JP2004363601A - クラスタ用移送チャンバー - Google Patents
クラスタ用移送チャンバー Download PDFInfo
- Publication number
- JP2004363601A JP2004363601A JP2004162901A JP2004162901A JP2004363601A JP 2004363601 A JP2004363601 A JP 2004363601A JP 2004162901 A JP2004162901 A JP 2004162901A JP 2004162901 A JP2004162901 A JP 2004162901A JP 2004363601 A JP2004363601 A JP 2004363601A
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- JP
- Japan
- Prior art keywords
- chamber
- transfer chamber
- main body
- chamber body
- cluster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 50
- 230000008569 process Effects 0.000 claims abstract description 49
- 238000012545 processing Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000008878 coupling Effects 0.000 abstract description 4
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 29
- 239000004973 liquid crystal related substance Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 10
- 238000003860 storage Methods 0.000 description 7
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000427 thin-film deposition Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electron Beam Exposure (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
【解決手段】移送チャンバーは第1本体320と、第1本体の上段に結合されるカバー380と、第1本体の側面に結合される第2本体340及び第3本体360と、により構成されていて、第1本体と第2本体との間、第1本体と第3本体との間、並びに第1本体とカバーとの間は、各々Oリング330、350、370によりシーリングされる。第1本体は直六面体であって、上面及び一組の側面には開口部322、別の一組の側面にはロードロックチャンバー連結部326、及び工程チャンバ−連結部324が各々形成されている。第2本体、第3本体は、三角柱状であって、第1本体の側面開口部に結合される側面開口部364、工程チャンバーが結合される工程チャンバ−連結部342、362が形成されている。
【選択図】図4
Description
320:第1本体
330、350、370:オーリング
340:第2本体
360:第3本体
380:カバー
Claims (12)
- 被加工物の加工を行うための工程チャンバーが連結されるように構成されていると共に、該工程チャンバーに被加工物を移送するための空間を内部に有するクラスタ用移送チャンバーにおいて、
第1本体と、
前記第1本体に連結されて該第1本体と共に被加工物を移送するための空間を形成する第2本体と、
を備えたことを特徴とするクラスタ用移送チェンバー。 - 六角柱状であることを特徴とする請求項1に記載のクラスタ用移送チャンバー。
- 前記第1本体は、六面体状であることを特徴とする請求項1又は2に記載のクラスタ用移送チャンバー。
- 前記第1本体は、直六面体状であることを特徴とする請求項3に記載のクラスタ用移送チャンバー。
- 前記第2本体は、三角柱状であることを特徴とする請求項1乃至4のいずれか1項に記載のクラスタ用移送チャンバー。
- 前記第2本体は、四角柱状であることを特徴とする請求項1乃至4のいずれか1項に記載のクラスタ用移送チャンバー。
- 前記第2本体の上面と下面は、台形状であることを特徴とする請求項6に記載のクラスタ用移送チャンバー。
- 前記移送チャンバーは、八角柱状であることを特徴とする請求項1に記載のクラスタ用移送チャンバー。
- 前記第1本体と前記第2本体との間に、オーリングが介装されていることを特徴とする請求項1乃至8のいずれか1項に記載のクラスタ用移送チャンバー。
- 前記第1本体の上部に形成された開口部を閉塞するカバー、を備え、
前記第1本体と前記カバーとの間に、オーリングが介装されていることを特徴とする請求項1乃至9のいずれか1項に記載のクラスタ用移送チャンバー。 - 前記第1本体に連結されて該第1本体及び前記第2本体と共に被加工物を移送するための空間を形成する第3本体、
を備えたことを特徴とする請求項1に記載のクラスタ用移送チャンバー。 - 前記第3本体は、前記第2本体と略同じ形であることを特徴とする請求項11に記載のクラスタ用移送チャンバー。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030035350A KR100441875B1 (ko) | 2003-06-02 | 2003-06-02 | 분리형 이송 챔버 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004363601A true JP2004363601A (ja) | 2004-12-24 |
JP2004363601A5 JP2004363601A5 (ja) | 2005-11-17 |
JP4527444B2 JP4527444B2 (ja) | 2010-08-18 |
Family
ID=33448340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004162901A Expired - Lifetime JP4527444B2 (ja) | 2003-06-02 | 2004-06-01 | クラスタ用移送チャンバー |
Country Status (5)
Country | Link |
---|---|
US (3) | US7282460B2 (ja) |
JP (1) | JP4527444B2 (ja) |
KR (1) | KR100441875B1 (ja) |
CN (1) | CN100375230C (ja) |
TW (1) | TWI249186B (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007073542A (ja) * | 2005-09-02 | 2007-03-22 | Tokyo Electron Ltd | 真空チャンバおよび真空処理装置 |
JP2007266576A (ja) * | 2006-01-13 | 2007-10-11 | Applied Materials Inc | 分離されたチャンバ本体 |
JP2009239085A (ja) * | 2008-03-27 | 2009-10-15 | Foi:Kk | 半導体ウェハ搬送装置および半導体ウェハ搬送方法 |
JP2009545171A (ja) * | 2006-07-25 | 2009-12-17 | アプライド マテリアルズ インコーポレイテッド | 八角形搬送チャンバ |
KR20110109077A (ko) * | 2010-03-30 | 2011-10-06 | 주식회사 원익아이피에스 | 진공챔버 |
US8033772B2 (en) | 2002-06-21 | 2011-10-11 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
CN108933097A (zh) * | 2017-05-23 | 2018-12-04 | 东京毅力科创株式会社 | 真空输送组件和基片处理装置 |
JP2018198305A (ja) * | 2017-05-23 | 2018-12-13 | 東京エレクトロン株式会社 | 真空搬送モジュール及び基板処理装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100441875B1 (ko) * | 2003-06-02 | 2004-07-27 | 주성엔지니어링(주) | 분리형 이송 챔버 |
KR100716041B1 (ko) * | 2004-06-02 | 2007-05-09 | 어플라이드 머티어리얼스, 인코포레이티드 | 챔버를 밀봉하기 위한 방법 및 장치 |
US7784164B2 (en) | 2004-06-02 | 2010-08-31 | Applied Materials, Inc. | Electronic device manufacturing chamber method |
US8648977B2 (en) | 2004-06-02 | 2014-02-11 | Applied Materials, Inc. | Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors |
TWI298895B (en) | 2004-06-02 | 2008-07-11 | Applied Materials Inc | Electronic device manufacturing chamber and methods of forming the same |
US20060201074A1 (en) * | 2004-06-02 | 2006-09-14 | Shinichi Kurita | Electronic device manufacturing chamber and methods of forming the same |
KR100595418B1 (ko) * | 2004-07-27 | 2006-07-03 | (주)아이씨디 | 알루미늄 플라즈마 챔버 및 그 제조 방법 |
KR100544896B1 (ko) * | 2004-07-27 | 2006-01-24 | (주)아이씨디 | 일체형 실링부재를 구비한 알루미늄 플라즈마 챔버 |
WO2006130811A2 (en) * | 2005-06-02 | 2006-12-07 | Applied Materials, Inc. | Electronic device manufacturing chamber and methods of forming the same |
KR100831950B1 (ko) * | 2005-11-28 | 2008-05-23 | 주식회사 유진테크 | 챔버 |
JP4473343B2 (ja) * | 2007-11-09 | 2010-06-02 | キヤノンアネルバ株式会社 | インライン型ウェハ搬送装置 |
DE102007057644A1 (de) * | 2007-11-28 | 2009-06-04 | Oerlikon Trading Ag, Trübbach | Vakuumkammer auf Rahmenbasis für Beschichtungsanlagen |
TWI544107B (zh) * | 2010-04-30 | 2016-08-01 | 應用材料股份有限公司 | 用於處理基板的設備及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0864542A (ja) * | 1994-08-25 | 1996-03-08 | Plasma Syst:Kk | 半導体処理装置用真空チャンバーおよびその製造方法 |
JP2002076091A (ja) * | 2000-08-24 | 2002-03-15 | Anelva Corp | 基板処理装置 |
JP2004335743A (ja) * | 2003-05-08 | 2004-11-25 | Ulvac Japan Ltd | 真空処理装置用真空チャンバー |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100367461C (zh) * | 1993-11-05 | 2008-02-06 | 株式会社半导体能源研究所 | 一种制造薄膜晶体管和电子器件的方法 |
US5672239A (en) * | 1995-05-10 | 1997-09-30 | Tegal Corporation | Integrated semiconductor wafer processing system |
ES2159084T3 (es) * | 1997-01-07 | 2001-09-16 | Siegfried Dr Stramke | Dispositivo para el tratamiento superficial por plasma de piezas de trabajo. |
US6045620A (en) * | 1997-07-11 | 2000-04-04 | Applied Materials, Inc. | Two-piece slit valve insert for vacuum processing system |
US6312525B1 (en) * | 1997-07-11 | 2001-11-06 | Applied Materials, Inc. | Modular architecture for semiconductor wafer fabrication equipment |
US6182851B1 (en) * | 1998-09-10 | 2001-02-06 | Applied Materials Inc. | Vacuum processing chambers and method for producing |
WO2000045425A1 (en) * | 1999-02-01 | 2000-08-03 | Tokyo Electron Limited | Etching system and etching chamber |
IT1308606B1 (it) * | 1999-02-12 | 2002-01-08 | Lpe Spa | Dispositivo per maneggiare substrati mediante un istema autolivellante a depressione in reattori epistassiali ad induzione con suscettore |
US6558509B2 (en) * | 1999-11-30 | 2003-05-06 | Applied Materials, Inc. | Dual wafer load lock |
US6977014B1 (en) * | 2000-06-02 | 2005-12-20 | Novellus Systems, Inc. | Architecture for high throughput semiconductor processing applications |
JP4021125B2 (ja) * | 2000-06-02 | 2007-12-12 | 東京エレクトロン株式会社 | ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置 |
KR100441875B1 (ko) * | 2003-06-02 | 2004-07-27 | 주성엔지니어링(주) | 분리형 이송 챔버 |
US7784164B2 (en) * | 2004-06-02 | 2010-08-31 | Applied Materials, Inc. | Electronic device manufacturing chamber method |
TWI298895B (en) * | 2004-06-02 | 2008-07-11 | Applied Materials Inc | Electronic device manufacturing chamber and methods of forming the same |
-
2003
- 2003-06-02 KR KR1020030035350A patent/KR100441875B1/ko not_active IP Right Cessation
-
2004
- 2004-06-01 TW TW093115658A patent/TWI249186B/zh not_active IP Right Cessation
- 2004-06-01 JP JP2004162901A patent/JP4527444B2/ja not_active Expired - Lifetime
- 2004-06-02 CN CNB2004100461822A patent/CN100375230C/zh not_active Ceased
- 2004-06-02 US US10/859,893 patent/US7282460B2/en active Active
-
2005
- 2005-05-23 US US11/135,727 patent/US7375041B2/en active Active
-
2007
- 2007-10-15 US US11/872,617 patent/US20080029029A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0864542A (ja) * | 1994-08-25 | 1996-03-08 | Plasma Syst:Kk | 半導体処理装置用真空チャンバーおよびその製造方法 |
JP2002076091A (ja) * | 2000-08-24 | 2002-03-15 | Anelva Corp | 基板処理装置 |
JP2004335743A (ja) * | 2003-05-08 | 2004-11-25 | Ulvac Japan Ltd | 真空処理装置用真空チャンバー |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8033772B2 (en) | 2002-06-21 | 2011-10-11 | Applied Materials, Inc. | Transfer chamber for vacuum processing system |
JP2007073542A (ja) * | 2005-09-02 | 2007-03-22 | Tokyo Electron Ltd | 真空チャンバおよび真空処理装置 |
JP2007266576A (ja) * | 2006-01-13 | 2007-10-11 | Applied Materials Inc | 分離されたチャンバ本体 |
JP2009545171A (ja) * | 2006-07-25 | 2009-12-17 | アプライド マテリアルズ インコーポレイテッド | 八角形搬送チャンバ |
JP2009239085A (ja) * | 2008-03-27 | 2009-10-15 | Foi:Kk | 半導体ウェハ搬送装置および半導体ウェハ搬送方法 |
KR20110109077A (ko) * | 2010-03-30 | 2011-10-06 | 주식회사 원익아이피에스 | 진공챔버 |
KR101598176B1 (ko) | 2010-03-30 | 2016-02-26 | 주식회사 원익아이피에스 | 진공챔버 |
CN108933097A (zh) * | 2017-05-23 | 2018-12-04 | 东京毅力科创株式会社 | 真空输送组件和基片处理装置 |
JP2018198305A (ja) * | 2017-05-23 | 2018-12-13 | 東京エレクトロン株式会社 | 真空搬送モジュール及び基板処理装置 |
CN108933097B (zh) * | 2017-05-23 | 2023-06-23 | 东京毅力科创株式会社 | 真空输送组件和基片处理装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI249186B (en) | 2006-02-11 |
US7375041B2 (en) | 2008-05-20 |
US7282460B2 (en) | 2007-10-16 |
US20050205012A1 (en) | 2005-09-22 |
CN1573481A (zh) | 2005-02-02 |
TW200501217A (en) | 2005-01-01 |
US20080029029A1 (en) | 2008-02-07 |
US20040240983A1 (en) | 2004-12-02 |
JP4527444B2 (ja) | 2010-08-18 |
KR100441875B1 (ko) | 2004-07-27 |
CN100375230C (zh) | 2008-03-12 |
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