * | 2018-10-31 | 2024-02-27 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing composite article |
| US11992918B2 (en) | 2018-12-18 | 2024-05-28 | 3M Innovative Properties Company | Abrasive article maker with differential tooling speed |
| EP3898093B1 (en) | 2018-12-18 | 2024-08-21 | 3M Innovative Properties Company | Tooling splice accommodation for abrasive article production |
| EP3898086A1 (en) | 2018-12-18 | 2021-10-27 | 3M Innovative Properties Company | Shaped abrasive particle transfer assembly |
| CN113260486A (zh) | 2018-12-18 | 2021-08-13 | 3M创新有限公司 | 具有间隔颗粒的涂层磨料制品及其制备方法和设备 |
| CN113226648A (zh) | 2018-12-18 | 2021-08-06 | 3M创新有限公司 | 磨料制品产生中改善的颗粒接收 |
| WO2020128858A1 (en) | 2018-12-18 | 2020-06-25 | 3M Innovative Properties Company | Camouflage for abrasive articles |
| EP3898087A1 (en) * | 2018-12-18 | 2021-10-27 | 3M Innovative Properties Company | Patterned abrasive substrate and method |
| CN109454547A (zh) * | 2018-12-27 | 2019-03-12 | 杭州众硅电子科技有限公司 | 一种用于cmp抛光垫寿命在线检测的系统和方法 |
| CN111896407A (zh) * | 2020-06-09 | 2020-11-06 | 河北招岳聚氨酯制品有限公司 | 一种筛板磨损监测系统 |
| US11673429B2 (en) * | 2020-08-24 | 2023-06-13 | Evident Canada, Inc. | Shoe interface wear indicator |
| CN113635216A (zh) * | 2021-08-26 | 2021-11-12 | 业成科技(成都)有限公司 | 砂纸、金相研磨方法和装置 |
| JP2025520622A (ja) * | 2022-06-22 | 2025-07-03 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨物品、システム及び使用方法 |
| EP4364945A1 (en) * | 2022-11-01 | 2024-05-08 | Roller Bearing Company of America, Inc. | Machinable molded fretting buffer |
| CN116690441A (zh) * | 2023-07-04 | 2023-09-05 | 江苏友和工具有限公司 | 一种磨轮及其制备工艺 |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014468A (en) * | 1989-05-05 | 1991-05-14 | Norton Company | Patterned coated abrasive for fine surface finishing |
| AT396213B (de) * | 1990-04-11 | 1993-07-26 | Swarovski Tyrolit Schleif | Schleifscheibe |
| US5152917B1 (en) * | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
| JP3286941B2 (ja) * | 1991-07-09 | 2002-05-27 | 株式会社日立製作所 | ダイヤモンド研削砥石のツルーイング法 |
| US5437754A (en) * | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
| US5243790A (en) * | 1992-06-25 | 1993-09-14 | Abrasifs Vega, Inc. | Abrasive member |
| US6022264A (en) * | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
| US6069080A (en) * | 1992-08-19 | 2000-05-30 | Rodel Holdings, Inc. | Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like |
| US5454844A (en) * | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
| US5453312A (en) * | 1993-10-29 | 1995-09-26 | Minnesota Mining And Manufacturing Company | Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface |
| US5536202A (en) * | 1994-07-27 | 1996-07-16 | Texas Instruments Incorporated | Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish |
| US5527424A (en) * | 1995-01-30 | 1996-06-18 | Motorola, Inc. | Preconditioner for a polishing pad and method for using the same |
| JP3438383B2 (ja) * | 1995-03-03 | 2003-08-18 | ソニー株式会社 | 研磨方法およびこれに用いる研磨装置 |
| JP3708167B2 (ja) * | 1995-05-17 | 2005-10-19 | 株式会社荏原製作所 | 研磨布及び該研磨布を備えたポリッシング装置 |
| US5868605A (en) * | 1995-06-02 | 1999-02-09 | Speedfam Corporation | In-situ polishing pad flatness control |
| US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US5958794A (en) * | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
| JP2830907B2 (ja) * | 1995-12-06 | 1998-12-02 | 日本電気株式会社 | 半導体基板研磨装置 |
| US5743784A (en) * | 1995-12-19 | 1998-04-28 | Applied Materials, Inc. | Apparatus and method to determine the coefficient of friction of a chemical mechanical polishing pad during a pad conditioning process and to use it to control the process |
| US5624303A (en) * | 1996-01-22 | 1997-04-29 | Micron Technology, Inc. | Polishing pad and a method for making a polishing pad with covalently bonded particles |
| US6090475A (en) * | 1996-05-24 | 2000-07-18 | Micron Technology Inc. | Polishing pad, methods of manufacturing and use |
| US5733176A (en) * | 1996-05-24 | 1998-03-31 | Micron Technology, Inc. | Polishing pad and method of use |
| JPH106218A (ja) * | 1996-06-27 | 1998-01-13 | Minnesota Mining & Mfg Co <3M> | ドレッシング用研磨材製品 |
| JPH1015807A (ja) * | 1996-07-01 | 1998-01-20 | Canon Inc | 研磨システム |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US6080215A (en) * | 1996-08-12 | 2000-06-27 | 3M Innovative Properties Company | Abrasive article and method of making such article |
| US5725417A (en) * | 1996-11-05 | 1998-03-10 | Micron Technology, Inc. | Method and apparatus for conditioning polishing pads used in mechanical and chemical-mechanical planarization of substrates |
| KR100210840B1 (ko) * | 1996-12-24 | 1999-07-15 | 구본준 | 기계 화학적 연마 방법 및 그 장치 |
| US5842910A (en) * | 1997-03-10 | 1998-12-01 | International Business Machines Corporation | Off-center grooved polish pad for CMP |
| US5944583A (en) * | 1997-03-17 | 1999-08-31 | International Business Machines Corporation | Composite polish pad for CMP |
| US5899745A (en) * | 1997-07-03 | 1999-05-04 | Motorola, Inc. | Method of chemical mechanical polishing (CMP) using an underpad with different compression regions and polishing pad therefor |
| US5904615A (en) * | 1997-07-18 | 1999-05-18 | Hankook Machine Tools Co., Ltd. | Pad conditioner for chemical mechanical polishing apparatus |
| US5913713A (en) * | 1997-07-31 | 1999-06-22 | International Business Machines Corporation | CMP polishing pad backside modifications for advantageous polishing results |
| US6168508B1 (en) * | 1997-08-25 | 2001-01-02 | Lsi Logic Corporation | Polishing pad surface for improved process control |
| US6121143A (en) * | 1997-09-19 | 2000-09-19 | 3M Innovative Properties Company | Abrasive articles comprising a fluorochemical agent for wafer surface modification |
| US5916010A (en) * | 1997-10-30 | 1999-06-29 | International Business Machines Corporation | CMP pad maintenance apparatus and method |
| JP3295888B2 (ja) * | 1998-04-22 | 2002-06-24 | 株式会社藤森技術研究所 | ケミカルマシンポリッシャの研磨盤用研磨ドレッサ |
| US6106661A (en) * | 1998-05-08 | 2000-08-22 | Advanced Micro Devices, Inc. | Polishing pad having a wear level indicator and system using the same |
| JPH11347919A (ja) * | 1998-06-09 | 1999-12-21 | Oki Electric Ind Co Ltd | 半導体素子の研磨平坦化装置及び研磨平坦化方法 |
| US6012968A (en) * | 1998-07-31 | 2000-01-11 | International Business Machines Corporation | Apparatus for and method of conditioning chemical mechanical polishing pad during workpiece polishing cycle |
| US6093085A (en) * | 1998-09-08 | 2000-07-25 | Advanced Micro Devices, Inc. | Apparatuses and methods for polishing semiconductor wafers |
| GB2345657B (en) * | 1999-01-13 | 2001-08-15 | United Microelectronics Corp | Lifetime self-indicated polishing pad |
| US6244935B1 (en) * | 1999-02-04 | 2001-06-12 | Applied Materials, Inc. | Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet |
| US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
| US6238592B1 (en) * | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
| US6264533B1 (en) * | 1999-05-28 | 2001-07-24 | 3M Innovative Properties Company | Abrasive processing apparatus and method employing encoded abrasive product |
-
2001
- 2001-07-20 US US09/910,425 patent/US20020077037A1/en not_active Abandoned
-
2002
- 2002-07-12 CN CNA028147529A patent/CN1535197A/zh active Pending
- 2002-07-12 EP EP02746972A patent/EP1409201A1/en not_active Withdrawn
- 2002-07-12 WO PCT/US2002/021940 patent/WO2003008151A1/en not_active Ceased
- 2002-07-12 KR KR10-2004-7000826A patent/KR20040017328A/ko not_active Withdrawn
- 2002-07-12 JP JP2003513743A patent/JP2004535306A/ja not_active Withdrawn
- 2002-07-19 TW TW091116153A patent/TW565488B/zh active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI399260B (zh) * | 2005-07-28 | 2013-06-21 | 3M Innovative Properties Co | 自含式修整研磨物件,製造自含式修整研磨物件之方法及包含自含式修整研磨物件之拋光系統 |
| TWI402136B (zh) * | 2005-07-28 | 2013-07-21 | 3M Innovative Properties Co | 研磨附聚物拋光方法 |
| TWI784082B (zh) * | 2017-11-16 | 2022-11-21 | 美商羅門哈斯電子材料Cmp控股公司 | 具有多用途複合窗口的拋光墊 |
| TWI800557B (zh) * | 2017-11-16 | 2023-05-01 | 美商羅門哈斯電子材料Cmp控股公司 | 具有墊磨損指示器的拋光墊 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20020077037A1 (en) | 2002-06-20 |
| JP2004535306A (ja) | 2004-11-25 |
| WO2003008151A1 (en) | 2003-01-30 |
| CN1535197A (zh) | 2004-10-06 |
| EP1409201A1 (en) | 2004-04-21 |
| KR20040017328A (ko) | 2004-02-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW565488B (en) | Fixed abrasive articles | |
| TWI276504B (en) | Polishing pad with recessed window | |
| CN100493847C (zh) | 包含疏水区及终点检测口的抛光垫 | |
| US7014538B2 (en) | Article for polishing semiconductor substrates | |
| JP5379481B2 (ja) | 研磨材物品及び加工物の表面の修正方法 | |
| US6194317B1 (en) | Method of planarizing the upper surface of a semiconductor wafer | |
| CN100519079C (zh) | 用于三维固定的研磨件的原位激活的设备和方法 | |
| US6890244B2 (en) | Polishing pads useful in chemical mechanical polishing of substrates in the presence of a slurry containing abrasive particles | |
| KR100571448B1 (ko) | 유리한 미세 조직을 갖는 연마 패드 | |
| US6679769B2 (en) | Polishing pad having an advantageous micro-texture and methods relating thereto | |
| JP3072526B2 (ja) | 研磨パッドおよびその使用方法 | |
| EP1016133A1 (en) | Method of planarizing the upper surface of a semiconductor wafer | |
| WO2009023387A2 (en) | Compositions and methods for modifying a surface suited for semiconductor fabrication | |
| US20170232577A1 (en) | Composite conditioner and associated methods | |
| KR20160119082A (ko) | 연마용 연마입자와 그 제조 방법과 연마 방법과 연마 장치와 슬러리 | |
| JP2012533888A (ja) | 溝付きcmp研磨pad | |
| JP2007512966A5 (enExample) | ||
| TW200905739A (en) | Polishing pad | |
| TW200424035A (en) | CMP pad with composite transparent window | |
| JP5997235B2 (ja) | 複合砥粒とその製造方法と研磨方法と研磨装置 | |
| US6884144B2 (en) | Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers | |
| JP2015165001A (ja) | 研磨用砥粒とその製造方法と研磨方法と研磨装置とスラリー | |
| JP7273796B2 (ja) | 表面突起研磨パッド | |
| KR101928085B1 (ko) | 연마체 및 이의 제조 방법 | |
| Tsai et al. | Characteristics of chemical mechanical polishing using graphite impregnated pad |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |