CN100337305C - 测试衬底的回收方法和装置 - Google Patents

测试衬底的回收方法和装置 Download PDF

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Publication number
CN100337305C
CN100337305C CNB2004100383240A CN200410038324A CN100337305C CN 100337305 C CN100337305 C CN 100337305C CN B2004100383240 A CNB2004100383240 A CN B2004100383240A CN 200410038324 A CN200410038324 A CN 200410038324A CN 100337305 C CN100337305 C CN 100337305C
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CN
China
Prior art keywords
test
test substrate
identification data
recycling
substrate
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Expired - Fee Related
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CNB2004100383240A
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English (en)
Chinese (zh)
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CN1574198A (zh
Inventor
伊斯雷尔·拜恩格拉斯
保罗·V·米勒
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN1574198A publication Critical patent/CN1574198A/zh
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Publication of CN100337305C publication Critical patent/CN100337305C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNB2004100383240A 2003-05-19 2004-05-19 测试衬底的回收方法和装置 Expired - Fee Related CN100337305C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/440,937 2003-05-19
US10/440,937 US6954711B2 (en) 2003-05-19 2003-05-19 Test substrate reclamation method and apparatus

Publications (2)

Publication Number Publication Date
CN1574198A CN1574198A (zh) 2005-02-02
CN100337305C true CN100337305C (zh) 2007-09-12

Family

ID=33131519

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100383240A Expired - Fee Related CN100337305C (zh) 2003-05-19 2004-05-19 测试衬底的回收方法和装置

Country Status (6)

Country Link
US (1) US6954711B2 (https=)
EP (1) EP1482538A3 (https=)
JP (1) JP2004349696A (https=)
KR (1) KR20040100996A (https=)
CN (1) CN100337305C (https=)
TW (1) TWI282137B (https=)

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US8639365B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US20080134076A1 (en) * 2003-11-10 2008-06-05 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US8668725B2 (en) 2007-07-13 2014-03-11 Southern Spine, Llc Bone screw
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP5418071B2 (ja) * 2009-08-28 2014-02-19 東京エレクトロン株式会社 ダミー基板の使用方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
CN102593285B (zh) * 2012-03-06 2014-07-09 华灿光电股份有限公司 一种回收图形化蓝宝石衬底的方法
JP6144924B2 (ja) 2012-03-21 2017-06-07 株式会社日立国際電気 基板処理装置、メンテナンス方法及びプログラム
EP3982134B1 (en) * 2020-10-12 2024-09-18 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Automated quality testing of component carrier structure after removing material

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US6061605A (en) * 1996-06-21 2000-05-09 Micron Technology, Inc. Methods of treating a semiconductor wafer
JP2000206480A (ja) * 1999-01-14 2000-07-28 Advanced Display Inc 液晶表示装置の修復支援装置およびその方法
CN1384544A (zh) * 2001-03-21 2002-12-11 株式会社东芝 具有id标记的半导体晶片,及从中生产半导体器件的方法和设备

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US5907492A (en) 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
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JPH1165644A (ja) * 1997-08-12 1999-03-09 Handotai Sentan Technol:Kk データ分類方法及びこれによるデータ管理方法、データベース及びデータ記録媒体
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US6563070B2 (en) 1999-03-30 2003-05-13 Micron Technology, Inc. Enhanced grading and sorting of semiconductor devices using modular “plug-in” sort algorithms
JP2000311930A (ja) * 1999-04-28 2000-11-07 Agilent Technologies Japan Ltd 半導体検査装置と半導体検査装置におけるウエハ上の各ダイの属性を指定する方法
US6265684B1 (en) * 1999-10-28 2001-07-24 Promos Technologies Inc. Wafer ID optical sorting system
US6431814B1 (en) * 2000-02-02 2002-08-13 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter with integrity verification system
US6470231B1 (en) * 2000-04-21 2002-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for auto dispatching wafer
US6303398B1 (en) * 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
US6530734B2 (en) * 2000-12-08 2003-03-11 Adept Technology, Inc. Methods and apparatus for positive wafer process status identification during semiconductor wafer processing
US6500261B1 (en) * 2001-12-21 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus for preventing misplacement of a cassette pod onto a process machine
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
US5432702A (en) * 1994-06-17 1995-07-11 Advanced Micro Devices Inc. Bar code recipe selection system using workstation controllers
US6061605A (en) * 1996-06-21 2000-05-09 Micron Technology, Inc. Methods of treating a semiconductor wafer
JP2000206480A (ja) * 1999-01-14 2000-07-28 Advanced Display Inc 液晶表示装置の修復支援装置およびその方法
CN1384544A (zh) * 2001-03-21 2002-12-11 株式会社东芝 具有id标记的半导体晶片,及从中生产半导体器件的方法和设备

Also Published As

Publication number Publication date
TW200428557A (en) 2004-12-16
TWI282137B (en) 2007-06-01
CN1574198A (zh) 2005-02-02
US6954711B2 (en) 2005-10-11
US20040236533A1 (en) 2004-11-25
EP1482538A2 (en) 2004-12-01
JP2004349696A (ja) 2004-12-09
EP1482538A3 (en) 2006-01-04
KR20040100996A (ko) 2004-12-02

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Granted publication date: 20070912