WO2002014018A3 - Abrasive pad for cmp - Google Patents

Abrasive pad for cmp Download PDF

Info

Publication number
WO2002014018A3
WO2002014018A3 PCT/US2001/025006 US0125006W WO0214018A3 WO 2002014018 A3 WO2002014018 A3 WO 2002014018A3 US 0125006 W US0125006 W US 0125006W WO 0214018 A3 WO0214018 A3 WO 0214018A3
Authority
WO
WIPO (PCT)
Prior art keywords
abrasive
cmp
substrate
abrasive pad
abrasive layer
Prior art date
Application number
PCT/US2001/025006
Other languages
French (fr)
Other versions
WO2002014018A2 (en
Inventor
Takashi Amano
Toshihiko Watase
Kengo Imamura
Original Assignee
3M Innovative Properties Co
Takashi Amano
Toshihiko Watase
Kengo Imamura
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co, Takashi Amano, Toshihiko Watase, Kengo Imamura filed Critical 3M Innovative Properties Co
Priority to EP01962017A priority Critical patent/EP1309424A2/en
Priority to US10/313,000 priority patent/US6776699B2/en
Priority to KR10-2003-7002029A priority patent/KR20030022388A/en
Priority to BR0113207-5A priority patent/BR0113207A/en
Priority to CA002416549A priority patent/CA2416549A1/en
Priority to AU2001283235A priority patent/AU2001283235A1/en
Publication of WO2002014018A2 publication Critical patent/WO2002014018A2/en
Publication of WO2002014018A3 publication Critical patent/WO2002014018A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

An abrasive pad for CMP has a substrate (12) and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements (II) having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.
PCT/US2001/025006 2000-08-14 2001-08-09 Abrasive pad for cmp WO2002014018A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP01962017A EP1309424A2 (en) 2000-08-14 2001-08-09 Abrasive pad for cmp
US10/313,000 US6776699B2 (en) 2000-08-14 2001-08-09 Abrasive pad for CMP
KR10-2003-7002029A KR20030022388A (en) 2000-08-14 2001-08-09 Abrasive Pad for CMP
BR0113207-5A BR0113207A (en) 2000-08-14 2001-08-09 Method to use an abrasive body for cmp
CA002416549A CA2416549A1 (en) 2000-08-14 2001-08-09 Abrasive pad for cmp
AU2001283235A AU2001283235A1 (en) 2000-08-14 2001-08-09 Abrasive pad for CMP

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000245793A JP2002057130A (en) 2000-08-14 2000-08-14 Polishing pad for cmp
JP2000-245793 2000-08-14

Publications (2)

Publication Number Publication Date
WO2002014018A2 WO2002014018A2 (en) 2002-02-21
WO2002014018A3 true WO2002014018A3 (en) 2002-05-23

Family

ID=18736249

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/025006 WO2002014018A2 (en) 2000-08-14 2001-08-09 Abrasive pad for cmp

Country Status (9)

Country Link
EP (1) EP1309424A2 (en)
JP (1) JP2002057130A (en)
KR (1) KR20030022388A (en)
CN (1) CN1179825C (en)
AU (1) AU2001283235A1 (en)
BR (1) BR0113207A (en)
CA (1) CA2416549A1 (en)
TW (1) TWI233384B (en)
WO (1) WO2002014018A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6843815B1 (en) * 2003-09-04 2005-01-18 3M Innovative Properties Company Coated abrasive articles and method of abrading
US7267700B2 (en) 2003-09-23 2007-09-11 3M Innovative Properties Company Structured abrasive with parabolic sides
US20050060942A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Structured abrasive article
US7300479B2 (en) 2003-09-23 2007-11-27 3M Innovative Properties Company Compositions for abrasive articles
US7524345B2 (en) 2005-02-22 2009-04-28 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7867302B2 (en) 2005-02-22 2011-01-11 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7875091B2 (en) 2005-02-22 2011-01-25 Saint-Gobain Abrasives, Inc. Rapid tooling system and methods for manufacturing abrasive articles
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US8591764B2 (en) * 2006-12-20 2013-11-26 3M Innovative Properties Company Chemical mechanical planarization composition, system, and method of use
CN102101263A (en) * 2009-12-18 2011-06-22 安集微电子（上海）有限公司 Chemically mechanical polishing method
BR112013001831B8 (en) * 2010-08-04 2021-05-04 3M Innovative Properties Co shaped abrasive particles
JP2013049112A (en) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology Polishing pad and manufacturing method thereof
KR101389572B1 (en) * 2012-04-23 2014-04-29 주식회사 디어포스 Abrasive article
RU2614488C2 (en) * 2012-10-15 2017-03-28 Сен-Гобен Абразивс, Инк. Abrasive particles, having certain shapes, and methods of such particles forming
US10160092B2 (en) * 2013-03-14 2018-12-25 Cabot Microelectronics Corporation Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
JP5953328B2 (en) * 2014-02-27 2016-07-20 株式会社アライドマテリアル MOUNTING MATERIAL, WORK PROCESSING METHOD USING THE SAME AND MOUNTING BODY FOR FLAT
WO2016047535A1 (en) * 2014-09-26 2016-03-31 バンドー化学株式会社 Polishing pad and method for producing polishing pad
US10086500B2 (en) * 2014-12-18 2018-10-02 Applied Materials, Inc. Method of manufacturing a UV curable CMP polishing pad
JP6602629B2 (en) * 2015-10-02 2019-11-06 富士紡ホールディングス株式会社 Polishing brush
WO2018221290A1 (en) * 2017-06-01 2018-12-06 東京エレクトロン株式会社 Gettering layer forming device, gettering layer forming method, and computer storage medium
JP2019136815A (en) * 2018-02-09 2019-08-22 株式会社ディスコ Resin bond grindstone manufacturing method
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
JP7368492B2 (en) * 2019-04-09 2023-10-24 インテグリス・インコーポレーテッド Disk segment design
US20210299816A1 (en) * 2020-03-25 2021-09-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with protruding structures having engineered open void space
KR102570825B1 (en) * 2020-07-16 2023-08-28 한국생산기술연구원 Polishing pad including porous protruding pattern and polishing apparatus including the same
CN112276806B (en) * 2020-10-26 2022-02-08 东莞金太阳研磨股份有限公司 Dry-wet dual-purpose sand paper coating sizing material and preparation method and application thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993024680A1 (en) * 1992-06-02 1993-12-09 Sumitomo Chemical Company, Limited PROCESS FOR PRODUCING α-ALUMINA
JPH06191836A (en) * 1992-06-02 1994-07-12 Sumitomo Chem Co Ltd Alpha-alumina
WO1997011484A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06191833A (en) * 1992-06-02 1994-07-12 Sumitomo Chem Co Ltd Alpha-alumina
JPH07206432A (en) * 1993-11-25 1995-08-08 Sumitomo Chem Co Ltd Alpha-alumina powder and its production

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993024680A1 (en) * 1992-06-02 1993-12-09 Sumitomo Chemical Company, Limited PROCESS FOR PRODUCING α-ALUMINA
JPH06191836A (en) * 1992-06-02 1994-07-12 Sumitomo Chem Co Ltd Alpha-alumina
WO1997011484A1 (en) * 1995-09-22 1997-03-27 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
JPH11512874A (en) * 1995-09-22 1999-11-02 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー Method for modifying exposed surface of semiconductor wafer

Also Published As

Publication number Publication date
TWI233384B (en) 2005-06-01
WO2002014018A2 (en) 2002-02-21
KR20030022388A (en) 2003-03-15
CN1447735A (en) 2003-10-08
AU2001283235A1 (en) 2002-02-25
BR0113207A (en) 2003-07-01
CN1179825C (en) 2004-12-15
EP1309424A2 (en) 2003-05-14
CA2416549A1 (en) 2002-02-21
JP2002057130A (en) 2002-02-22

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