JP2006513573A5 - - Google Patents

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Publication number
JP2006513573A5
JP2006513573A5 JP2004566602A JP2004566602A JP2006513573A5 JP 2006513573 A5 JP2006513573 A5 JP 2006513573A5 JP 2004566602 A JP2004566602 A JP 2004566602A JP 2004566602 A JP2004566602 A JP 2004566602A JP 2006513573 A5 JP2006513573 A5 JP 2006513573A5
Authority
JP
Japan
Prior art keywords
subpad
fixed abrasive
shore
astm
hardness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004566602A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006513573A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2003/041364 external-priority patent/WO2004062849A1/en
Publication of JP2006513573A publication Critical patent/JP2006513573A/ja
Publication of JP2006513573A5 publication Critical patent/JP2006513573A5/ja
Pending legal-status Critical Current

Links

JP2004566602A 2003-01-10 2003-12-23 化学的機械的平坦化用途向けのパッド構成体 Pending JP2006513573A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43931403P 2003-01-10 2003-01-10
PCT/US2003/041364 WO2004062849A1 (en) 2003-01-10 2003-12-23 Pad constructions for chemical mechanical planarization applications

Publications (2)

Publication Number Publication Date
JP2006513573A JP2006513573A (ja) 2006-04-20
JP2006513573A5 true JP2006513573A5 (enExample) 2006-12-28

Family

ID=32713463

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004566602A Pending JP2006513573A (ja) 2003-01-10 2003-12-23 化学的機械的平坦化用途向けのパッド構成体

Country Status (9)

Country Link
US (1) US7163444B2 (enExample)
EP (1) EP1590127A1 (enExample)
JP (1) JP2006513573A (enExample)
KR (1) KR101018942B1 (enExample)
CN (1) CN100551623C (enExample)
AU (1) AU2003297539A1 (enExample)
MY (1) MY136868A (enExample)
TW (1) TWI312305B (enExample)
WO (1) WO2004062849A1 (enExample)

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CA2874456C (en) 2012-05-22 2018-07-03 Wynright Corporation System, method, and apparatus for picking-and-putting product
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US20150038066A1 (en) * 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
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EP2859997B1 (en) * 2013-10-08 2015-09-30 Valentini, Guido Method for manufacturing a polishing pad and polishing pad
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
JP6604472B2 (ja) * 2015-09-29 2019-11-13 富士紡ホールディングス株式会社 研磨パッド
WO2018005767A1 (en) * 2016-06-29 2018-01-04 Saint-Gobain Abrasives, Inc. Abrasive tools and methods for forming same
KR101916119B1 (ko) * 2017-02-06 2019-01-30 주식회사 리온에스엠아이 화학적 기계 연마용 연마패드
USD832898S1 (en) * 2017-02-09 2018-11-06 Global Polishing Systems LLC Material removal/polishing tool
CN107081688A (zh) * 2017-05-27 2017-08-22 江苏省江南新型复合研磨材料及制品工程技术研究中心有限公司 一种高强度高性能的复合研磨片及其制造方法
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
DE112020000934T5 (de) 2019-02-26 2021-11-04 Denka Company Limited Klebefolie zum Rückseitenschleifen und Herstellungsverfahren für Halbleiterwafer
JP7156341B2 (ja) * 2020-07-13 2022-10-19 信越半導体株式会社 片面研磨装置及び片面研磨方法、並びに研磨パッド
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
CN114227530B (zh) * 2021-12-10 2022-05-10 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法

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US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
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