DE602004032121D1 - Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren - Google Patents
Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahrenInfo
- Publication number
- DE602004032121D1 DE602004032121D1 DE602004032121T DE602004032121T DE602004032121D1 DE 602004032121 D1 DE602004032121 D1 DE 602004032121D1 DE 602004032121 T DE602004032121 T DE 602004032121T DE 602004032121 T DE602004032121 T DE 602004032121T DE 602004032121 D1 DE602004032121 D1 DE 602004032121D1
- Authority
- DE
- Germany
- Prior art keywords
- conductive components
- optically conductive
- hydrosilation
- transmission components
- optical transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 6
- 230000005540 biological transmission Effects 0.000 abstract 4
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- 150000003961 organosilicon compounds Chemical class 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 1
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003085 diluting agent Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 238000006459 hydrosilylation reaction Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 125000005375 organosiloxane group Chemical group 0.000 abstract 1
- 239000002904 solvent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/003—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12061—Silicon
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12069—Organic material
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003103252 | 2003-04-07 | ||
| JP2003160302A JP2004361692A (ja) | 2003-04-07 | 2003-06-05 | 光伝送部材用硬化性オルガノポリシロキサン樹脂組成物、オルガノポリシロキサン樹脂硬化物からなる光伝送部材および光伝送部材の製造方法 |
| PCT/JP2004/005014 WO2004090041A2 (en) | 2003-04-07 | 2004-04-07 | Curable organopolysiloxane resin composition for optical transmission components, optical transmission components, and fabrication process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE602004032121D1 true DE602004032121D1 (de) | 2011-05-19 |
Family
ID=33161521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE602004032121T Expired - Lifetime DE602004032121D1 (de) | 2003-04-07 | 2004-04-07 | Vernetzbare organopolysiloxanharzzusammensetzung für optisch leitfähige komponente, optisch leitfähige komponente und deren herstellungsverfahren |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20070025678A1 (enExample) |
| EP (1) | EP1611203B1 (enExample) |
| JP (1) | JP2004361692A (enExample) |
| KR (1) | KR101092249B1 (enExample) |
| AT (1) | ATE504634T1 (enExample) |
| CA (1) | CA2521736C (enExample) |
| DE (1) | DE602004032121D1 (enExample) |
| WO (1) | WO2004090041A2 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7786983B2 (en) * | 2003-04-08 | 2010-08-31 | Poa Sana Liquidating Trust | Apparatus and method for a data input device using a light lamina screen |
| US7509011B2 (en) * | 2004-01-15 | 2009-03-24 | Poa Sana Liquidating Trust | Hybrid waveguide |
| WO2005111149A1 (ja) * | 2004-05-14 | 2005-11-24 | Dow Corning Toray Co., Ltd. | オルガノポリシロキサン樹脂硬化物からなる独立フィルム、その製造方法および積層フィルム |
| US7676131B2 (en) * | 2004-06-04 | 2010-03-09 | Poa Sana Liquidating Trust | Waveguide with a three-dimensional lens |
| US7471865B2 (en) * | 2004-06-04 | 2008-12-30 | Poa Sana Liquidating Trust | Apparatus and method for a molded waveguide for use with touch screen displays |
| JP4647941B2 (ja) * | 2004-06-23 | 2011-03-09 | 東レ・ダウコーニング株式会社 | シリコーンレジンとシリコーンゴムの一体化成形体、その製造方法および硬化性シリコーンレジン組成物 |
| KR100860657B1 (ko) * | 2004-06-25 | 2008-09-26 | 오므론 가부시키가이샤 | 필름 광 도파로 및 그 제조 방법 및 전자 기기 장치 |
| CN100489578C (zh) * | 2004-06-25 | 2009-05-20 | 欧姆龙株式会社 | 薄膜光波导和其制造方法以及电子设备装置 |
| JP4593348B2 (ja) * | 2005-04-20 | 2010-12-08 | 日本ペイント株式会社 | ポリシラン組成物並びに光導波路及びその製造方法 |
| JP4636242B2 (ja) * | 2005-04-21 | 2011-02-23 | 信越化学工業株式会社 | 光半導体素子封止材及び光半導体素子 |
| AU2011235989B2 (en) * | 2005-06-10 | 2013-08-01 | Accenture Global Services Limited | Electronic vehicle identification |
| US20090130463A1 (en) * | 2005-10-05 | 2009-05-21 | John Dean Albaugh | Coated Substrates and Methods for their Preparation |
| WO2007086987A1 (en) * | 2006-01-17 | 2007-08-02 | Dow Corning Corporation | Thermally stable transparent silicone resin compositions and methods for their preparation and use |
| US20080031584A1 (en) * | 2006-08-02 | 2008-02-07 | National Semiconductor Corporation | Apparatus and method for a singulation of polymer waveguides using photolithography |
| KR101397616B1 (ko) * | 2006-08-28 | 2014-05-26 | 다우 코닝 코포레이션 | 광학 장치들과 실리콘 조성물들 및 광학 장치들을 제조하는공정들 |
| CN101589483B (zh) * | 2006-12-20 | 2012-06-06 | 陶氏康宁公司 | 含阳离子敏感层的复合制品 |
| JP4605402B2 (ja) * | 2007-05-25 | 2011-01-05 | 信越化学工業株式会社 | 光導波板用液状シリコーンゴム組成物 |
| WO2009004929A1 (ja) * | 2007-07-03 | 2009-01-08 | Konica Minolta Opto, Inc. | 撮像装置の製造方法、撮像装置及び光学素子 |
| CN101910255B (zh) | 2008-01-08 | 2013-07-10 | 道康宁东丽株式会社 | 倍半硅氧烷树脂 |
| US9023433B2 (en) * | 2008-01-15 | 2015-05-05 | Dow Corning Corporation | Silsesquioxane resins and method of using them to form an antireflective coating |
| JP5581225B2 (ja) * | 2008-03-04 | 2014-08-27 | ダウ・コーニング・コーポレイション | シルセスキオキサン樹脂 |
| JP2011517327A (ja) * | 2008-03-04 | 2011-06-02 | ダウ・コーニング・コーポレイション | シリコーン組成物、シリコーン接着剤、被覆基材及び積層基材 |
| CN101970540B (zh) * | 2008-03-05 | 2014-07-23 | 陶氏康宁公司 | 倍半硅氧烷树脂 |
| WO2010068336A1 (en) | 2008-12-10 | 2010-06-17 | Dow Corning Corporation | Silsesquioxane resins |
| US20110236835A1 (en) * | 2008-12-10 | 2011-09-29 | Peng-Fei Fu | Silsesquioxane Resins |
| JP5914351B2 (ja) | 2009-12-21 | 2016-05-11 | ダウ コーニング コーポレーションDow Corning Corporation | アルキル官能性シルセスキオキサン樹脂を使用した柔軟性導波路の製造方法 |
| CN101819296B (zh) * | 2010-03-05 | 2011-12-28 | 中国人民解放军国防科学技术大学 | 一种用于光互连的聚硅氧烷光波导的制备方法 |
| US8742009B2 (en) * | 2010-06-04 | 2014-06-03 | Shin-Etsu Chemical Co., Ltd. | Temporary adhesive composition, and method of producing thin wafer |
| JP5170471B2 (ja) * | 2010-09-02 | 2013-03-27 | 信越化学工業株式会社 | 低ガス透過性シリコーン樹脂組成物及び光半導体装置 |
| JP2012074512A (ja) * | 2010-09-28 | 2012-04-12 | Sekisui Chem Co Ltd | 光半導体装置用ダイボンド材及びそれを用いた光半導体装置 |
| JP2013544949A (ja) * | 2010-12-08 | 2013-12-19 | ダウ コーニング コーポレーション | 封止材を形成するのに好適な二酸化チタンナノ粒子を含むシロキサン組成物 |
| CN103370360A (zh) * | 2010-12-08 | 2013-10-23 | 道康宁公司 | 适合形成封装物的硅氧烷组合物 |
| JP5592330B2 (ja) * | 2011-10-07 | 2014-09-17 | 信越化学工業株式会社 | 仮接着剤組成物、及びそれを用いた薄型ウエハの製造方法 |
| JP6157085B2 (ja) | 2012-10-24 | 2017-07-05 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6084808B2 (ja) * | 2012-10-24 | 2017-02-22 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6081774B2 (ja) * | 2012-10-30 | 2017-02-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| US10332772B2 (en) * | 2013-03-13 | 2019-06-25 | Applied Materials, Inc. | Multi-zone heated ESC with independent edge zones |
| CN105492539B (zh) * | 2013-08-29 | 2019-05-07 | 美国陶氏有机硅公司 | 可固化有机硅组合物、其固化产物及光学半导体器件 |
| TWI648345B (zh) | 2013-12-16 | 2019-01-21 | 道康寧公司 | 選擇性遮光之光物理材料及包括此等選擇性遮光之光物理材料的光學裝置 |
| WO2018235200A1 (ja) * | 2017-06-21 | 2018-12-27 | 三菱電機株式会社 | 光導波路、光回路および半導体レーザ |
| WO2020086675A1 (en) * | 2018-10-23 | 2020-04-30 | Sigma International | Lighted device useful in a vehicle interior |
| US11886001B2 (en) * | 2019-12-20 | 2024-01-30 | Snap Inc. | Optical waveguide fabrication process |
| KR20220146519A (ko) * | 2020-02-21 | 2022-11-01 | 다우 도레이 캄파니 리미티드 | 경화성 액상 실리콘 조성물, 이의 경화물, 이를 포함하는 광학 충전제, 및 이의 경화물로 이루어진 층을 포함하는 표시 장치 |
| KR20220146521A (ko) | 2020-02-21 | 2022-11-01 | 다우 도레이 캄파니 리미티드 | 광경화성 액상 실리콘 조성물, 이의 경화물, 이를 포함하는 광학 충전제, 및 이의 경화물로 이루어진 층을 포함하는 표시 장치 |
| JP7696089B2 (ja) * | 2021-09-24 | 2025-06-20 | パナソニックIpマネジメント株式会社 | 光導波路用材料 |
| JP2025507537A (ja) * | 2022-02-24 | 2025-03-21 | ダウ シリコーンズ コーポレーション | 硬化性シリコーン組成物及びその硬化物 |
| TW202334318A (zh) * | 2022-02-24 | 2023-09-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3948848A (en) * | 1975-08-04 | 1976-04-06 | Dow Corning Corporation | Low temperature solventless silicone resins |
| US4198131A (en) * | 1978-03-23 | 1980-04-15 | Dow Corning Corporation | Silicone resin optical devices |
| CA1230192A (en) | 1984-03-23 | 1987-12-08 | Loretta A. Kroupa | Liquid curable polyorganosiloxane compositions |
| US4529789A (en) * | 1984-03-23 | 1985-07-16 | Dow Corning Corporation | Liquid curable polyorganosiloxane compositions |
| JPS61275706A (ja) * | 1985-05-30 | 1986-12-05 | Sumitomo Electric Ind Ltd | 光導波路 |
| JP2726043B2 (ja) | 1987-03-06 | 1998-03-11 | 株式会社ブリヂストン | 可撓性光導波路 |
| US4830461A (en) * | 1987-01-29 | 1989-05-16 | Bridgestone Corporation | Pressure-sensitive sensors |
| JPH01143605A (ja) | 1987-11-30 | 1989-06-06 | Kagawa Atsuko | 多孔質フィルムの製造方法 |
| JPH04214730A (ja) * | 1990-12-13 | 1992-08-05 | Shin Etsu Chem Co Ltd | オルガノポリシロキサンの製造方法 |
| JPH07306301A (ja) * | 1994-05-13 | 1995-11-21 | Dow Corning Kk | 光学素子及びその製造方法 |
| JPH08176444A (ja) * | 1994-10-26 | 1996-07-09 | Nippon Telegr & Teleph Corp <Ntt> | 高分子光学材料及びこれを用いた光導波路 |
| JP3449456B2 (ja) * | 1997-02-05 | 2003-09-22 | 信越化学工業株式会社 | オルガノポリシロキサン樹脂組成物 |
-
2003
- 2003-06-05 JP JP2003160302A patent/JP2004361692A/ja active Pending
-
2004
- 2004-04-07 WO PCT/JP2004/005014 patent/WO2004090041A2/en not_active Ceased
- 2004-04-07 DE DE602004032121T patent/DE602004032121D1/de not_active Expired - Lifetime
- 2004-04-07 AT AT04726300T patent/ATE504634T1/de not_active IP Right Cessation
- 2004-04-07 EP EP04726300A patent/EP1611203B1/en not_active Expired - Lifetime
- 2004-04-07 US US10/552,191 patent/US20070025678A1/en not_active Abandoned
- 2004-04-07 CA CA2521736A patent/CA2521736C/en not_active Expired - Fee Related
-
2005
- 2005-10-06 KR KR1020057019042A patent/KR101092249B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1611203B1 (en) | 2011-04-06 |
| EP1611203A2 (en) | 2006-01-04 |
| KR101092249B1 (ko) | 2011-12-12 |
| ATE504634T1 (de) | 2011-04-15 |
| KR20060030465A (ko) | 2006-04-10 |
| CA2521736C (en) | 2013-07-02 |
| US20070025678A1 (en) | 2007-02-01 |
| WO2004090041A2 (en) | 2004-10-21 |
| JP2004361692A (ja) | 2004-12-24 |
| WO2004090041A3 (en) | 2005-01-27 |
| CA2521736A1 (en) | 2004-10-21 |
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