JP2004361692A5 - - Google Patents

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Publication number
JP2004361692A5
JP2004361692A5 JP2003160302A JP2003160302A JP2004361692A5 JP 2004361692 A5 JP2004361692 A5 JP 2004361692A5 JP 2003160302 A JP2003160302 A JP 2003160302A JP 2003160302 A JP2003160302 A JP 2003160302A JP 2004361692 A5 JP2004361692 A5 JP 2004361692A5
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JP
Japan
Prior art keywords
sio
units
unit
resin
carbon atoms
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003160302A
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English (en)
Japanese (ja)
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JP2004361692A (ja
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Publication date
Application filed filed Critical
Priority to JP2003160302A priority Critical patent/JP2004361692A/ja
Priority claimed from JP2003160302A external-priority patent/JP2004361692A/ja
Priority to US10/552,191 priority patent/US20070025678A1/en
Priority to PCT/JP2004/005014 priority patent/WO2004090041A2/en
Priority to DE602004032121T priority patent/DE602004032121D1/de
Priority to CA2521736A priority patent/CA2521736C/en
Priority to AT04726300T priority patent/ATE504634T1/de
Priority to EP04726300A priority patent/EP1611203B1/en
Publication of JP2004361692A publication Critical patent/JP2004361692A/ja
Priority to KR1020057019042A priority patent/KR101092249B1/ko
Publication of JP2004361692A5 publication Critical patent/JP2004361692A5/ja
Pending legal-status Critical Current

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JP2003160302A 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 Pending JP2004361692A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2003160302A JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法
EP04726300A EP1611203B1 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
CA2521736A CA2521736C (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical waveguides, optical waveguide, and fabrication process thereof
PCT/JP2004/005014 WO2004090041A2 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
DE602004032121T DE602004032121D1 (de) 2003-04-07 2004-04-07 Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren
US10/552,191 US20070025678A1 (en) 2003-04-07 2004-04-07 Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof
AT04726300T ATE504634T1 (de) 2003-04-07 2004-04-07 Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren
KR1020057019042A KR101092249B1 (ko) 2003-04-07 2005-10-06 광 도파관용 경화성 오가노폴리실록산 수지 조성물, 광 도파관 및 이들의 제조방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003103252 2003-04-07
JP2003160302A JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法

Publications (2)

Publication Number Publication Date
JP2004361692A JP2004361692A (ja) 2004-12-24
JP2004361692A5 true JP2004361692A5 (enExample) 2006-07-06

Family

ID=33161521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003160302A Pending JP2004361692A (ja) 2003-04-07 2003-06-05 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法

Country Status (8)

Country Link
US (1) US20070025678A1 (enExample)
EP (1) EP1611203B1 (enExample)
JP (1) JP2004361692A (enExample)
KR (1) KR101092249B1 (enExample)
AT (1) ATE504634T1 (enExample)
CA (1) CA2521736C (enExample)
DE (1) DE602004032121D1 (enExample)
WO (1) WO2004090041A2 (enExample)

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US7676131B2 (en) * 2004-06-04 2010-03-09 Poa Sana Liquidating Trust Waveguide with a three-dimensional lens
US7471865B2 (en) * 2004-06-04 2008-12-30 Poa Sana Liquidating Trust Apparatus and method for a molded waveguide for use with touch screen displays
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US7496266B2 (en) * 2004-06-25 2009-02-24 Omron Corporation Film waveguide, method of manufacturing film waveguide, and electronic device
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ATE536558T1 (de) * 2006-08-28 2011-12-15 Dow Corning Optische bauelemente und silikonzusammensetzungen sowie verfahren zur herstellung der optischen bauelemente
KR20090092324A (ko) * 2006-12-20 2009-08-31 다우 코닝 코포레이션 양이온 민감성 층을 포함하는 복합 물품
JP4605402B2 (ja) * 2007-05-25 2011-01-05 信越化学工業株式会社 光導波板用液状シリコーンゴム組成物
EP2166395A1 (en) * 2007-07-03 2010-03-24 Konica Minolta Opto, Inc. Imaging device manufacturing method, imaging device and optical element
JP5587791B2 (ja) 2008-01-08 2014-09-10 東レ・ダウコーニング株式会社 シルセスキオキサン樹脂
CN101910253B (zh) * 2008-01-15 2013-04-10 陶氏康宁公司 倍半硅氧烷树脂
EP2250213B1 (en) * 2008-03-04 2013-08-21 Dow Corning Corporation Silsesquioxane resins
CN101959947B (zh) * 2008-03-04 2014-02-26 陶氏康宁公司 硅氧烷组合物,硅氧烷粘合剂,涂布和层压的基底
WO2009111121A2 (en) * 2008-03-05 2009-09-11 Dow Corning Corporation Silsesquioxane resins
JP5632387B2 (ja) * 2008-12-10 2014-11-26 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 湿式エッチング可能な反射防止膜
US8809482B2 (en) 2008-12-10 2014-08-19 Dow Corning Corporation Silsesquioxane resins
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JP5170471B2 (ja) * 2010-09-02 2013-03-27 信越化学工業株式会社 低ガス透過性シリコーン樹脂組成物及び光半導体装置
JP2012074512A (ja) * 2010-09-28 2012-04-12 Sekisui Chem Co Ltd 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
WO2012078617A1 (en) * 2010-12-08 2012-06-14 Dow Corning Corporation Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
KR20130140815A (ko) * 2010-12-08 2013-12-24 다우 코닝 코포레이션 봉지재의 형성에 적합한 실록산 조성물
JP5592330B2 (ja) * 2011-10-07 2014-09-17 信越化学工業株式会社 仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法
JP6084808B2 (ja) * 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US10332772B2 (en) * 2013-03-13 2019-06-25 Applied Materials, Inc. Multi-zone heated ESC with independent edge zones
EP3039079B1 (en) * 2013-08-29 2022-05-18 Ddp Specialty Electronic Materials Us 9, Llc. Curable silicone composition, cured product thereof, and optical semiconductor device
TWI648345B (zh) * 2013-12-16 2019-01-21 道康寧公司 選擇性遮光之光物理材料及包括此等選擇性遮光之光物理材料的光學裝置
WO2018235200A1 (ja) * 2017-06-21 2018-12-27 三菱電機株式会社 光導波路、光回路および半導体レーザ
WO2020086675A1 (en) * 2018-10-23 2020-04-30 Sigma International Lighted device useful in a vehicle interior
US11886001B2 (en) * 2019-12-20 2024-01-30 Snap Inc. Optical waveguide fabrication process
CN115315487A (zh) * 2020-02-21 2022-11-08 陶氏东丽株式会社 固化性液态有机硅组合物、其固化物、包含该组合物的光学填充剂、以及包含由该固化物形成的层的显示装置
WO2021167051A1 (ja) 2020-02-21 2021-08-26 ダウ・東レ株式会社 光硬化性液状シリコーン組成物、その硬化物、それを含む光学充填剤、およびその硬化物からなる層を含む表示装置
JP7696089B2 (ja) * 2021-09-24 2025-06-20 パナソニックＩｐマネジメント株式会社 光導波路用材料
CN118591593A (zh) * 2022-02-24 2024-09-03 美国陶氏有机硅公司 可固化硅酮组合物及其经固化的产物
TW202334318A (zh) * 2022-02-24 2023-09-01 美商陶氏有機矽公司 可固化聚矽氧組成物

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