TW528646B - Polishing pads for chemical mechanical planarization - Google Patents

Polishing pads for chemical mechanical planarization Download PDF

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Publication number
TW528646B
TW528646B TW090112660A TW90112660A TW528646B TW 528646 B TW528646 B TW 528646B TW 090112660 A TW090112660 A TW 090112660A TW 90112660 A TW90112660 A TW 90112660A TW 528646 B TW528646 B TW 528646B
Authority
TW
Taiwan
Prior art keywords
polishing
pad
item
patent application
wafer
Prior art date
Application number
TW090112660A
Other languages
English (en)
Chinese (zh)
Inventor
Arun Vishwanathan
Peter A Burke
David B James
David Shidner
Lee Melbourne Cook
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW528646(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rodel Inc filed Critical Rodel Inc
Application granted granted Critical
Publication of TW528646B publication Critical patent/TW528646B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW090112660A 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization TW528646B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US22209900P 2000-07-28 2000-07-28

Publications (1)

Publication Number Publication Date
TW528646B true TW528646B (en) 2003-04-21

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
TW090112660A TW528646B (en) 2000-05-27 2001-05-25 Polishing pads for chemical mechanical planarization
TW090112648A TW508284B (en) 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW090112648A TW508284B (en) 2000-05-27 2001-05-25 Grooved polishing pads for chemical mechanical planarization

Country Status (6)

Country Link
EP (2) EP1284842B1 (https=)
JP (12) JP4615813B2 (https=)
KR (2) KR100571449B1 (https=)
DE (2) DE60109601T2 (https=)
TW (2) TW528646B (https=)
WO (2) WO2001091971A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457202B (zh) * 2007-10-26 2014-10-21 Innopad Inc 化學機械平面化拋光墊及其產生方法
TWI805850B (zh) * 2018-09-28 2023-06-21 日商富士紡控股股份有限公司 研磨墊及研磨加工物之製造方法

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US6838149B2 (en) * 2001-12-13 2005-01-04 3M Innovative Properties Company Abrasive article for the deposition and polishing of a conductive material
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
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WO2004059715A1 (en) * 2002-12-28 2004-07-15 Skc Co., Ltd. Polishing pads, conditioner and methods for polishing using the same
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7238097B2 (en) 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US7074115B2 (en) 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
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JP4606730B2 (ja) * 2003-12-11 2011-01-05 東洋ゴム工業株式会社 研磨パッドおよびその製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
JP2006114885A (ja) * 2004-09-17 2006-04-27 Jsr Corp 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
JP2006231429A (ja) * 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR20070070094A (ko) 2005-12-28 2007-07-03 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 화학 기계 연마 방법
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JP5393434B2 (ja) 2008-12-26 2014-01-22 東洋ゴム工業株式会社 研磨パッド及びその製造方法
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US9597769B2 (en) * 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
JP6196858B2 (ja) * 2012-09-24 2017-09-13 株式会社荏原製作所 研磨方法および研磨装置
JP5836992B2 (ja) 2013-03-19 2015-12-24 株式会社東芝 半導体装置の製造方法
US20140370788A1 (en) * 2013-06-13 2014-12-18 Cabot Microelectronics Corporation Low surface roughness polishing pad
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
SG11201608134YA (en) * 2014-04-03 2016-10-28 3M Innovative Properties Co Polishing pads and systems and methods of making and using the same
US9731398B2 (en) 2014-08-22 2017-08-15 Rohm And Haas Electronic Materials Cmp Holding, Inc. Polyurethane polishing pad
JP6513455B2 (ja) * 2015-04-03 2019-05-15 富士紡ホールディングス株式会社 研磨パッド
TWI669360B (zh) * 2015-04-03 2019-08-21 日商富士紡控股股份有限公司 Abrasive pad
JP2016196067A (ja) * 2015-04-03 2016-11-24 富士紡ホールディングス株式会社 研磨パッド
JP6600149B2 (ja) * 2015-04-03 2019-10-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
US10086494B2 (en) * 2016-09-13 2018-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High planarization efficiency chemical mechanical polishing pads and methods of making
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EP3603968B1 (en) 2017-03-28 2023-09-13 AGC Inc. Use of a laminate in inkjet printing, printed matter and method for manufacturing same
JP6968651B2 (ja) * 2017-10-12 2021-11-17 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7349774B2 (ja) * 2018-03-09 2023-09-25 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、被研磨物の表面を研磨する方法、被研磨物の表面を研磨する際のスクラッチを低減する方法
JP7141230B2 (ja) * 2018-03-30 2022-09-22 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
JP7141283B2 (ja) * 2018-09-06 2022-09-22 富士紡ホールディングス株式会社 研磨パッド、研磨パッドの製造方法、及び被研磨物の表面を研磨する方法
TWI828771B (zh) 2018-09-28 2024-01-11 日商富士紡控股股份有限公司 研磨墊及研磨加工物的製造方法
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
KR102345784B1 (ko) * 2019-07-10 2022-01-03 에프엔에스테크 주식회사 웨이퍼 후면 연마용 고경도 연마패드
CN114450127B (zh) * 2019-07-12 2024-05-28 Cmc材料有限责任公司 采用多胺及环己烷二甲醇固化剂的抛光垫
JP7759179B2 (ja) * 2020-09-30 2025-10-23 富士紡ホールディングス株式会社 研磨パッド
CN116348245A (zh) 2020-09-30 2023-06-27 富士纺控股株式会社 研磨垫、及研磨加工物的制造方法
KR102488115B1 (ko) * 2020-11-06 2023-01-12 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI457202B (zh) * 2007-10-26 2014-10-21 Innopad Inc 化學機械平面化拋光墊及其產生方法
TWI805850B (zh) * 2018-09-28 2023-06-21 日商富士紡控股股份有限公司 研磨墊及研磨加工物之製造方法

Also Published As

Publication number Publication date
WO2001091972A1 (en) 2001-12-06
EP1284842B1 (en) 2005-10-19
JP2014078723A (ja) 2014-05-01
DE60109601T2 (de) 2006-02-09
JP2004507077A (ja) 2004-03-04
JP6141359B2 (ja) 2017-06-07
JP5767280B2 (ja) 2015-08-19
WO2001091971A1 (en) 2001-12-06
JP5993360B2 (ja) 2016-09-14
JP2017063211A (ja) 2017-03-30
JP4959901B2 (ja) 2012-06-27
EP1284842A1 (en) 2003-02-26
JP6655848B2 (ja) 2020-02-26
JP2012023387A (ja) 2012-02-02
JP2004507076A (ja) 2004-03-04
DE60114183T2 (de) 2006-07-13
JP2009033193A (ja) 2009-02-12
JP5584666B2 (ja) 2014-09-03
JP2015188108A (ja) 2015-10-29
KR20030004421A (ko) 2003-01-14
JP2018117150A (ja) 2018-07-26
JP2013239737A (ja) 2013-11-28
JP2015092610A (ja) 2015-05-14
JP4615813B2 (ja) 2011-01-19
KR100571449B1 (ko) 2006-04-17
EP1284841B1 (en) 2005-03-23
EP1284841A1 (en) 2003-02-26
KR100770852B1 (ko) 2007-10-26
DE60114183D1 (de) 2006-03-02
JP6375352B2 (ja) 2018-08-15
JP2018157220A (ja) 2018-10-04
JP2012114454A (ja) 2012-06-14
TW508284B (en) 2002-11-01
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
KR20030005405A (ko) 2003-01-17
DE60109601D1 (de) 2005-04-28

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