FR2789005B1 - PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE - Google Patents

PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE

Info

Publication number
FR2789005B1
FR2789005B1 FR9901230A FR9901230A FR2789005B1 FR 2789005 B1 FR2789005 B1 FR 2789005B1 FR 9901230 A FR9901230 A FR 9901230A FR 9901230 A FR9901230 A FR 9901230A FR 2789005 B1 FR2789005 B1 FR 2789005B1
Authority
FR
France
Prior art keywords
pad
polishing
physical
substrate
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9901230A
Other languages
French (fr)
Other versions
FR2789005A1 (en
Inventor
Hsueh Chung Chen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB9900721A priority Critical patent/GB2345657B/en
Priority to DE19902804A priority patent/DE19902804A1/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to FR9901230A priority patent/FR2789005B1/en
Priority to JP11028922A priority patent/JP2000225558A/en
Publication of FR2789005A1 publication Critical patent/FR2789005A1/en
Application granted granted Critical
Publication of FR2789005B1 publication Critical patent/FR2789005B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The polishing pad has a main body (21) and a colored indicating structure (22) a certain distance under the surface (25). While performing chemical mechanical polishing, a slurry is supplied onto the polishing pad to react with the water to be polished. As the polishing pad is consumed until, when reaching the colored indicating structure, a different color appears on the pad to indicate the consumption level. The color can be further changed with consumption to show the lifetime of the pad. Thus the quality of products being polished is very much enhanced, and the fabrication cost is reduced since the risk of polishing wafers by a worn out pad is prevented.
FR9901230A 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE Expired - Fee Related FR2789005B1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9900721A GB2345657B (en) 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad
DE19902804A DE19902804A1 (en) 1999-01-13 1999-01-25 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface
FR9901230A FR2789005B1 (en) 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE
JP11028922A JP2000225558A (en) 1999-01-13 1999-02-05 Polishing pad indicating durable period limit

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB9900721A GB2345657B (en) 1999-01-13 1999-01-13 Lifetime self-indicated polishing pad
DE19902804A DE19902804A1 (en) 1999-01-13 1999-01-25 Lifetime self-indicate polishing pad for chemical mechanical polisher comprises a pad with body having multicolored indicate layers with a top surface
FR9901230A FR2789005B1 (en) 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE
JP11028922A JP2000225558A (en) 1999-01-13 1999-02-05 Polishing pad indicating durable period limit

Publications (2)

Publication Number Publication Date
FR2789005A1 FR2789005A1 (en) 2000-08-04
FR2789005B1 true FR2789005B1 (en) 2001-03-30

Family

ID=27438914

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9901230A Expired - Fee Related FR2789005B1 (en) 1999-01-13 1999-02-03 PHYSICAL-CHEMICAL POLISHING PAD, POLISHING DEVICE USING SUCH A PAD AND METHOD FOR FORMING INSULATION IN A SUBSTRATE

Country Status (4)

Country Link
JP (1) JP2000225558A (en)
DE (1) DE19902804A1 (en)
FR (1) FR2789005B1 (en)
GB (1) GB2345657B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
JP2002239922A (en) * 2001-02-07 2002-08-28 Dainippon Printing Co Ltd Abrasive film
JP4041107B2 (en) 2004-09-22 2008-01-30 株式会社東芝 Polishing method
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
CN107344328B (en) * 2016-05-06 2020-03-10 中芯国际集成电路制造(上海)有限公司 Polishing pad, forming method thereof and polishing monitoring method
JP6822518B2 (en) * 2019-05-14 2021-01-27 株式会社Sumco Polishing pad management method and polishing pad management system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4424203C2 (en) * 1994-07-09 1996-05-09 Wernicke & Co Gmbh Grinding wheel for grinding the edge of spectacle lenses
US5579717A (en) * 1994-10-13 1996-12-03 International Business Machines Corporation Method of grinding thin-film magnetic heads using optical grinding markers
US5733176A (en) * 1996-05-24 1998-03-31 Micron Technology, Inc. Polishing pad and method of use
JPH10100062A (en) * 1996-09-26 1998-04-21 Toshiba Corp Abrasive pad and grinding device
US5736427A (en) * 1996-10-08 1998-04-07 Micron Technology, Inc. Polishing pad contour indicator for mechanical or chemical-mechanical planarization

Also Published As

Publication number Publication date
GB2345657B (en) 2001-08-15
DE19902804A1 (en) 2000-07-27
GB2345657A (en) 2000-07-19
FR2789005A1 (en) 2000-08-04
JP2000225558A (en) 2000-08-15

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Legal Events

Date Code Title Description
ST Notification of lapse