JP4405805B2 - 導電性材料を蒸着および研磨するための研磨物品 - Google Patents

導電性材料を蒸着および研磨するための研磨物品 Download PDF

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Publication number
JP4405805B2
JP4405805B2 JP2003552490A JP2003552490A JP4405805B2 JP 4405805 B2 JP4405805 B2 JP 4405805B2 JP 2003552490 A JP2003552490 A JP 2003552490A JP 2003552490 A JP2003552490 A JP 2003552490A JP 4405805 B2 JP4405805 B2 JP 4405805B2
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JP
Japan
Prior art keywords
abrasive
channel
abrasive article
polishing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003552490A
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English (en)
Japanese (ja)
Other versions
JP2005511337A5 (enExample
JP2005511337A (ja
Inventor
エス． ラッグ，ポール
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2005511337A publication Critical patent/JP2005511337A/ja
Publication of JP2005511337A5 publication Critical patent/JP2005511337A5/ja
Application granted granted Critical
Publication of JP4405805B2 publication Critical patent/JP4405805B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2003552490A 2001-12-13 2002-10-15 導電性材料を蒸着および研磨するための研磨物品 Expired - Fee Related JP4405805B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/021,161 US6838149B2 (en) 2001-12-13 2001-12-13 Abrasive article for the deposition and polishing of a conductive material
PCT/US2002/032864 WO2003051577A1 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Publications (3)

Publication Number Publication Date
JP2005511337A JP2005511337A (ja) 2005-04-28
JP2005511337A5 JP2005511337A5 (enExample) 2006-01-05
JP4405805B2 true JP4405805B2 (ja) 2010-01-27

Family

ID=21802689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003552490A Expired - Fee Related JP4405805B2 (ja) 2001-12-13 2002-10-15 導電性材料を蒸着および研磨するための研磨物品

Country Status (10)

Country Link
US (1) US6838149B2 (enExample)
EP (1) EP1465750A1 (enExample)
JP (1) JP4405805B2 (enExample)
KR (1) KR100926198B1 (enExample)
CN (1) CN100450716C (enExample)
AU (1) AU2002335025A1 (enExample)
IL (1) IL161977A0 (enExample)
MY (1) MY138955A (enExample)
TW (1) TWI229153B (enExample)
WO (1) WO2003051577A1 (enExample)

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CN102990530B (zh) * 2006-07-14 2016-02-10 圣戈本磨料股份有限公司 无背衬研磨制品
US7820068B2 (en) * 2007-02-21 2010-10-26 Houghton Technical Corp. Chemical assisted lapping and polishing of metals
US20090191376A1 (en) * 2008-01-30 2009-07-30 3M Innovative Properties Company Method, apparatus, and system using adapter assembly for modifying surfaces
US20140234639A1 (en) * 2013-02-21 2014-08-21 Prakash B Malla Self binding nano particle mineral pigment
US8083828B2 (en) * 2009-06-19 2011-12-27 Hollingsworth & Vose Company Fiber web having a high stiffness
CN102107397B (zh) 2009-12-25 2015-02-04 3M新设资产公司 研磨砂轮的制造方法及研磨砂轮
JP2013514159A (ja) * 2009-12-29 2013-04-25 サンーゴバン アブレイシブズ，インコーポレイティド 家庭用品表面の清掃方法
CN102233540B (zh) * 2011-04-12 2013-05-29 安泰科技股份有限公司 一种珩磨条及其制造方法
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
BR112016024547A2 (pt) 2014-04-21 2017-08-15 3M Innovative Properties Co partículas abrasivas e artigos abrasivos incluindo as mesmas
JP6838811B2 (ja) * 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
KR101520743B1 (ko) * 2014-05-16 2015-05-18 코닝정밀소재 주식회사 발광 다이오드 패키지 제조방법
US9764449B2 (en) 2014-05-29 2017-09-19 Saint-Gobain Abrasives, Inc. Abrasive article having a core including a polymer material
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN107078048B (zh) * 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10252200B2 (en) 2016-02-17 2019-04-09 Hollingsworth & Vose Company Filter media including a filtration layer comprising synthetic fibers
US11014030B2 (en) 2016-02-17 2021-05-25 Hollingsworth & Vose Company Filter media including flame retardant fibers
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111565892A (zh) 2017-12-29 2020-08-21 圣戈班磨料磨具公司 磨料抛光制品
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112934133B (zh) * 2021-03-15 2023-10-31 乌鲁木齐益好天成新型节能材料有限公司 一种改性固相硅凝胶的制备方法
CN114211411B (zh) * 2021-12-28 2022-09-13 江苏华东砂轮有限公司 一种大尺寸单晶硅片超精密加工抛光砂轮及其制备方法
CN114952642B (zh) * 2022-06-15 2023-10-31 安徽禾臣新材料有限公司 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺
CN115813129A (zh) * 2022-11-22 2023-03-21 金牌厨柜家居科技股份有限公司 一种复合金属和下扣条的石英石台面制作工艺
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Also Published As

Publication number Publication date
CN1604834A (zh) 2005-04-06
KR100926198B1 (ko) 2009-11-09
KR20040062681A (ko) 2004-07-07
TWI229153B (en) 2005-03-11
US20030113509A1 (en) 2003-06-19
WO2003051577A1 (en) 2003-06-26
AU2002335025A1 (en) 2003-06-30
JP2005511337A (ja) 2005-04-28
US6838149B2 (en) 2005-01-04
MY138955A (en) 2009-08-28
IL161977A0 (en) 2005-11-20
CN100450716C (zh) 2009-01-14
TW200300805A (en) 2003-06-16
EP1465750A1 (en) 2004-10-13

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