JP2004503108A - 半導体基板の熱処理 - Google Patents
半導体基板の熱処理 Download PDFInfo
- Publication number
- JP2004503108A JP2004503108A JP2002508836A JP2002508836A JP2004503108A JP 2004503108 A JP2004503108 A JP 2004503108A JP 2002508836 A JP2002508836 A JP 2002508836A JP 2002508836 A JP2002508836 A JP 2002508836A JP 2004503108 A JP2004503108 A JP 2004503108A
- Authority
- JP
- Japan
- Prior art keywords
- purge gas
- substrate
- heat treatment
- treatment system
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 151
- 238000010438 heat treatment Methods 0.000 title claims abstract description 99
- 239000004065 semiconductor Substances 0.000 title description 4
- 238000010926 purge Methods 0.000 claims abstract description 153
- 238000000034 method Methods 0.000 claims abstract description 57
- 238000001816 cooling Methods 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 166
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 22
- 239000001307 helium Substances 0.000 claims description 17
- 229910052734 helium Inorganic materials 0.000 claims description 17
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 150000002431 hydrogen Chemical class 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003247 decreasing effect Effects 0.000 claims 2
- 230000004044 response Effects 0.000 abstract description 7
- 230000008859 change Effects 0.000 abstract description 3
- 239000012530 fluid Substances 0.000 description 21
- 230000003287 optical effect Effects 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 238000001289 rapid thermal chemical vapour deposition Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001225 therapeutic effect Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/10—Heating of the reaction chamber or the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/06—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor by contacting with diffusion material in the gaseous state
- C30B31/12—Heating of the reaction chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/611,349 US6803546B1 (en) | 1999-07-08 | 2000-07-06 | Thermally processing a substrate |
PCT/US2001/021154 WO2002005323A2 (fr) | 2000-07-06 | 2001-07-03 | Traitement thermique de substrat |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004503108A true JP2004503108A (ja) | 2004-01-29 |
Family
ID=24448674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002508836A Pending JP2004503108A (ja) | 2000-07-06 | 2001-07-03 | 半導体基板の熱処理 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1297560A2 (fr) |
JP (1) | JP2004503108A (fr) |
KR (1) | KR100838874B1 (fr) |
CN (1) | CN1279577C (fr) |
WO (1) | WO2002005323A2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021113A (ja) * | 2011-07-11 | 2013-01-31 | Nuflare Technology Inc | 気相成長装置および気相成長方法 |
JP2019210522A (ja) * | 2018-06-05 | 2019-12-12 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6803546B1 (en) * | 1999-07-08 | 2004-10-12 | Applied Materials, Inc. | Thermally processing a substrate |
US8980767B2 (en) * | 2012-01-13 | 2015-03-17 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
WO2017116708A1 (fr) * | 2015-12-30 | 2017-07-06 | Mattson Technology, Inc. | Caractéristiques permettant d'améliorer l'uniformité de processus dans un système de recuit milliseconde |
KR102010329B1 (ko) * | 2017-08-04 | 2019-10-15 | 주식회사 디엠에스 | 기판처리장치 및 이를 이용한 인라인 기판처리시스템 |
CN114045470B (zh) * | 2021-12-31 | 2022-09-30 | 西安奕斯伟材料科技有限公司 | 一种用于常压外延反应腔室的清洁方法及外延硅片 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62282437A (ja) * | 1986-05-31 | 1987-12-08 | Shinku Riko Kk | 半導体ウエハ処理用急速加熱冷却装置 |
JPH02240923A (ja) * | 1989-03-15 | 1990-09-25 | Hitachi Ltd | 真空処理方法及び装置 |
JPH05197953A (ja) * | 1991-09-20 | 1993-08-06 | Intevac Inc | 排気環境下で基板を冷却するシステム |
JPH10144628A (ja) * | 1996-07-12 | 1998-05-29 | Applied Materials Inc | 薄膜の改良堆積法 |
JPH10172977A (ja) * | 1996-12-11 | 1998-06-26 | Sumitomo Electric Ind Ltd | 化合物半導体基板の熱処理方法及び熱処理装置 |
JPH10199824A (ja) * | 1997-01-14 | 1998-07-31 | Japan Storage Battery Co Ltd | 紫外線処理装置 |
JP2000505961A (ja) * | 1996-12-20 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 急速熱処理用炉 |
WO2000031777A1 (fr) * | 1998-11-20 | 2000-06-02 | Steag Rtp Systems, Inc. | Appareil a chauffage et a refroidissement rapides pour galettes de semi-conducteurs |
JP2001250788A (ja) * | 1999-12-23 | 2001-09-14 | Asm Internatl Nv | 半導体ウェハ処理装置 |
JP2001297995A (ja) * | 2000-04-13 | 2001-10-26 | Nec Corp | 回路製造方法および装置 |
JP2001308023A (ja) * | 2000-04-21 | 2001-11-02 | Tokyo Electron Ltd | 熱処理装置及び方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4818327A (en) * | 1987-07-16 | 1989-04-04 | Texas Instruments Incorporated | Wafer processing apparatus |
US5620525A (en) * | 1990-07-16 | 1997-04-15 | Novellus Systems, Inc. | Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate |
TW277139B (fr) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
US5676205A (en) * | 1993-10-29 | 1997-10-14 | Applied Materials, Inc. | Quasi-infinite heat source/sink |
US5620560A (en) * | 1994-10-05 | 1997-04-15 | Tokyo Electron Limited | Method and apparatus for heat-treating substrate |
US6046439A (en) * | 1996-06-17 | 2000-04-04 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
NL1003538C2 (nl) * | 1996-07-08 | 1998-01-12 | Advanced Semiconductor Mat | Werkwijze en inrichting voor het contactloos behandelen van een schijfvormig halfgeleidersubstraat. |
US6054688A (en) * | 1997-06-25 | 2000-04-25 | Brooks Automation, Inc. | Hybrid heater with ceramic foil serrated plate and gas assist |
US6803546B1 (en) * | 1999-07-08 | 2004-10-12 | Applied Materials, Inc. | Thermally processing a substrate |
-
2001
- 2001-07-03 KR KR1020037000152A patent/KR100838874B1/ko not_active IP Right Cessation
- 2001-07-03 WO PCT/US2001/021154 patent/WO2002005323A2/fr active Application Filing
- 2001-07-03 EP EP01952404A patent/EP1297560A2/fr not_active Withdrawn
- 2001-07-03 JP JP2002508836A patent/JP2004503108A/ja active Pending
- 2001-07-03 CN CNB018144985A patent/CN1279577C/zh not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62282437A (ja) * | 1986-05-31 | 1987-12-08 | Shinku Riko Kk | 半導体ウエハ処理用急速加熱冷却装置 |
JPH02240923A (ja) * | 1989-03-15 | 1990-09-25 | Hitachi Ltd | 真空処理方法及び装置 |
JPH05197953A (ja) * | 1991-09-20 | 1993-08-06 | Intevac Inc | 排気環境下で基板を冷却するシステム |
JPH10144628A (ja) * | 1996-07-12 | 1998-05-29 | Applied Materials Inc | 薄膜の改良堆積法 |
JPH10172977A (ja) * | 1996-12-11 | 1998-06-26 | Sumitomo Electric Ind Ltd | 化合物半導体基板の熱処理方法及び熱処理装置 |
JP2000505961A (ja) * | 1996-12-20 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 急速熱処理用炉 |
JPH10199824A (ja) * | 1997-01-14 | 1998-07-31 | Japan Storage Battery Co Ltd | 紫外線処理装置 |
WO2000031777A1 (fr) * | 1998-11-20 | 2000-06-02 | Steag Rtp Systems, Inc. | Appareil a chauffage et a refroidissement rapides pour galettes de semi-conducteurs |
JP2001250788A (ja) * | 1999-12-23 | 2001-09-14 | Asm Internatl Nv | 半導体ウェハ処理装置 |
JP2001297995A (ja) * | 2000-04-13 | 2001-10-26 | Nec Corp | 回路製造方法および装置 |
JP2001308023A (ja) * | 2000-04-21 | 2001-11-02 | Tokyo Electron Ltd | 熱処理装置及び方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013021113A (ja) * | 2011-07-11 | 2013-01-31 | Nuflare Technology Inc | 気相成長装置および気相成長方法 |
JP2019210522A (ja) * | 2018-06-05 | 2019-12-12 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
KR20190138587A (ko) * | 2018-06-05 | 2019-12-13 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 및 성막 장치 |
KR102214217B1 (ko) * | 2018-06-05 | 2021-02-08 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 및 성막 장치 |
JP7018825B2 (ja) | 2018-06-05 | 2022-02-14 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
CN1279577C (zh) | 2006-10-11 |
KR20030014322A (ko) | 2003-02-15 |
EP1297560A2 (fr) | 2003-04-02 |
KR100838874B1 (ko) | 2008-06-16 |
WO2002005323A3 (fr) | 2002-06-20 |
CN1447980A (zh) | 2003-10-08 |
WO2002005323A2 (fr) | 2002-01-17 |
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