TWI282137B - Test substrate reclamation method and apparatus - Google Patents

Test substrate reclamation method and apparatus Download PDF

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Publication number
TWI282137B
TWI282137B TW093112545A TW93112545A TWI282137B TW I282137 B TWI282137 B TW I282137B TW 093112545 A TW093112545 A TW 093112545A TW 93112545 A TW93112545 A TW 93112545A TW I282137 B TWI282137 B TW I282137B
Authority
TW
Taiwan
Prior art keywords
test
test substrate
identification data
substrate
stored
Prior art date
Application number
TW093112545A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428557A (en
Inventor
Israel Beinglass
Paul V Miller
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200428557A publication Critical patent/TW200428557A/zh
Application granted granted Critical
Publication of TWI282137B publication Critical patent/TWI282137B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093112545A 2003-05-19 2004-05-04 Test substrate reclamation method and apparatus TWI282137B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/440,937 US6954711B2 (en) 2003-05-19 2003-05-19 Test substrate reclamation method and apparatus

Publications (2)

Publication Number Publication Date
TW200428557A TW200428557A (en) 2004-12-16
TWI282137B true TWI282137B (en) 2007-06-01

Family

ID=33131519

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093112545A TWI282137B (en) 2003-05-19 2004-05-04 Test substrate reclamation method and apparatus

Country Status (6)

Country Link
US (1) US6954711B2 (https=)
EP (1) EP1482538A3 (https=)
JP (1) JP2004349696A (https=)
KR (1) KR20040100996A (https=)
CN (1) CN100337305C (https=)
TW (1) TWI282137B (https=)

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US8639365B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US20080134076A1 (en) * 2003-11-10 2008-06-05 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US8668725B2 (en) 2007-07-13 2014-03-11 Southern Spine, Llc Bone screw
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP5418071B2 (ja) * 2009-08-28 2014-02-19 東京エレクトロン株式会社 ダミー基板の使用方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
CN102593285B (zh) * 2012-03-06 2014-07-09 华灿光电股份有限公司 一种回收图形化蓝宝石衬底的方法
JP6144924B2 (ja) 2012-03-21 2017-06-07 株式会社日立国際電気 基板処理装置、メンテナンス方法及びプログラム
EP3982134B1 (en) * 2020-10-12 2024-09-18 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Automated quality testing of component carrier structure after removing material

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Also Published As

Publication number Publication date
TW200428557A (en) 2004-12-16
CN1574198A (zh) 2005-02-02
US6954711B2 (en) 2005-10-11
US20040236533A1 (en) 2004-11-25
CN100337305C (zh) 2007-09-12
EP1482538A2 (en) 2004-12-01
JP2004349696A (ja) 2004-12-09
EP1482538A3 (en) 2006-01-04
KR20040100996A (ko) 2004-12-02

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MM4A Annulment or lapse of patent due to non-payment of fees