JP2004361692A - 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 - Google Patents

光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 Download PDF

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Publication number
JP2004361692A
JP2004361692A JP2003160302A JP2003160302A JP2004361692A JP 2004361692 A JP2004361692 A JP 2004361692A JP 2003160302 A JP2003160302 A JP 2003160302A JP 2003160302 A JP2003160302 A JP 2003160302A JP 2004361692 A JP2004361692 A JP 2004361692A
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Japan
Prior art keywords
optical transmission
transmission member
monovalent
organopolysiloxane resin
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003160302A
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English (en)
Japanese (ja)
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JP2004361692A5 (enExample
Inventor
Nobuo Kushibiki
信男 櫛引
Takuya Ogawa
琢哉 小川
Kikuko Takeuchi
貴久子 竹内
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DuPont Toray Specialty Materials KK
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Dow Corning Asia Ltd
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Publication date
Application filed by Dow Corning Asia Ltd filed Critical Dow Corning Asia Ltd
Priority to JP2003160302A priority Critical patent/JP2004361692A/ja
Priority to US10/552,191 priority patent/US20070025678A1/en
Priority to AT04726300T priority patent/ATE504634T1/de
Priority to CA2521736A priority patent/CA2521736C/en
Priority to DE602004032121T priority patent/DE602004032121D1/de
Priority to EP04726300A priority patent/EP1611203B1/en
Priority to PCT/JP2004/005014 priority patent/WO2004090041A2/en
Publication of JP2004361692A publication Critical patent/JP2004361692A/ja
Priority to KR1020057019042A priority patent/KR101092249B1/ko
Publication of JP2004361692A5 publication Critical patent/JP2004361692A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/10—Transparent films; Clear coatings; Transparent materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12061—Silicon
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12035—Materials
    • G02B2006/12069—Organic material

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  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
JP2003160302A 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 Pending JP2004361692A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2003160302A JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
US10/552,191 US20070025678A1 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
AT04726300T ATE504634T1 (de) 2003-04-07 2004-04-07 Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren
CA2521736A CA2521736C (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical waveguides, optical waveguide, and fabrication process thereof
DE602004032121T DE602004032121D1 (de) 2003-04-07 2004-04-07 Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren
EP04726300A EP1611203B1 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
PCT/JP2004/005014 WO2004090041A2 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
KR1020057019042A KR101092249B1 (ko) 2003-04-07 2005-10-06 광 도파관용 경화성 오가노폴리실록산 수지 조성물, 광 도파관 및 이들의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003103252 2003-04-07
JP2003160302A JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法

Publications (2)

Publication Number Publication Date
JP2004361692A true JP2004361692A (ja) 2004-12-24
JP2004361692A5 JP2004361692A5 (enExample) 2006-07-06

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JP2003160302A Pending JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法

Country Status (8)

Country Link
US (1) US20070025678A1 (enExample)
EP (1) EP1611203B1 (enExample)
JP (1) JP2004361692A (enExample)
KR (1) KR101092249B1 (enExample)
AT (1) ATE504634T1 (enExample)
CA (1) CA2521736C (enExample)
DE (1) DE602004032121D1 (enExample)
WO (1) WO2004090041A2 (enExample)

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WO2005111149A1 (ja) * 2004-05-14 2005-11-24 Dow Corning Toray Co., Ltd. オルガノポリシロキサン樹脂硬化物からなる独立フィルム、その製造方法および積層フィルム
JP2006299099A (ja) * 2005-04-21 2006-11-02 Shin Etsu Chem Co Ltd 光半導体素子封止用樹脂組成物及び光半導体素子
KR100857754B1 (ko) * 2005-04-20 2008-09-09 닛뽕 뻬인또 가부시키가이샤 폴리실란 조성물, 광 도파로 및 그 제조 방법
JP2008291124A (ja) * 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 光導波板用液状シリコーンゴム組成物
JP2009523856A (ja) * 2006-01-17 2009-06-25 ダウ・コーニング・コーポレイション 熱安定性の透明なシリコーン樹脂組成物、並びにその調製方法及び使用
JP2012052045A (ja) * 2010-09-02 2012-03-15 Shin-Etsu Chemical Co Ltd 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP2012074512A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2016534162A (ja) * 2013-08-29 2016-11-04 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2018235200A1 (ja) * 2017-06-21 2018-12-27 三菱電機株式会社 光導波路、光回路および半導体レーザ
JP2023046799A (ja) * 2021-09-24 2023-04-05 パナソニックＩｐマネジメント株式会社 光導波路の製造方法、及び、光導波路用材料

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US7786983B2 (en) * 2003-04-08 2010-08-31 Poa Sana Liquidating Trust Apparatus and method for a data input device using a light lamina screen
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KR100860657B1 (ko) * 2004-06-25 2008-09-26 오므론 가부시키가이샤 필름 광 도파로 및 그 제조 방법 및 전자 기기 장치
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WO2005111149A1 (ja) * 2004-05-14 2005-11-24 Dow Corning Toray Co., Ltd. オルガノポリシロキサン樹脂硬化物からなる独立フィルム、その製造方法および積層フィルム
US7960030B2 (en) 2004-05-14 2011-06-14 Dow Corning Corporation Free films made of cured organopolysiloxane resins, process for production thereof, and laminated films
KR100857754B1 (ko) * 2005-04-20 2008-09-09 닛뽕 뻬인또 가부시키가이샤 폴리실란 조성물, 광 도파로 및 그 제조 방법
JP2006299099A (ja) * 2005-04-21 2006-11-02 Shin Etsu Chem Co Ltd 光半導体素子封止用樹脂組成物及び光半導体素子
JP2009523856A (ja) * 2006-01-17 2009-06-25 ダウ・コーニング・コーポレイション 熱安定性の透明なシリコーン樹脂組成物、並びにその調製方法及び使用
KR101325792B1 (ko) 2006-01-17 2013-11-04 다우 코닝 코포레이션 열 안정성 투명 실리콘 수지 조성물 및 이의 제조 방법 및용도
JP2008291124A (ja) * 2007-05-25 2008-12-04 Shin Etsu Chem Co Ltd 光導波板用液状シリコーンゴム組成物
JP2012052045A (ja) * 2010-09-02 2012-03-15 Shin-Etsu Chemical Co Ltd 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP2012074512A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
JP2016534162A (ja) * 2013-08-29 2016-11-04 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 硬化性シリコーン組成物、その硬化物、および光半導体装置
WO2018235200A1 (ja) * 2017-06-21 2018-12-27 三菱電機株式会社 光導波路、光回路および半導体レーザ
JP2023046799A (ja) * 2021-09-24 2023-04-05 パナソニックＩｐマネジメント株式会社 光導波路の製造方法、及び、光導波路用材料
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CA2521736C (en) 2013-07-02
WO2004090041A3 (en) 2005-01-27
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DE602004032121D1 (de) 2011-05-19
US20070025678A1 (en) 2007-02-01
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WO2004090041A2 (en) 2004-10-21

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