KR20040100996A - 테스트 기판 재생 방법 및 장치 - Google Patents

테스트 기판 재생 방법 및 장치 Download PDF

Info

Publication number
KR20040100996A
KR20040100996A KR1020040035669A KR20040035669A KR20040100996A KR 20040100996 A KR20040100996 A KR 20040100996A KR 1020040035669 A KR1020040035669 A KR 1020040035669A KR 20040035669 A KR20040035669 A KR 20040035669A KR 20040100996 A KR20040100996 A KR 20040100996A
Authority
KR
South Korea
Prior art keywords
test
test substrate
identification data
stored
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020040035669A
Other languages
English (en)
Korean (ko)
Inventor
바인글래스이스라엘
밀러폴브이
Original Assignee
어플라이드 머티어리얼즈 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어플라이드 머티어리얼즈 인코포레이티드 filed Critical 어플라이드 머티어리얼즈 인코포레이티드
Publication of KR20040100996A publication Critical patent/KR20040100996A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020040035669A 2003-05-19 2004-05-19 테스트 기판 재생 방법 및 장치 Withdrawn KR20040100996A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/440,937 2003-05-19
US10/440,937 US6954711B2 (en) 2003-05-19 2003-05-19 Test substrate reclamation method and apparatus

Publications (1)

Publication Number Publication Date
KR20040100996A true KR20040100996A (ko) 2004-12-02

Family

ID=33131519

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040035669A Withdrawn KR20040100996A (ko) 2003-05-19 2004-05-19 테스트 기판 재생 방법 및 장치

Country Status (6)

Country Link
US (1) US6954711B2 (https=)
EP (1) EP1482538A3 (https=)
JP (1) JP2004349696A (https=)
KR (1) KR20040100996A (https=)
CN (1) CN100337305C (https=)
TW (1) TWI282137B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10290516B2 (en) 2012-03-21 2019-05-14 Kokusai Electric Corpoation Substrate processing apparatus, maintenance method, and maintenance program

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8639365B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US20080134076A1 (en) * 2003-11-10 2008-06-05 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US8668725B2 (en) 2007-07-13 2014-03-11 Southern Spine, Llc Bone screw
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP5418071B2 (ja) * 2009-08-28 2014-02-19 東京エレクトロン株式会社 ダミー基板の使用方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
CN102593285B (zh) * 2012-03-06 2014-07-09 华灿光电股份有限公司 一种回收图形化蓝宝石衬底的方法
EP3982134B1 (en) * 2020-10-12 2024-09-18 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Automated quality testing of component carrier structure after removing material

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583561A (en) * 1968-12-19 1971-06-08 Transistor Automation Corp Die sorting system
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
EP0165364B1 (fr) * 1984-06-20 1988-09-07 International Business Machines Corporation Procédé de standardisation et de stabilisation de tranches semiconductrices
US5625816A (en) * 1994-04-05 1997-04-29 Advanced Micro Devices, Inc. Method and system for generating product performance history
US5432702A (en) * 1994-06-17 1995-07-11 Advanced Micro Devices Inc. Bar code recipe selection system using workstation controllers
US5654204A (en) * 1994-07-20 1997-08-05 Anderson; James C. Die sorter
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
JP3226780B2 (ja) * 1996-02-27 2001-11-05 東芝マイクロエレクトロニクス株式会社 半導体装置のテストハンドラ
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US20010014884A1 (en) * 1996-07-12 2001-08-16 Kelly Eugene Dillard Copy protection for database updates transmitted via the internet
US6138256A (en) 1998-03-27 2000-10-24 Micron Technology, Inc. Intelligent binning for electrically repairable semiconductor chips
US6100486A (en) * 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US5856923A (en) * 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US5949584A (en) * 1997-05-13 1999-09-07 Northeast Robotics Llc Wafer
JP3048956B2 (ja) * 1997-05-21 2000-06-05 九州日本電気株式会社 非製品ウェハ管理装置
US5907492A (en) 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US5966459A (en) * 1997-07-17 1999-10-12 Advanced Micro Devices, Inc. Automatic defect classification (ADC) reclassification engine
JPH1165644A (ja) * 1997-08-12 1999-03-09 Handotai Sentan Technol:Kk データ分類方法及びこれによるデータ管理方法、データベース及びデータ記録媒体
JPH11121577A (ja) * 1997-10-08 1999-04-30 Mecs Corp 半導体ウェハの検査システム
US5999003A (en) * 1997-12-12 1999-12-07 Advanced Micro Devices, Inc. Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
JP4077951B2 (ja) * 1998-01-14 2008-04-23 株式会社ルネサステクノロジ 欠陥解析方法、記録媒体及び工程管理方法
US6203617B1 (en) * 1998-03-26 2001-03-20 Tokyo Electron Limited Conveying unit and substrate processing unit
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
DE19840200A1 (de) * 1998-09-03 2000-03-09 Wacker Chemie Gmbh Klassiervorrichtung
JP4013350B2 (ja) * 1998-09-18 2007-11-28 株式会社日立製作所 廃工業製品のリサイクルシステム
US6449522B1 (en) * 1998-11-17 2002-09-10 Micro Devices, Inc. Managing a semiconductor fabrication facility using wafer lot and cassette attributes
JP2000206480A (ja) * 1999-01-14 2000-07-28 Advanced Display Inc 液晶表示装置の修復支援装置およびその方法
US6563070B2 (en) 1999-03-30 2003-05-13 Micron Technology, Inc. Enhanced grading and sorting of semiconductor devices using modular “plug-in” sort algorithms
JP2000311930A (ja) * 1999-04-28 2000-11-07 Agilent Technologies Japan Ltd 半導体検査装置と半導体検査装置におけるウエハ上の各ダイの属性を指定する方法
US6265684B1 (en) * 1999-10-28 2001-07-24 Promos Technologies Inc. Wafer ID optical sorting system
US6431814B1 (en) * 2000-02-02 2002-08-13 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter with integrity verification system
US6470231B1 (en) * 2000-04-21 2002-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for auto dispatching wafer
US6303398B1 (en) * 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
US6530734B2 (en) * 2000-12-08 2003-03-11 Adept Technology, Inc. Methods and apparatus for positive wafer process status identification during semiconductor wafer processing
JP4071476B2 (ja) * 2001-03-21 2008-04-02 株式会社東芝 半導体ウェーハ及び半導体ウェーハの製造方法
US6500261B1 (en) * 2001-12-21 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus for preventing misplacement of a cassette pod onto a process machine
US6807455B2 (en) * 2002-06-26 2004-10-19 Dainippon Screen Mfg. Co. Ltd. System for and method of processing substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10290516B2 (en) 2012-03-21 2019-05-14 Kokusai Electric Corpoation Substrate processing apparatus, maintenance method, and maintenance program

Also Published As

Publication number Publication date
TW200428557A (en) 2004-12-16
TWI282137B (en) 2007-06-01
CN1574198A (zh) 2005-02-02
US6954711B2 (en) 2005-10-11
US20040236533A1 (en) 2004-11-25
CN100337305C (zh) 2007-09-12
EP1482538A2 (en) 2004-12-01
JP2004349696A (ja) 2004-12-09
EP1482538A3 (en) 2006-01-04

Similar Documents

Publication Publication Date Title
KR20040100996A (ko) 테스트 기판 재생 방법 및 장치
US7657390B2 (en) Reclaiming substrates having defects and contaminants
JP7447087B2 (ja) エッジリング部品番号をスロット番号にマッピングするための識別子の使用
WO1993009565A1 (fr) Appareil et procede pour la fabrication de tranches de semi-conducteur
US6718223B1 (en) Method of processing semiconductor wafer and semiconductor wafer supporting member
JPH05315207A (ja) 半導体装置
CN101383310B (zh) 用于生产线的管理系统和管理方法
US7045387B1 (en) Method of performing back-end manufacturing of an integrated circuit device
US6599763B1 (en) Wafer randomization and alignment system integrated into a multiple chamber wafer processing system
JP2008293508A (ja) 半導体ウエハの加工方法および半導体ウエハ支持部材
JPH06183524A (ja) キャリアカセットの管理方法および管理装置
JP4381673B2 (ja) 生産ラインの管理方法
US7810645B2 (en) Paddle for securely mounting a wafer cassette holder thereto
US6622111B1 (en) Wafer rotation in semiconductor processing
EP1180788A1 (en) Method for wafer position data retrieval in semiconductor wafer manufacturing
CN100428438C (zh) 在处理工具内交换传送盒的方法和系统
US6730532B1 (en) Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
US20060293780A1 (en) Systems and methods for tool monitoring
JP2004507082A5 (https=)
JP2004145792A6 (ja) 生産ラインの管理方法
CN101556436A (zh) 光罩追踪监控系统及方法
JP3144167B2 (ja) 半導体装置の製造方法
US6620636B2 (en) Semiconductor manufacturing method and semiconductor manufacturing apparatus
KR20260058688A (ko) 공정중 반도체기판 관리방법
Merrill et al. Yield and equipment utilization improvements achieved through fab conversion to carbon fiber/PEEK wafer carriers and carbon fiber/polypropylene storage boxes

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000