JP2006513573A5 - - Google Patents
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- Publication number
- JP2006513573A5 JP2006513573A5 JP2004566602A JP2004566602A JP2006513573A5 JP 2006513573 A5 JP2006513573 A5 JP 2006513573A5 JP 2004566602 A JP2004566602 A JP 2004566602A JP 2004566602 A JP2004566602 A JP 2004566602A JP 2006513573 A5 JP2006513573 A5 JP 2006513573A5
- Authority
- JP
- Japan
- Prior art keywords
- subpad
- fixed abrasive
- shore
- astm
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005296 abrasive Methods 0.000 claims 3
Claims (1)
- 固定研磨要素と、
弾性要素を含むサブパッドと、
を含む研磨物品であって、前記固定研磨要素が前記サブパッドと共に延存し、かつ前記弾性要素が、ASTM−2240を用いて測定したときに60以下のショアA硬度を有する、研磨物品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43931403P | 2003-01-10 | 2003-01-10 | |
PCT/US2003/041364 WO2004062849A1 (en) | 2003-01-10 | 2003-12-23 | Pad constructions for chemical mechanical planarization applications |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006513573A JP2006513573A (ja) | 2006-04-20 |
JP2006513573A5 true JP2006513573A5 (ja) | 2006-12-28 |
Family
ID=32713463
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004566602A Pending JP2006513573A (ja) | 2003-01-10 | 2003-12-23 | 化学的機械的平坦化用途向けのパッド構成体 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7163444B2 (ja) |
EP (1) | EP1590127A1 (ja) |
JP (1) | JP2006513573A (ja) |
KR (1) | KR101018942B1 (ja) |
CN (1) | CN100551623C (ja) |
AU (1) | AU2003297539A1 (ja) |
MY (1) | MY136868A (ja) |
TW (1) | TWI312305B (ja) |
WO (1) | WO2004062849A1 (ja) |
Families Citing this family (31)
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US7179159B2 (en) * | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
JP2007149949A (ja) * | 2005-11-28 | 2007-06-14 | Roki Techno Co Ltd | デバイスウエハ用の研磨パッド |
US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
US20080233845A1 (en) * | 2007-03-21 | 2008-09-25 | 3M Innovative Properties Company | Abrasive articles, rotationally reciprocating tools, and methods |
US8087975B2 (en) | 2007-04-30 | 2012-01-03 | San Fang Chemical Industry Co., Ltd. | Composite sheet for mounting a workpiece and the method for making the same |
US20080287047A1 (en) * | 2007-05-18 | 2008-11-20 | Sang Fang Chemical Industry Co., Ltd. | Polishing pad, use thereof and method for making the same |
US7815491B2 (en) | 2007-05-29 | 2010-10-19 | San Feng Chemical Industry Co., Ltd. | Polishing pad, the use thereof and the method for manufacturing the same |
JP2011502362A (ja) * | 2007-10-31 | 2011-01-20 | スリーエム イノベイティブ プロパティズ カンパニー | ウエハを研磨するための組成物、方法及びプロセス |
CN102159361B (zh) * | 2008-07-18 | 2014-11-05 | 3M创新有限公司 | 具有浮动单元的抛光垫以及制造和使用该抛光垫的方法 |
US7645186B1 (en) * | 2008-07-18 | 2010-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad manufacturing assembly |
ES2541704T3 (es) | 2009-02-02 | 2015-07-23 | 3M Innovative Properties Company | Aparato de pulido de fibra óptica y método |
TWI510328B (zh) * | 2010-05-03 | 2015-12-01 | Iv Technologies Co Ltd | 基底層、包括此基底層的研磨墊及研磨方法 |
US8360823B2 (en) | 2010-06-15 | 2013-01-29 | 3M Innovative Properties Company | Splicing technique for fixed abrasives used in chemical mechanical planarization |
CN102601747B (zh) * | 2011-01-20 | 2015-12-09 | 中芯国际集成电路制造(上海)有限公司 | 一种研磨垫及其制备方法、使用方法 |
JP5789634B2 (ja) * | 2012-05-14 | 2015-10-07 | 株式会社荏原製作所 | ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法 |
EP2852542B1 (en) | 2012-05-22 | 2022-04-06 | Wynright Corporation | Method for picking-and-putting product |
CN102862128B (zh) | 2012-09-20 | 2015-10-21 | 北京国瑞升科技股份有限公司 | 一种凹凸结构磨料制品及其制备方法 |
US20150038066A1 (en) * | 2013-07-31 | 2015-02-05 | Nexplanar Corporation | Low density polishing pad |
SG11201602207QA (en) | 2013-09-25 | 2016-04-28 | 3M Innovative Properties Co | Multi-layered polishing pads |
EP2859997B1 (en) * | 2013-10-08 | 2015-09-30 | Valentini, Guido | Method for manufacturing a polishing pad and polishing pad |
USD785339S1 (en) * | 2014-10-23 | 2017-05-02 | Griot's Garage, Inc. | Hand applicator buffing pad |
JP6604472B2 (ja) * | 2015-09-29 | 2019-11-13 | 富士紡ホールディングス株式会社 | 研磨パッド |
WO2018005767A1 (en) * | 2016-06-29 | 2018-01-04 | Saint-Gobain Abrasives, Inc. | Abrasive tools and methods for forming same |
KR101916119B1 (ko) * | 2017-02-06 | 2019-01-30 | 주식회사 리온에스엠아이 | 화학적 기계 연마용 연마패드 |
USD832898S1 (en) * | 2017-02-09 | 2018-11-06 | Global Polishing Systems LLC | Material removal/polishing tool |
CN107081688A (zh) * | 2017-05-27 | 2017-08-22 | 江苏省江南新型复合研磨材料及制品工程技术研究中心有限公司 | 一种高强度高性能的复合研磨片及其制造方法 |
US11331767B2 (en) | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
CN113226638B (zh) * | 2019-02-26 | 2023-02-17 | 株式会社迪思科 | 用于磨削背面的胶粘片及半导体晶片的制造方法 |
CN114227530B (zh) * | 2021-12-10 | 2022-05-10 | 湖北鼎汇微电子材料有限公司 | 一种抛光垫及半导体器件的制造方法 |
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US4055897A (en) * | 1976-03-11 | 1977-11-01 | Minnesota Mining And Manufacturing Company | Dental abrading device and method |
US4927432A (en) | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
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CA2134156A1 (en) | 1993-11-22 | 1995-05-23 | Thomas P. Klun | Coatable compositions, abrasive articles made therefrom, and methods of making and using same |
JPH0955362A (ja) | 1995-08-09 | 1997-02-25 | Cypress Semiconductor Corp | スクラッチを減少する集積回路の製造方法 |
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DE60032423T2 (de) | 1999-08-18 | 2007-10-11 | Ebara Corp. | Verfahren und Einrichtung zum Polieren |
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JP2001121405A (ja) * | 1999-10-25 | 2001-05-08 | Matsushita Electric Ind Co Ltd | 研磨パッド |
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JP2001334458A (ja) * | 2000-05-26 | 2001-12-04 | Ebara Corp | ポリッシング方法 |
JP2001345297A (ja) * | 2000-05-30 | 2001-12-14 | Hitachi Ltd | 半導体集積回路装置の製造方法及び研磨装置 |
KR100373846B1 (ko) * | 2000-06-12 | 2003-02-26 | 지앤피테크놀로지 주식회사 | 반도체 및 광학부품용 연마패드 및 그 제조방법 |
US6383066B1 (en) * | 2000-06-23 | 2002-05-07 | International Business Machines Corporation | Multilayered polishing pad, method for fabricating, and use thereof |
JP3797861B2 (ja) * | 2000-09-27 | 2006-07-19 | 株式会社荏原製作所 | ポリッシング装置 |
US6645624B2 (en) * | 2000-11-10 | 2003-11-11 | 3M Innovative Properties Company | Composite abrasive particles and method of manufacture |
US6612916B2 (en) * | 2001-01-08 | 2003-09-02 | 3M Innovative Properties Company | Article suitable for chemical mechanical planarization processes |
US6612917B2 (en) | 2001-02-07 | 2003-09-02 | 3M Innovative Properties Company | Abrasive article suitable for modifying a semiconductor wafer |
US6632129B2 (en) | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
US6817923B2 (en) * | 2001-05-24 | 2004-11-16 | Applied Materials, Inc. | Chemical mechanical processing system with mobile load cup |
JP4693024B2 (ja) * | 2002-04-26 | 2011-06-01 | 東洋ゴム工業株式会社 | 研磨材 |
-
2003
- 2003-12-23 WO PCT/US2003/041364 patent/WO2004062849A1/en active Application Filing
- 2003-12-23 US US10/744,761 patent/US7163444B2/en not_active Expired - Lifetime
- 2003-12-23 JP JP2004566602A patent/JP2006513573A/ja active Pending
- 2003-12-23 EP EP03815249A patent/EP1590127A1/en not_active Withdrawn
- 2003-12-23 KR KR1020057012771A patent/KR101018942B1/ko active IP Right Grant
- 2003-12-23 CN CNB2003801086368A patent/CN100551623C/zh not_active Expired - Fee Related
- 2003-12-23 AU AU2003297539A patent/AU2003297539A1/en not_active Abandoned
-
2004
- 2004-01-02 MY MYPI20040007A patent/MY136868A/en unknown
- 2004-01-05 TW TW093100142A patent/TWI312305B/zh not_active IP Right Cessation
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