JP2004349696A - テスト基板の再生利用方法及び装置 - Google Patents

テスト基板の再生利用方法及び装置 Download PDF

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Publication number
JP2004349696A
JP2004349696A JP2004145277A JP2004145277A JP2004349696A JP 2004349696 A JP2004349696 A JP 2004349696A JP 2004145277 A JP2004145277 A JP 2004145277A JP 2004145277 A JP2004145277 A JP 2004145277A JP 2004349696 A JP2004349696 A JP 2004349696A
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JP
Japan
Prior art keywords
test
identification data
recycling
stored
test board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004145277A
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English (en)
Japanese (ja)
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JP2004349696A5 (https=
Inventor
Israel Beinglass
ビイングラス イスラエル
Paul V Miller
ヴィ ミラー ポール
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Applied Materials Inc
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Applied Materials Inc
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Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2004349696A publication Critical patent/JP2004349696A/ja
Publication of JP2004349696A5 publication Critical patent/JP2004349696A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2004145277A 2003-05-19 2004-05-14 テスト基板の再生利用方法及び装置 Pending JP2004349696A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/440,937 US6954711B2 (en) 2003-05-19 2003-05-19 Test substrate reclamation method and apparatus

Publications (2)

Publication Number Publication Date
JP2004349696A true JP2004349696A (ja) 2004-12-09
JP2004349696A5 JP2004349696A5 (https=) 2007-06-28

Family

ID=33131519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004145277A Pending JP2004349696A (ja) 2003-05-19 2004-05-14 テスト基板の再生利用方法及び装置

Country Status (6)

Country Link
US (1) US6954711B2 (https=)
EP (1) EP1482538A3 (https=)
JP (1) JP2004349696A (https=)
KR (1) KR20040100996A (https=)
CN (1) CN100337305C (https=)
TW (1) TWI282137B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049432A (ja) * 2009-08-28 2011-03-10 Tokyo Electron Ltd ダミー基板の使用方法

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* Cited by examiner, † Cited by third party
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US8639365B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US20080134076A1 (en) * 2003-11-10 2008-06-05 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US8668725B2 (en) 2007-07-13 2014-03-11 Southern Spine, Llc Bone screw
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
CN102593285B (zh) * 2012-03-06 2014-07-09 华灿光电股份有限公司 一种回收图形化蓝宝石衬底的方法
JP6144924B2 (ja) 2012-03-21 2017-06-07 株式会社日立国際電気 基板処理装置、メンテナンス方法及びプログラム
EP3982134B1 (en) * 2020-10-12 2024-09-18 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Automated quality testing of component carrier structure after removing material

Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH10321486A (ja) * 1997-05-21 1998-12-04 Nec Kyushu Ltd 非製品ウェハ管理装置

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JPH1165644A (ja) * 1997-08-12 1999-03-09 Handotai Sentan Technol:Kk データ分類方法及びこれによるデータ管理方法、データベース及びデータ記録媒体
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US6500261B1 (en) * 2001-12-21 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus for preventing misplacement of a cassette pod onto a process machine
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10321486A (ja) * 1997-05-21 1998-12-04 Nec Kyushu Ltd 非製品ウェハ管理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049432A (ja) * 2009-08-28 2011-03-10 Tokyo Electron Ltd ダミー基板の使用方法

Also Published As

Publication number Publication date
TW200428557A (en) 2004-12-16
TWI282137B (en) 2007-06-01
CN1574198A (zh) 2005-02-02
US6954711B2 (en) 2005-10-11
US20040236533A1 (en) 2004-11-25
CN100337305C (zh) 2007-09-12
EP1482538A2 (en) 2004-12-01
EP1482538A3 (en) 2006-01-04
KR20040100996A (ko) 2004-12-02

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