JP2004507076A5 - - Google Patents

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Publication number
JP2004507076A5
JP2004507076A5 JP2001587968A JP2001587968A JP2004507076A5 JP 2004507076 A5 JP2004507076 A5 JP 2004507076A5 JP 2001587968 A JP2001587968 A JP 2001587968A JP 2001587968 A JP2001587968 A JP 2001587968A JP 2004507076 A5 JP2004507076 A5 JP 2004507076A5
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JP
Japan
Prior art keywords
polishing
wafer
polishing pad
kel
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001587968A
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English (en)
Japanese (ja)
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JP2004507076A (ja
JP4615813B2 (ja
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Priority claimed from PCT/US2001/016869 external-priority patent/WO2001091971A1/en
Publication of JP2004507076A publication Critical patent/JP2004507076A/ja
Publication of JP2004507076A5 publication Critical patent/JP2004507076A5/ja
Application granted granted Critical
Publication of JP4615813B2 publication Critical patent/JP4615813B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2001587968A 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド Expired - Lifetime JP4615813B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28
PCT/US2001/016869 WO2001091971A1 (en) 2000-05-27 2001-05-24 Polishing pads for chemical mechanical planarization

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008245811A Division JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド

Publications (3)

Publication Number Publication Date
JP2004507076A JP2004507076A (ja) 2004-03-04
JP2004507076A5 true JP2004507076A5 (https=) 2006-01-05
JP4615813B2 JP4615813B2 (ja) 2011-01-19

Family

ID=26902748

Family Applications (12)

Application Number Title Priority Date Filing Date
JP2001587968A Expired - Lifetime JP4615813B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用の研磨パッド
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Family Applications After (11)

Application Number Title Priority Date Filing Date
JP2001587969A Expired - Lifetime JP4959901B2 (ja) 2000-05-27 2001-05-24 化学機械平坦化用溝付き研磨パッド
JP2008245811A Expired - Lifetime JP5016576B2 (ja) 2000-05-27 2008-09-25 化学機械平坦化用の研磨パッド
JP2011199659A Expired - Lifetime JP5584666B2 (ja) 2000-05-27 2011-09-13 化学機械平坦化用溝付き研磨パッド
JP2012020977A Expired - Lifetime JP5544381B2 (ja) 2000-05-27 2012-02-02 化学機械平坦化用の研磨パッド
JP2013156497A Expired - Lifetime JP5767280B2 (ja) 2000-05-27 2013-07-29 化学機械平坦化用溝付き研磨パッド
JP2013235414A Expired - Lifetime JP5993360B2 (ja) 2000-05-27 2013-11-13 化学機械平坦化用の研磨パッド
JP2014264802A Pending JP2015092610A (ja) 2000-05-27 2014-12-26 化学機械平坦化用溝付き研磨パッド
JP2015121009A Expired - Lifetime JP6141359B2 (ja) 2000-05-27 2015-06-16 化学機械平坦化用の研磨パッド
JP2016217133A Expired - Lifetime JP6375352B2 (ja) 2000-05-27 2016-11-07 化学機械平坦化用の研磨パッド
JP2018058015A Pending JP2018117150A (ja) 2000-05-27 2018-03-26 化学機械平坦化用の研磨パッド
JP2018104803A Expired - Lifetime JP6655848B2 (ja) 2000-05-27 2018-05-31 化学機械平坦化用の研磨パッド

Country Status (6)

Country Link
EP (2) EP1284842B1 (https=)
JP (12) JP4615813B2 (https=)
KR (2) KR100571449B1 (https=)
DE (2) DE60109601T2 (https=)
TW (2) TW528646B (https=)
WO (2) WO2001091971A1 (https=)

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JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
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JP7141230B2 (ja) * 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
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KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
CN114450127B (zh) * 2019-07-12 2024-05-28 Cmc材料有限责任公司 采用多胺及环己烷二甲醇固化剂的抛光垫
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
CN116348245A (zh) 2020-09-30 2023-06-27 富士纺控股株式会社 研磨垫、及研磨加工物的制造方法
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