TWI229153B - Abrasive article for the deposition and polishing of a conductive material - Google Patents
Abrasive article for the deposition and polishing of a conductive material Download PDFInfo
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- TWI229153B TWI229153B TW091132769A TW91132769A TWI229153B TW I229153 B TWI229153 B TW I229153B TW 091132769 A TW091132769 A TW 091132769A TW 91132769 A TW91132769 A TW 91132769A TW I229153 B TWI229153 B TW I229153B
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- abrasive article
- abrasive
- layer
- item
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- 238000005498 polishing Methods 0.000 title claims abstract description 73
- 239000004020 conductor Substances 0.000 title claims abstract description 22
- 230000008021 deposition Effects 0.000 title abstract description 11
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- 239000000853 adhesive Substances 0.000 claims description 33
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- 238000000151 deposition Methods 0.000 claims description 17
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/02—Backings, e.g. foils, webs, mesh fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
- Y10T428/24322—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/021,161 US6838149B2 (en) | 2001-12-13 | 2001-12-13 | Abrasive article for the deposition and polishing of a conductive material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200300805A TW200300805A (en) | 2003-06-16 |
| TWI229153B true TWI229153B (en) | 2005-03-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091132769A TWI229153B (en) | 2001-12-13 | 2002-11-07 | Abrasive article for the deposition and polishing of a conductive material |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6838149B2 (enExample) |
| EP (1) | EP1465750A1 (enExample) |
| JP (1) | JP4405805B2 (enExample) |
| KR (1) | KR100926198B1 (enExample) |
| CN (1) | CN100450716C (enExample) |
| AU (1) | AU2002335025A1 (enExample) |
| IL (1) | IL161977A0 (enExample) |
| MY (1) | MY138955A (enExample) |
| TW (1) | TWI229153B (enExample) |
| WO (1) | WO2003051577A1 (enExample) |
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| GB0418633D0 (en) * | 2004-08-20 | 2004-09-22 | 3M Innovative Properties Co | Method of making abrasive article |
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| JP5448289B2 (ja) * | 2006-06-15 | 2014-03-19 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨ディスク |
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| US20090191376A1 (en) * | 2008-01-30 | 2009-07-30 | 3M Innovative Properties Company | Method, apparatus, and system using adapter assembly for modifying surfaces |
| US20140234639A1 (en) * | 2013-02-21 | 2014-08-21 | Prakash B Malla | Self binding nano particle mineral pigment |
| US8083828B2 (en) * | 2009-06-19 | 2011-12-27 | Hollingsworth & Vose Company | Fiber web having a high stiffness |
| CN102107397B (zh) | 2009-12-25 | 2015-02-04 | 3M新设资产公司 | 研磨砂轮的制造方法及研磨砂轮 |
| JP2013514159A (ja) * | 2009-12-29 | 2013-04-25 | サンーゴバン アブレイシブズ，インコーポレイティド | 家庭用品表面の清掃方法 |
| CN102233540B (zh) * | 2011-04-12 | 2013-05-29 | 安泰科技股份有限公司 | 一种珩磨条及其制造方法 |
| US8888877B2 (en) * | 2012-05-11 | 2014-11-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Forming alkaline-earth metal oxide polishing pad |
| US9073172B2 (en) * | 2012-05-11 | 2015-07-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Alkaline-earth metal oxide-polymeric polishing pad |
| US9421666B2 (en) | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
| BR112016024547A2 (pt) | 2014-04-21 | 2017-08-15 | 3M Innovative Properties Co | partículas abrasivas e artigos abrasivos incluindo as mesmas |
| JP6838811B2 (ja) * | 2014-05-02 | 2021-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 断続的構造化研磨物品並びに被加工物の研磨方法 |
| KR101520743B1 (ko) * | 2014-05-16 | 2015-05-18 | 코닝정밀소재 주식회사 | 발광 다이오드 패키지 제조방법 |
| US9764449B2 (en) | 2014-05-29 | 2017-09-19 | Saint-Gobain Abrasives, Inc. | Abrasive article having a core including a polymer material |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| CN107078048B (zh) * | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| WO2017066077A1 (en) * | 2015-10-16 | 2017-04-20 | Applied Materials, Inc. | Method and apparatus for forming advanced polishing pads using an additive manufacturing process |
| KR20230169424A (ko) | 2015-10-30 | 2023-12-15 | 어플라이드 머티어리얼스, 인코포레이티드 | 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법 |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10252200B2 (en) | 2016-02-17 | 2019-04-09 | Hollingsworth & Vose Company | Filter media including a filtration layer comprising synthetic fibers |
| US11014030B2 (en) | 2016-02-17 | 2021-05-25 | Hollingsworth & Vose Company | Filter media including flame retardant fibers |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
| CN111565892A (zh) | 2017-12-29 | 2020-08-21 | 圣戈班磨料磨具公司 | 磨料抛光制品 |
| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
| US20220212314A1 (en) * | 2019-04-15 | 2022-07-07 | Arizona Board Of Regents On Behalf Of The University Of Arizona | Pitch layer pad for smoothing optical surfaces |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
| CN112934133B (zh) * | 2021-03-15 | 2023-10-31 | 乌鲁木齐益好天成新型节能材料有限公司 | 一种改性固相硅凝胶的制备方法 |
| CN114211411B (zh) * | 2021-12-28 | 2022-09-13 | 江苏华东砂轮有限公司 | 一种大尺寸单晶硅片超精密加工抛光砂轮及其制备方法 |
| CN114952642B (zh) * | 2022-06-15 | 2023-10-31 | 安徽禾臣新材料有限公司 | 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺 |
| CN115813129A (zh) * | 2022-11-22 | 2023-03-21 | 金牌厨柜家居科技股份有限公司 | 一种复合金属和下扣条的石英石台面制作工艺 |
| CN117655911B (zh) * | 2024-01-04 | 2025-04-15 | 郑州海科研磨工具有限公司 | 一种阵列结构树脂结合剂研磨垫及其制备方法 |
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-
2001
- 2001-12-13 US US10/021,161 patent/US6838149B2/en not_active Expired - Fee Related
-
2002
- 2002-10-15 AU AU2002335025A patent/AU2002335025A1/en not_active Abandoned
- 2002-10-15 KR KR1020047009148A patent/KR100926198B1/ko not_active Expired - Fee Related
- 2002-10-15 JP JP2003552490A patent/JP4405805B2/ja not_active Expired - Fee Related
- 2002-10-15 EP EP02805057A patent/EP1465750A1/en not_active Withdrawn
- 2002-10-15 CN CNB02825001XA patent/CN100450716C/zh not_active Expired - Fee Related
- 2002-10-15 IL IL16197702A patent/IL161977A0/xx unknown
- 2002-10-15 WO PCT/US2002/032864 patent/WO2003051577A1/en not_active Ceased
- 2002-11-07 TW TW091132769A patent/TWI229153B/zh not_active IP Right Cessation
- 2002-11-13 MY MYPI20024245A patent/MY138955A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1604834A (zh) | 2005-04-06 |
| KR100926198B1 (ko) | 2009-11-09 |
| KR20040062681A (ko) | 2004-07-07 |
| US20030113509A1 (en) | 2003-06-19 |
| WO2003051577A1 (en) | 2003-06-26 |
| AU2002335025A1 (en) | 2003-06-30 |
| JP4405805B2 (ja) | 2010-01-27 |
| JP2005511337A (ja) | 2005-04-28 |
| US6838149B2 (en) | 2005-01-04 |
| MY138955A (en) | 2009-08-28 |
| IL161977A0 (en) | 2005-11-20 |
| CN100450716C (zh) | 2009-01-14 |
| TW200300805A (en) | 2003-06-16 |
| EP1465750A1 (en) | 2004-10-13 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |