MY136868A - Pad constructions for chemical mechanical planarization applications - Google Patents

Pad constructions for chemical mechanical planarization applications

Info

Publication number
MY136868A
MY136868A MYPI20040007A MYPI20040007A MY136868A MY 136868 A MY136868 A MY 136868A MY PI20040007 A MYPI20040007 A MY PI20040007A MY PI20040007 A MYPI20040007 A MY PI20040007A MY 136868 A MY136868 A MY 136868A
Authority
MY
Malaysia
Prior art keywords
chemical mechanical
mechanical planarization
pad constructions
planarization applications
applications
Prior art date
Application number
MYPI20040007A
Other languages
English (en)
Inventor
Jeffrey Scott Kollodge
Christopher Nicholas Loesch
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of MY136868A publication Critical patent/MY136868A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
MYPI20040007A 2003-01-10 2004-01-02 Pad constructions for chemical mechanical planarization applications MY136868A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US43931403P 2003-01-10 2003-01-10

Publications (1)

Publication Number Publication Date
MY136868A true MY136868A (en) 2008-11-28

Family

ID=32713463

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20040007A MY136868A (en) 2003-01-10 2004-01-02 Pad constructions for chemical mechanical planarization applications

Country Status (9)

Country Link
US (1) US7163444B2 (enExample)
EP (1) EP1590127A1 (enExample)
JP (1) JP2006513573A (enExample)
KR (1) KR101018942B1 (enExample)
CN (1) CN100551623C (enExample)
AU (1) AU2003297539A1 (enExample)
MY (1) MY136868A (enExample)
TW (1) TWI312305B (enExample)
WO (1) WO2004062849A1 (enExample)

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US20080287047A1 (en) * 2007-05-18 2008-11-20 Sang Fang Chemical Industry Co., Ltd. Polishing pad, use thereof and method for making the same
US7815491B2 (en) * 2007-05-29 2010-10-19 San Feng Chemical Industry Co., Ltd. Polishing pad, the use thereof and the method for manufacturing the same
EP2217670A4 (en) * 2007-10-31 2011-07-13 3M Innovative Properties Co COMPOSITION, METHOD AND METHOD FOR POLISHING A WAFER
US7645186B1 (en) * 2008-07-18 2010-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad manufacturing assembly
JP5450622B2 (ja) * 2008-07-18 2014-03-26 スリーエム イノベイティブ プロパティズ カンパニー 浮遊要素を備えた研磨パッド、その製造方法及び使用方法
US8771042B2 (en) 2009-02-02 2014-07-08 3M Innovative Properties Company Optical fiber polishing apparatus
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US8360823B2 (en) * 2010-06-15 2013-01-29 3M Innovative Properties Company Splicing technique for fixed abrasives used in chemical mechanical planarization
CN102601747B (zh) * 2011-01-20 2015-12-09 中芯国际集成电路制造(上海)有限公司 一种研磨垫及其制备方法、使用方法
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
CA2874456C (en) 2012-05-22 2018-07-03 Wynright Corporation System, method, and apparatus for picking-and-putting product
CN102862128B (zh) * 2012-09-20 2015-10-21 北京国瑞升科技股份有限公司 一种凹凸结构磨料制品及其制备方法
US20150038066A1 (en) * 2013-07-31 2015-02-05 Nexplanar Corporation Low density polishing pad
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USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
JP6604472B2 (ja) * 2015-09-29 2019-11-13 富士紡ホールディングス株式会社 研磨パッド
WO2018005767A1 (en) * 2016-06-29 2018-01-04 Saint-Gobain Abrasives, Inc. Abrasive tools and methods for forming same
KR101916119B1 (ko) * 2017-02-06 2019-01-30 주식회사 리온에스엠아이 화학적 기계 연마용 연마패드
USD832898S1 (en) * 2017-02-09 2018-11-06 Global Polishing Systems LLC Material removal/polishing tool
CN107081688A (zh) * 2017-05-27 2017-08-22 江苏省江南新型复合研磨材料及制品工程技术研究中心有限公司 一种高强度高性能的复合研磨片及其制造方法
US11331767B2 (en) 2019-02-01 2022-05-17 Micron Technology, Inc. Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods
KR102743885B1 (ko) * 2019-02-26 2024-12-16 가부시기가이샤 디스코 이면 연삭용 점착 시트 및 반도체 웨이퍼의 제조 방법
JP7156341B2 (ja) * 2020-07-13 2022-10-19 信越半導体株式会社 片面研磨装置及び片面研磨方法、並びに研磨パッド
CN114227530B (zh) * 2021-12-10 2022-05-10 湖北鼎汇微电子材料有限公司 一种抛光垫及半导体器件的制造方法

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Also Published As

Publication number Publication date
KR101018942B1 (ko) 2011-03-02
AU2003297539A1 (en) 2004-08-10
KR20050092396A (ko) 2005-09-21
JP2006513573A (ja) 2006-04-20
US7163444B2 (en) 2007-01-16
CN1738698A (zh) 2006-02-22
WO2004062849A1 (en) 2004-07-29
TW200510114A (en) 2005-03-16
US20040137831A1 (en) 2004-07-15
TWI312305B (en) 2009-07-21
CN100551623C (zh) 2009-10-21
EP1590127A1 (en) 2005-11-02

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