JP2004507082A5 - - Google Patents

Download PDF

Info

Publication number
JP2004507082A5
JP2004507082A5 JP2002520274A JP2002520274A JP2004507082A5 JP 2004507082 A5 JP2004507082 A5 JP 2004507082A5 JP 2002520274 A JP2002520274 A JP 2002520274A JP 2002520274 A JP2002520274 A JP 2002520274A JP 2004507082 A5 JP2004507082 A5 JP 2004507082A5
Authority
JP
Japan
Prior art keywords
product
processing
orders
series
steps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002520274A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004507082A (ja
Filing date
Publication date
Priority claimed from EP00117733A external-priority patent/EP1180788A1/en
Application filed filed Critical
Publication of JP2004507082A publication Critical patent/JP2004507082A/ja
Publication of JP2004507082A5 publication Critical patent/JP2004507082A5/ja
Pending legal-status Critical Current

Links

JP2002520274A 2000-08-17 2001-08-01 半導体ウエハ製造においてウエハ位置データを検索する方法 Pending JP2004507082A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00117733A EP1180788A1 (en) 2000-08-17 2000-08-17 Method for wafer position data retrieval in semiconductor wafer manufacturing
PCT/EP2001/008900 WO2002015235A1 (en) 2000-08-17 2001-08-01 Method for wafer position data retrieval in semiconductor wafer manufacturing

Publications (2)

Publication Number Publication Date
JP2004507082A JP2004507082A (ja) 2004-03-04
JP2004507082A5 true JP2004507082A5 (https=) 2005-02-17

Family

ID=8169562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002520274A Pending JP2004507082A (ja) 2000-08-17 2001-08-01 半導体ウエハ製造においてウエハ位置データを検索する方法

Country Status (7)

Country Link
US (1) US6909932B2 (https=)
EP (2) EP1180788A1 (https=)
JP (1) JP2004507082A (https=)
KR (1) KR100523826B1 (https=)
DE (1) DE60130896T2 (https=)
TW (1) TW503501B (https=)
WO (1) WO2002015235A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7894174B2 (en) * 2004-08-23 2011-02-22 Monolithic Power Systems, Inc. Method and apparatus for fault detection scheme for cold cathode fluorescent lamp (CCFL) integrated circuits
CN101453818B (zh) * 2007-11-29 2014-03-19 杭州茂力半导体技术有限公司 放电灯的电路保护和调节装置
US7826914B2 (en) * 2008-06-27 2010-11-02 International Business Machines Corporation System and method for tracking transports in a production process
US20110153660A1 (en) * 2008-10-15 2011-06-23 Inotera Memories, Inc. Method of searching for key semiconductor operation with randomization for wafer position
JP6525500B2 (ja) * 2014-02-03 2019-06-05 キヤノン株式会社 パターン形成方法、リソグラフィ装置及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761065A (en) * 1995-03-30 1998-06-02 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
US5716856A (en) * 1995-08-22 1998-02-10 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs
US6259960B1 (en) * 1996-11-01 2001-07-10 Joel Ltd. Part-inspecting system
US6300584B1 (en) * 1998-12-23 2001-10-09 Mirae Corporation Loading/unloading control apparatus of semiconductor device and control method thereof
TW426872B (en) * 1999-10-08 2001-03-21 Taiwan Semiconductor Mfg Method of preventing contamination in process
US6684125B2 (en) * 2000-12-31 2004-01-27 Texas Instruments Incorporated In-situ randomization and recording of wafer processing order at process tools
JP3870052B2 (ja) * 2001-09-20 2007-01-17 株式会社日立製作所 半導体装置の製造方法及び欠陥検査データ処理方法

Similar Documents

Publication Publication Date Title
JP7498858B2 (ja) 注文処理及び出庫方法、設備、システム、並びに記憶媒体
EP3601109A1 (en) Systems and methods for processing objects including a zone gantry system
US7039495B1 (en) Management of multiple types of empty carriers in automated material handling systems
MY107676A (en) Automatically operable manufacturing and machining plant
US6821082B2 (en) Wafer management system and methods for managing wafers
TW523800B (en) Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
JP2004507082A5 (https=)
KR20040100996A (ko) 테스트 기판 재생 방법 및 장치
US8015040B2 (en) Methods, systems, and computer program products for product randomization and analysis in a manufacturing environment
JP2000188316A5 (ja) 搬送方法および装置
JPS62251811A (ja) 貨物自動積付システム
EP1309988B1 (en) Method for wafer position data retrieval in semiconductor wafer manufacturing
US20050096782A1 (en) Automated sorter system and method thereof
JP3301228B2 (ja) 製造工程における物品の工程管理方法
US20060293780A1 (en) Systems and methods for tool monitoring
JP3222196B2 (ja) 形状データ制御の搬送格納システム
TW557480B (en) Automatic wafer sorting system and method
CN100428438C (zh) 在处理工具内交换传送盒的方法和系统
US7810645B2 (en) Paddle for securely mounting a wafer cassette holder thereto
JP2000280146A (ja) 熱処理設備を含んだｆｍｓにおける生産方法及び該生産方法を用いたｆｍｓ
JP2001088913A (ja) Ｆｍｓにおける搬送方法及び搬送装置
JP3144167B2 (ja) 半導体装置の製造方法
US20070213863A1 (en) System and method for correcting material and data mismatch in an automated manufacturing environment
JPH03222452A (ja) カセット収納方法および多数カセットの処理設備
JP2000280149A (ja) 熱処理設備を含んだｆｍｓにおける生産方法及び該生産方法を用いたｆｍｓ