AU2002335025A1 - Abrasive article for the deposition and polishing of a conductive material - Google Patents

Abrasive article for the deposition and polishing of a conductive material

Info

Publication number
AU2002335025A1
AU2002335025A1 AU2002335025A AU2002335025A AU2002335025A1 AU 2002335025 A1 AU2002335025 A1 AU 2002335025A1 AU 2002335025 A AU2002335025 A AU 2002335025A AU 2002335025 A AU2002335025 A AU 2002335025A AU 2002335025 A1 AU2002335025 A1 AU 2002335025A1
Authority
AU
Australia
Prior art keywords
polishing
deposition
conductive material
abrasive article
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002335025A
Other languages
English (en)
Inventor
Paul S. Lugg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2002335025A1 publication Critical patent/AU2002335025A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2002335025A 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material Abandoned AU2002335025A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/021,161 US6838149B2 (en) 2001-12-13 2001-12-13 Abrasive article for the deposition and polishing of a conductive material
US10/021,161 2001-12-13
PCT/US2002/032864 WO2003051577A1 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Publications (1)

Publication Number Publication Date
AU2002335025A1 true AU2002335025A1 (en) 2003-06-30

Family

ID=21802689

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002335025A Abandoned AU2002335025A1 (en) 2001-12-13 2002-10-15 Abrasive article for the deposition and polishing of a conductive material

Country Status (10)

Country Link
US (1) US6838149B2 (enExample)
EP (1) EP1465750A1 (enExample)
JP (1) JP4405805B2 (enExample)
KR (1) KR100926198B1 (enExample)
CN (1) CN100450716C (enExample)
AU (1) AU2002335025A1 (enExample)
IL (1) IL161977A0 (enExample)
MY (1) MY138955A (enExample)
TW (1) TWI229153B (enExample)
WO (1) WO2003051577A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0411268D0 (en) * 2004-05-20 2004-06-23 3M Innovative Properties Co Method for making a moulded abrasive article
US6958002B1 (en) * 2004-07-19 2005-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with flow modifying groove network
GB0418633D0 (en) * 2004-08-20 2004-09-22 3M Innovative Properties Co Method of making abrasive article
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
JP5448289B2 (ja) * 2006-06-15 2014-03-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨ディスク
CN102990530B (zh) * 2006-07-14 2016-02-10 圣戈本磨料股份有限公司 无背衬研磨制品
US7820068B2 (en) * 2007-02-21 2010-10-26 Houghton Technical Corp. Chemical assisted lapping and polishing of metals
US20090191376A1 (en) * 2008-01-30 2009-07-30 3M Innovative Properties Company Method, apparatus, and system using adapter assembly for modifying surfaces
US20140234639A1 (en) * 2013-02-21 2014-08-21 Prakash B Malla Self binding nano particle mineral pigment
US8083828B2 (en) * 2009-06-19 2011-12-27 Hollingsworth & Vose Company Fiber web having a high stiffness
CN102107397B (zh) 2009-12-25 2015-02-04 3M新设资产公司 研磨砂轮的制造方法及研磨砂轮
JP2013514159A (ja) * 2009-12-29 2013-04-25 サンーゴバン アブレイシブズ，インコーポレイティド 家庭用品表面の清掃方法
CN102233540B (zh) * 2011-04-12 2013-05-29 安泰科技股份有限公司 一种珩磨条及其制造方法
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
BR112016024547A2 (pt) 2014-04-21 2017-08-15 3M Innovative Properties Co partículas abrasivas e artigos abrasivos incluindo as mesmas
JP6838811B2 (ja) * 2014-05-02 2021-03-03 スリーエム イノベイティブ プロパティズ カンパニー 断続的構造化研磨物品並びに被加工物の研磨方法
KR101520743B1 (ko) * 2014-05-16 2015-05-18 코닝정밀소재 주식회사 발광 다이오드 패키지 제조방법
US9764449B2 (en) 2014-05-29 2017-09-19 Saint-Gobain Abrasives, Inc. Abrasive article having a core including a polymer material
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN107078048B (zh) * 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
WO2017066077A1 (en) * 2015-10-16 2017-04-20 Applied Materials, Inc. Method and apparatus for forming advanced polishing pads using an additive manufacturing process
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10252200B2 (en) 2016-02-17 2019-04-09 Hollingsworth & Vose Company Filter media including a filtration layer comprising synthetic fibers
US11014030B2 (en) 2016-02-17 2021-05-25 Hollingsworth & Vose Company Filter media including flame retardant fibers
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN111565892A (zh) 2017-12-29 2020-08-21 圣戈班磨料磨具公司 磨料抛光制品
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US20220212314A1 (en) * 2019-04-15 2022-07-07 Arizona Board Of Regents On Behalf Of The University Of Arizona Pitch layer pad for smoothing optical surfaces
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN112934133B (zh) * 2021-03-15 2023-10-31 乌鲁木齐益好天成新型节能材料有限公司 一种改性固相硅凝胶的制备方法
CN114211411B (zh) * 2021-12-28 2022-09-13 江苏华东砂轮有限公司 一种大尺寸单晶硅片超精密加工抛光砂轮及其制备方法
CN114952642B (zh) * 2022-06-15 2023-10-31 安徽禾臣新材料有限公司 一种蓝宝石防护盖板抛光用阻尼布及其生产工艺
CN115813129A (zh) * 2022-11-22 2023-03-21 金牌厨柜家居科技股份有限公司 一种复合金属和下扣条的石英石台面制作工艺
CN117655911B (zh) * 2024-01-04 2025-04-15 郑州海科研磨工具有限公司 一种阵列结构树脂结合剂研磨垫及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4314827A (en) * 1979-06-29 1982-02-09 Minnesota Mining And Manufacturing Company Non-fused aluminum oxide-based abrasive mineral
US4623364A (en) * 1984-03-23 1986-11-18 Norton Company Abrasive material and method for preparing the same
CA1254238A (en) * 1985-04-30 1989-05-16 Alvin P. Gerk Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products
US4652274A (en) * 1985-08-07 1987-03-24 Minnesota Mining And Manufacturing Company Coated abrasive product having radiation curable binder
US4770671A (en) * 1985-12-30 1988-09-13 Minnesota Mining And Manufacturing Company Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith
US4881951A (en) * 1987-05-27 1989-11-21 Minnesota Mining And Manufacturing Co. Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
US4903440A (en) * 1988-11-23 1990-02-27 Minnesota Mining And Manufacturing Company Abrasive product having binder comprising an aminoplast resin
US5061294A (en) * 1989-05-15 1991-10-29 Minnesota Mining And Manufacturing Company Abrasive article with conductive, doped, conjugated, polymer coat and method of making same
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5137542A (en) * 1990-08-08 1992-08-11 Minnesota Mining And Manufacturing Company Abrasive printed with an electrically conductive ink
US5152917B1 (en) * 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5236472A (en) * 1991-02-22 1993-08-17 Minnesota Mining And Manufacturing Company Abrasive product having a binder comprising an aminoplast binder
US5196353A (en) * 1992-01-03 1993-03-23 Micron Technology, Inc. Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer
US5203884A (en) * 1992-06-04 1993-04-20 Minnesota Mining And Manufacturing Company Abrasive article having vanadium oxide incorporated therein
US5378252A (en) * 1993-09-03 1995-01-03 Minnesota Mining And Manufacturing Company Abrasive articles
US5433651A (en) * 1993-12-22 1995-07-18 International Business Machines Corporation In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
JP3313505B2 (ja) * 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5658185A (en) * 1995-10-25 1997-08-19 International Business Machines Corporation Chemical-mechanical polishing apparatus with slurry removal system and method
US5609517A (en) * 1995-11-20 1997-03-11 International Business Machines Corporation Composite polishing pad
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
CA2287404C (en) 1997-04-30 2007-10-16 David A. Kaisaki Method of planarizing the upper surface of a semiconductor wafer
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
US6106371A (en) * 1997-10-30 2000-08-22 Lsi Logic Corporation Effective pad conditioning
US6251235B1 (en) 1999-03-30 2001-06-26 Nutool, Inc. Apparatus for forming an electrical contact with a semiconductor substrate
US6103628A (en) * 1998-12-01 2000-08-15 Nutool, Inc. Reverse linear polisher with loadable housing
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6179887B1 (en) * 1999-02-17 2001-01-30 3M Innovative Properties Company Method for making an abrasive article and abrasive articles thereof
US6692588B1 (en) 1999-07-12 2004-02-17 Nutool, Inc. Method and apparatus for simultaneously cleaning and annealing a workpiece
JP2001150333A (ja) * 1999-11-29 2001-06-05 Nec Corp 研磨パッド
EP1284842B1 (en) * 2000-05-27 2005-10-19 Rohm and Haas Electronic Materials CMP Holdings, Inc. Polishing pads for chemical mechanical planarization
US7201829B2 (en) * 2001-03-01 2007-04-10 Novellus Systems, Inc. Mask plate design
US7238092B2 (en) * 2001-09-28 2007-07-03 Novellus Systems, Inc. Low-force electrochemical mechanical processing method and apparatus
CN1646263A (zh) * 2001-11-02 2005-07-27 Asm纳托尔公司 具有可前移的清扫器的电化学机械加工

Also Published As

Publication number Publication date
CN1604834A (zh) 2005-04-06
KR100926198B1 (ko) 2009-11-09
KR20040062681A (ko) 2004-07-07
TWI229153B (en) 2005-03-11
US20030113509A1 (en) 2003-06-19
WO2003051577A1 (en) 2003-06-26
JP4405805B2 (ja) 2010-01-27
JP2005511337A (ja) 2005-04-28
US6838149B2 (en) 2005-01-04
MY138955A (en) 2009-08-28
IL161977A0 (en) 2005-11-20
CN100450716C (zh) 2009-01-14
TW200300805A (en) 2003-06-16
EP1465750A1 (en) 2004-10-13

Similar Documents

Publication Publication Date Title
AU2002335025A1 (en) Abrasive article for the deposition and polishing of a conductive material
AU2688599A (en) Resilient abrasive article with hard anti-loading size coating
AU4365100A (en) Abrasive article suitable for abrading glass and glass ceramic workpieces
AU2002246872A1 (en) Abrasive articles having a polymeric material
AU2113901A (en) Production of layered engineered abrasive surfaces
AU2002319749A1 (en) Ceramic materials, abrasive particles, abrasive articles, and methods of making and using the same
AU1371899A (en) Abrasive article containing a grinding aid and method of making the same
AU5546199A (en) Abrasive article for providing a clear surface finish on glass
AU3779799A (en) Abrasive article comprising a barrier coating
AU2036300A (en) Tearable abrasive article
AU2001294082A1 (en) Polycrystalline abrasive grit
GB0122153D0 (en) Abrasive articles
AU2001241692A1 (en) Coated abrasive having laminate backing material and method of making the same
AUPR373901A0 (en) An article having an erodynamic surface
AU2273001A (en) Abrasive surface and article and methods for making them
AU2002225682A1 (en) Methods and materials for the manufacture of a solid surface article
AU2003275655A1 (en) Polishing slurry and polished substrate
AU2003205971A1 (en) Coated diamond particles
AU2001278768A1 (en) Diamond abrasive material particles and production method therefor
GB2382818B (en) Polishing composition for a magnetic disc substrate and polishing process using the same
AU2002241826A1 (en) Abrasive particles that include a polymeric material and abrasive articles made from them
HK1071710A (en) Abrasive article for the deposition and polishing of a conductive material
AU2003298978A1 (en) Process for finishing the surface of an article and article thus obtained
AU1082301A (en) Flexible abrasive article releasing low amounts of contaminants
AU2003209244A1 (en) Abrasive article with hydrophilic/lipophilic coating

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase