JP2004507082A - 半導体ウエハ製造においてウエハ位置データを検索する方法 - Google Patents

半導体ウエハ製造においてウエハ位置データを検索する方法 Download PDF

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Publication number
JP2004507082A
JP2004507082A JP2002520274A JP2002520274A JP2004507082A JP 2004507082 A JP2004507082 A JP 2004507082A JP 2002520274 A JP2002520274 A JP 2002520274A JP 2002520274 A JP2002520274 A JP 2002520274A JP 2004507082 A JP2004507082 A JP 2004507082A
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JP
Japan
Prior art keywords
product
processing
handling
order
orders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2002520274A
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English (en)
Japanese (ja)
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JP2004507082A5 (https=
Inventor
ハシュケ，　ジルカ
ウィンターガースト，　アンドレアス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies SC300 GmbH and Co KG
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Infineon Technologies SC300 GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Infineon Technologies SC300 GmbH and Co KG filed Critical Infineon Technologies SC300 GmbH and Co KG
Publication of JP2004507082A publication Critical patent/JP2004507082A/ja
Publication of JP2004507082A5 publication Critical patent/JP2004507082A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices
JP2002520274A 2000-08-17 2001-08-01 半導体ウエハ製造においてウエハ位置データを検索する方法 Pending JP2004507082A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00117733A EP1180788A1 (en) 2000-08-17 2000-08-17 Method for wafer position data retrieval in semiconductor wafer manufacturing
PCT/EP2001/008900 WO2002015235A1 (en) 2000-08-17 2001-08-01 Method for wafer position data retrieval in semiconductor wafer manufacturing

Publications (2)

Publication Number Publication Date
JP2004507082A true JP2004507082A (ja) 2004-03-04
JP2004507082A5 JP2004507082A5 (https=) 2005-02-17

Family

ID=8169562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002520274A Pending JP2004507082A (ja) 2000-08-17 2001-08-01 半導体ウエハ製造においてウエハ位置データを検索する方法

Country Status (7)

Country Link
US (1) US6909932B2 (https=)
EP (2) EP1180788A1 (https=)
JP (1) JP2004507082A (https=)
KR (1) KR100523826B1 (https=)
DE (1) DE60130896T2 (https=)
TW (1) TW503501B (https=)
WO (1) WO2002015235A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7894174B2 (en) * 2004-08-23 2011-02-22 Monolithic Power Systems, Inc. Method and apparatus for fault detection scheme for cold cathode fluorescent lamp (CCFL) integrated circuits
CN101453818B (zh) * 2007-11-29 2014-03-19 杭州茂力半导体技术有限公司 放电灯的电路保护和调节装置
US7826914B2 (en) * 2008-06-27 2010-11-02 International Business Machines Corporation System and method for tracking transports in a production process
US20110153660A1 (en) * 2008-10-15 2011-06-23 Inotera Memories, Inc. Method of searching for key semiconductor operation with randomization for wafer position
JP6525500B2 (ja) * 2014-02-03 2019-06-05 キヤノン株式会社 パターン形成方法、リソグラフィ装置及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761065A (en) * 1995-03-30 1998-06-02 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
US5716856A (en) * 1995-08-22 1998-02-10 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs
US6259960B1 (en) * 1996-11-01 2001-07-10 Joel Ltd. Part-inspecting system
US6300584B1 (en) * 1998-12-23 2001-10-09 Mirae Corporation Loading/unloading control apparatus of semiconductor device and control method thereof
TW426872B (en) * 1999-10-08 2001-03-21 Taiwan Semiconductor Mfg Method of preventing contamination in process
US6684125B2 (en) * 2000-12-31 2004-01-27 Texas Instruments Incorporated In-situ randomization and recording of wafer processing order at process tools
JP3870052B2 (ja) * 2001-09-20 2007-01-17 株式会社日立製作所 半導体装置の製造方法及び欠陥検査データ処理方法

Also Published As

Publication number Publication date
EP1309988A1 (en) 2003-05-14
KR100523826B1 (ko) 2005-10-25
EP1180788A1 (en) 2002-02-20
WO2002015235A1 (en) 2002-02-21
DE60130896D1 (de) 2007-11-22
US6909932B2 (en) 2005-06-21
EP1309988B1 (en) 2007-10-10
TW503501B (en) 2002-09-21
DE60130896T2 (de) 2008-08-21
US20030144757A1 (en) 2003-07-31
KR20030064375A (ko) 2003-07-31

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