JP2005511337A5 - - Google Patents

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Publication number
JP2005511337A5
JP2005511337A5 JP2003552490A JP2003552490A JP2005511337A5 JP 2005511337 A5 JP2005511337 A5 JP 2005511337A5 JP 2003552490 A JP2003552490 A JP 2003552490A JP 2003552490 A JP2003552490 A JP 2003552490A JP 2005511337 A5 JP2005511337 A5 JP 2005511337A5
Authority
JP
Japan
Prior art keywords
channel
backing
polishing layer
extending
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003552490A
Other languages
English (en)
Japanese (ja)
Other versions
JP4405805B2 (ja
JP2005511337A (ja
Filing date
Publication date
Priority claimed from US10/021,161 external-priority patent/US6838149B2/en
Application filed filed Critical
Publication of JP2005511337A publication Critical patent/JP2005511337A/ja
Publication of JP2005511337A5 publication Critical patent/JP2005511337A5/ja
Application granted granted Critical
Publication of JP4405805B2 publication Critical patent/JP4405805B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003552490A 2001-12-13 2002-10-15 導電性材料を蒸着および研磨するための研磨物品 Expired - Fee Related JP4405805B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/021,161 US6838149B2 (en) 2001-12-13 2001-12-13 Abrasive article for the deposition and polishing of a conductive material
PCT/US2002/032864 WO2003051577A1 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Publications (3)

Publication Number Publication Date
JP2005511337A JP2005511337A (ja) 2005-04-28
JP2005511337A5 true JP2005511337A5 (enExample) 2006-01-05
JP4405805B2 JP4405805B2 (ja) 2010-01-27

Family

ID=21802689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003552490A Expired - Fee Related JP4405805B2 (ja) 2001-12-13 2002-10-15 導電性材料を蒸着および研磨するための研磨物品

Country Status (10)

Country Link
US (1) US6838149B2 (enExample)
EP (1) EP1465750A1 (enExample)
JP (1) JP4405805B2 (enExample)
KR (1) KR100926198B1 (enExample)
CN (1) CN100450716C (enExample)
AU (1) AU2002335025A1 (enExample)
IL (1) IL161977A0 (enExample)
MY (1) MY138955A (enExample)
TW (1) TWI229153B (enExample)
WO (1) WO2003051577A1 (enExample)

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CN102107397B (zh) 2009-12-25 2015-02-04 3M新设资产公司 研磨砂轮的制造方法及研磨砂轮
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CN102233540B (zh) * 2011-04-12 2013-05-29 安泰科技股份有限公司 一种珩磨条及其制造方法
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
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BR112016024547A2 (pt) 2014-04-21 2017-08-15 3M Innovative Properties Co partículas abrasivas e artigos abrasivos incluindo as mesmas
JP6838811B2 (ja) * 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
KR101520743B1 (ko) * 2014-05-16 2015-05-18 코닝정밀소재 주식회사 발광 다이오드 패키지 제조방법
US9764449B2 (en) 2014-05-29 2017-09-19 Saint-Gobain Abrasives, Inc. Abrasive article having a core including a polymer material
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN107078048B (zh) * 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10252200B2 (en) 2016-02-17 2019-04-09 Hollingsworth & Vose Company Filter media including a filtration layer comprising synthetic fibers
US11014030B2 (en) 2016-02-17 2021-05-25 Hollingsworth & Vose Company Filter media including flame retardant fibers
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111565892A (zh) 2017-12-29 2020-08-21 圣戈班磨料磨具公司 磨料抛光制品
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112934133B (zh) * 2021-03-15 2023-10-31 乌鲁木齐益好天成新型节能材料有限公司 一种改性固相硅凝胶的制备方法
CN114211411B (zh) * 2021-12-28 2022-09-13 江苏华东砂轮有限公司 一种大尺寸单晶硅片超精密加工抛光砂轮及其制备方法
CN114952642B (zh) * 2022-06-15 2023-10-31 安徽禾臣新材料有限公司 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺
CN115813129A (zh) * 2022-11-22 2023-03-21 金牌厨柜家居科技股份有限公司 一种复合金属和下扣条的石英石台面制作工艺
CN117655911B (zh) * 2024-01-04 2025-04-15 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法

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