KR100571449B1 - 화학 기계적 평탄화용 연마 패드 - Google Patents

화학 기계적 평탄화용 연마 패드 Download PDF

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Publication number
KR100571449B1
KR100571449B1 KR1020027015966A KR20027015966A KR100571449B1 KR 100571449 B1 KR100571449 B1 KR 100571449B1 KR 1020027015966 A KR1020027015966 A KR 1020027015966A KR 20027015966 A KR20027015966 A KR 20027015966A KR 100571449 B1 KR100571449 B1 KR 100571449B1
Authority
KR
South Korea
Prior art keywords
pad
polishing
delete delete
storage modulus
kel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020027015966A
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English (en)
Korean (ko)
Other versions
KR20030004421A (ko
Inventor
비슈와나탄아런
제임스데이빗비.
쿡리멜버른
버크피터에이.
시드너데이빗
소조셉케이.
로버츠존브이.에이치.
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26902748&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100571449(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드
Publication of KR20030004421A publication Critical patent/KR20030004421A/ko
Application granted granted Critical
Publication of KR100571449B1 publication Critical patent/KR100571449B1/ko
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020027015966A 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드 Ceased KR100571449B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US20793800P 2000-05-27 2000-05-27
US60/207,938 2000-05-27
US22209900P 2000-07-28 2000-07-28
US60/222,099 2000-07-28
PCT/US2001/016869 WO2001091971A1 (en) 2000-05-27 2001-05-24 Polishing pads for chemical mechanical planarization

Publications (2)

Publication Number Publication Date
KR20030004421A KR20030004421A (ko) 2003-01-14
KR100571449B1 true KR100571449B1 (ko) 2006-04-17

Family

ID=26902748

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020027015966A Ceased KR100571449B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 연마 패드
KR1020027016049A Ceased KR100770852B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020027016049A Ceased KR100770852B1 (ko) 2000-05-27 2001-05-24 화학 기계적 평탄화용 그루브형 연마 패드

Country Status (6)

Country Link
EP (2) EP1284842B1 (https=)
JP (12) JP4615813B2 (https=)
KR (2) KR100571449B1 (https=)
DE (2) DE60109601T2 (https=)
TW (2) TW528646B (https=)
WO (2) WO2001091971A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102959354B1 (ko) 2024-12-18 2026-04-30 케이피엑스일렉트로켐 주식회사 연마패드, 이의 제조방법 및 평가방법

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Publication number Priority date Publication date Assignee Title
KR102959354B1 (ko) 2024-12-18 2026-04-30 케이피엑스일렉트로켐 주식회사 연마패드, 이의 제조방법 및 평가방법

Also Published As

Publication number Publication date
WO2001091972A1 (en) 2001-12-06
EP1284842B1 (en) 2005-10-19
JP2014078723A (ja) 2014-05-01
DE60109601T2 (de) 2006-02-09
JP2004507077A (ja) 2004-03-04
JP6141359B2 (ja) 2017-06-07
JP5767280B2 (ja) 2015-08-19
WO2001091971A1 (en) 2001-12-06
JP5993360B2 (ja) 2016-09-14
JP2017063211A (ja) 2017-03-30
JP4959901B2 (ja) 2012-06-27
EP1284842A1 (en) 2003-02-26
JP6655848B2 (ja) 2020-02-26
JP2012023387A (ja) 2012-02-02
TW528646B (en) 2003-04-21
JP2004507076A (ja) 2004-03-04
DE60114183T2 (de) 2006-07-13
JP2009033193A (ja) 2009-02-12
JP5584666B2 (ja) 2014-09-03
JP2015188108A (ja) 2015-10-29
KR20030004421A (ko) 2003-01-14
JP2018117150A (ja) 2018-07-26
JP2013239737A (ja) 2013-11-28
JP2015092610A (ja) 2015-05-14
JP4615813B2 (ja) 2011-01-19
EP1284841B1 (en) 2005-03-23
EP1284841A1 (en) 2003-02-26
KR100770852B1 (ko) 2007-10-26
DE60114183D1 (de) 2006-03-02
JP6375352B2 (ja) 2018-08-15
JP2018157220A (ja) 2018-10-04
JP2012114454A (ja) 2012-06-14
TW508284B (en) 2002-11-01
JP5016576B2 (ja) 2012-09-05
JP5544381B2 (ja) 2014-07-09
KR20030005405A (ko) 2003-01-17
DE60109601D1 (de) 2005-04-28

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