GB2345657B - Lifetime self-indicated polishing pad - Google Patents

Lifetime self-indicated polishing pad

Info

Publication number
GB2345657B
GB2345657B GB9900721A GB9900721A GB2345657B GB 2345657 B GB2345657 B GB 2345657B GB 9900721 A GB9900721 A GB 9900721A GB 9900721 A GB9900721 A GB 9900721A GB 2345657 B GB2345657 B GB 2345657B
Authority
GB
United Kingdom
Prior art keywords
pad
polishing pad
polishing
lifetime
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9900721A
Other versions
GB2345657A (en
Inventor
Hsueh-Chung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to GB9900721A priority Critical patent/GB2345657B/en
Priority to DE19902804A priority patent/DE19902804A1/en
Priority to FR9901230A priority patent/FR2789005B1/en
Priority to JP11028922A priority patent/JP2000225558A/en
Publication of GB2345657A publication Critical patent/GB2345657A/en
Application granted granted Critical
Publication of GB2345657B publication Critical patent/GB2345657B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The polishing pad has a main body (21) and a colored indicating structure (22) a certain distance under the surface (25). While performing chemical mechanical polishing, a slurry is supplied onto the polishing pad to react with the water to be polished. As the polishing pad is consumed until, when reaching the colored indicating structure, a different color appears on the pad to indicate the consumption level. The color can be further changed with consumption to show the lifetime of the pad. Thus the quality of products being polished is very much enhanced, and the fabrication cost is reduced since the risk of polishing wafers by a worn out pad is prevented.
GB9900721A 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad Expired - Fee Related GB2345657B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9900721A GB2345657B (en) 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad
DE19902804A DE19902804A1 (en) 1999-01-13 1999-01-25 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface
FR9901230A FR2789005B1 (en) 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE
JP11028922A JP2000225558A (en) 1999-01-13 1999-02-05 Polishing pad indicating durable period limit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9900721A GB2345657B (en) 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad
DE19902804A DE19902804A1 (en) 1999-01-13 1999-01-25 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface
FR9901230A FR2789005B1 (en) 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE
JP11028922A JP2000225558A (en) 1999-01-13 1999-02-05 Polishing pad indicating durable period limit

Publications (2)

Publication Number Publication Date
GB2345657A GB2345657A (en) 2000-07-19
GB2345657B true GB2345657B (en) 2001-08-15

Family

ID=27438914

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9900721A Expired - Fee Related GB2345657B (en) 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad

Country Status (4)

Country Link
JP (1) JP2000225558A (en)
DE (1) DE19902804A1 (en)
FR (1) FR2789005B1 (en)
GB (1) GB2345657B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2002239922A (en) * 2001-02-07 2002-08-28 Dainippon Printing Co Ltd Abrasive film
JP4041107B2 (en) 2004-09-22 2008-01-30 株式会社東芝 Polishing method
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
CN107344328B (en) * 2016-05-06 2020-03-10 中芯国际集成电路制造(上海)有限公司 Polishing pad, forming method thereof and polishing monitoring method
JP6822518B2 (en) * 2019-05-14 2021-01-27 株式会社Sumco Polishing pad management method and polishing pad management system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579717A (en) * 1994-10-13 1996-12-03 International Business Machines Corporation Method of grinding thin-film magnetic heads using optical grinding markers
US5733176A (en) * 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
WO1998015384A1 (en) * 1996-10-08 1998-04-16 Micron Technology, Inc. Polishing pad contour indicator for mechanical or chemical-mechanical planarization
JPH10100062A (en) * 1996-09-26 1998-04-21 Toshiba Corp Abrasive pad and grinding device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4424203C2 (en) * 1994-07-09 1996-05-09 Wernicke & Co Gmbh Grinding wheel for grinding the edge of spectacle lenses

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5579717A (en) * 1994-10-13 1996-12-03 International Business Machines Corporation Method of grinding thin-film magnetic heads using optical grinding markers
US5733176A (en) * 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
JPH10100062A (en) * 1996-09-26 1998-04-21 Toshiba Corp Abrasive pad and grinding device
WO1998015384A1 (en) * 1996-10-08 1998-04-16 Micron Technology, Inc. Polishing pad contour indicator for mechanical or chemical-mechanical planarization

Also Published As

Publication number Publication date
DE19902804A1 (en) 2000-07-27
GB2345657A (en) 2000-07-19
FR2789005B1 (en) 2001-03-30
FR2789005A1 (en) 2000-08-04
JP2000225558A (en) 2000-08-15

Similar Documents

Publication Publication Date Title
TW200531783A (en) Polishing pad having a groove arrangement for reducing slurry consumption
IL134213A0 (en) A polishing composition including an inhibitor of tungsten etching
MY136868A (en) Pad constructions for chemical mechanical planarization applications
AU4743297A (en) Polishing pad contour indicator for mechanical or chemical-mechanical planarization
MY114512A (en) Polymeric substrate with polymeric microelements
HK1006953A1 (en) Conductive coated abrasives
TW200420382A (en) Transparent microporous materials for CMP
MY123347A (en) Planarization apparatus and method
MY133059A (en) Workpiece carrier with monopiece pressure plate and low gimbal point
EP0933166A4 (en) Abrasive and method for polishing semiconductor substrate
MY130639A (en) Method of rough polishing semiconductor wafers to reduce surface roughness
MY118577A (en) Apparatus for polishing wafers
GB2345657B (en) Lifetime self-indicated polishing pad
EP1075898A3 (en) Dresser and dressing apparatus
EP1205280A4 (en) Wafer polishing method and wafer polishing device
TW516119B (en) Chemical mechanical planarization of metal substrates
EP1418614A4 (en) Wafer holding ring for chemical and mechanical polisher
ZA89412B (en) Gas-fluxing stone
JPS5446144A (en) Hot plate
BR9804634A (en) Abrasive body
JPS5542027A (en) Dial plate and parting plate for watch
CN219293716U (en) Open type antistatic sand paper
CN213758497U (en) Beauty treatment square mill
KR100356388B1 (en) Manufacturing method of washing tools for clothing decoloration
JPS6471661A (en) Mirror polishing method for semiconductor wafer

Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)
PCNP Patent ceased through non-payment of renewal fee