JP2004515610A5 - - Google Patents

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Publication number
JP2004515610A5
JP2004515610A5 JP2002549457A JP2002549457A JP2004515610A5 JP 2004515610 A5 JP2004515610 A5 JP 2004515610A5 JP 2002549457 A JP2002549457 A JP 2002549457A JP 2002549457 A JP2002549457 A JP 2002549457A JP 2004515610 A5 JP2004515610 A5 JP 2004515610A5
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JP
Japan
Prior art keywords
wiring board
printed wiring
layer
laminate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002549457A
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English (en)
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JP2004515610A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2001/048199 external-priority patent/WO2002047899A1/en
Publication of JP2004515610A publication Critical patent/JP2004515610A/ja
Publication of JP2004515610A5 publication Critical patent/JP2004515610A5/ja
Withdrawn legal-status Critical Current

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Description

【特許請求の範囲】
【請求項１】 導電性及び熱伝導性をもつ積層品；
前記導電性及び熱伝導性をもつ積層品より上に配置された第１の誘電体層；及び
前記導電性及び熱伝導性をもつ積層品より下に配置された第２の誘電体層、
を含んでなる、プリント配線板。
【請求項２】 前記導電性及び熱伝導性をもつ積層品は１ＭＨｚで６．０を上回る誘電率を有し、
前記第１の誘電体層及び第２の誘導体層は１ＭＨｚで６．０未満の誘電率を有する、請求項１に記載のプリント配線板。
【請求項３】 前記導電性及び熱伝導性をもつ積層品は、
導電性及び熱伝導性をもつ樹脂が含浸された基材を含むプリプレグ；
前記プリプレグより上に配置された導電性材料の第１層；及び
前記プリプレグより下に配置された導電性材料の第２層、
を含んでなる、請求項１に記載のプリント配線板。
【請求項４】 前記導電性及び熱伝導性をもつ積層品が、
基材；
前記基材より上に配置された第１のプリプレグ層；
前記基材より下に配置された第２のプリプレグ層；
前記第１のプリプレグ層より上に配置された導電性材料の第１層；及び
前記第２のプリプレグ層より下に配置された導電性材料の第２層、
を含んでなり、
前記積層品の誘導率が１ＭＨｚで６．０を上回る、請求項１に記載のプリント配線板。
【請求項５】 前記基材は炭素の層を含んでなる、請求項３または４に記載のプリント配線板。
【請求項６】 導電性材料層；
前記導電性材料層から前記導電性及び熱伝導性をもつ積層品へ延びている、メッキされた貫通孔；をさらに含んでなり、
前記誘電体層の１つが前記導電性材料層と前記導電性及び熱伝導性をもつ積層品との間に配置され；そして
前記メッキされた貫通孔は前記導電性材料層と前記導電性及び熱伝導性をもつ積層品との間の電気接続を形成している、請求項１に記載のプリント配線板。
【請求項７】 前記導電性及び熱伝導性をもつ積層品は、それがプリント配線板内でパワー面、グランド面またはパワー面とグランド面の両方として作用するように構成されている、請求項６に記載のプリント配線板。
【請求項８】 プリント配線板が、プリント配線板の表面から導電性及び熱伝導性をもつ積層品を通って延びる熱伝導性材料でライニングされた複数の孔を含む、請求項１に記載のプリント配線板。
【請求項９】 熱伝導性樹脂を基材に含浸させる工程を含んでなる、プリプレグを構築する方法。
【請求項１０】 熱伝導性樹脂が導電性をも有する、請求項９に記載の方法。
JP2002549457A 2000-12-12 2001-12-11 伝導性制約コアを含む軽量回路板 Withdrawn JP2004515610A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25499700P 2000-12-12 2000-12-12
PCT/US2001/048199 WO2002047899A1 (en) 2000-12-12 2001-12-11 Lightweight circuit board with conductive constraining cores

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008297101A Division JP2009164582A (ja) 2000-12-12 2008-11-20 伝導性制約コアを含む軽量回路板

Publications (2)

Publication Number Publication Date
JP2004515610A JP2004515610A (ja) 2004-05-27
JP2004515610A5 true JP2004515610A5 (ja) 2006-01-05

Family

ID=22966398

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002549457A Withdrawn JP2004515610A (ja) 2000-12-12 2001-12-11 伝導性制約コアを含む軽量回路板
JP2008297101A Pending JP2009164582A (ja) 2000-12-12 2008-11-20 伝導性制約コアを含む軽量回路板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008297101A Pending JP2009164582A (ja) 2000-12-12 2008-11-20 伝導性制約コアを含む軽量回路板

Country Status (10)

Country Link
US (5) US6869664B2 (ja)
EP (1) EP1360067B1 (ja)
JP (2) JP2004515610A (ja)
CN (1) CN100345679C (ja)
AT (1) ATE354466T1 (ja)
AU (1) AU2002229042A1 (ja)
DE (1) DE60126832T2 (ja)
MY (1) MY143326A (ja)
TW (2) TWI338703B (ja)
WO (1) WO2002047899A1 (ja)

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