TW503501B - Method for wafer position data retrieval in semiconductor wafer manufacturing - Google Patents

Method for wafer position data retrieval in semiconductor wafer manufacturing Download PDF

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Publication number
TW503501B
TW503501B TW090120079A TW90120079A TW503501B TW 503501 B TW503501 B TW 503501B TW 090120079 A TW090120079 A TW 090120079A TW 90120079 A TW90120079 A TW 90120079A TW 503501 B TW503501 B TW 503501B
Authority
TW
Taiwan
Prior art keywords
product
processing
instruction
instructions
patent application
Prior art date
Application number
TW090120079A
Other languages
English (en)
Chinese (zh)
Inventor
Silka Haschke
Andreas Wintergerst
Original Assignee
Infineon Technologies Sc300
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Sc300 filed Critical Infineon Technologies Sc300
Application granted granted Critical
Publication of TW503501B publication Critical patent/TW503501B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0611—Sorting devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
TW090120079A 2000-08-17 2001-08-16 Method for wafer position data retrieval in semiconductor wafer manufacturing TW503501B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP00117733A EP1180788A1 (en) 2000-08-17 2000-08-17 Method for wafer position data retrieval in semiconductor wafer manufacturing

Publications (1)

Publication Number Publication Date
TW503501B true TW503501B (en) 2002-09-21

Family

ID=8169562

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090120079A TW503501B (en) 2000-08-17 2001-08-16 Method for wafer position data retrieval in semiconductor wafer manufacturing

Country Status (7)

Country Link
US (1) US6909932B2 (https=)
EP (2) EP1180788A1 (https=)
JP (1) JP2004507082A (https=)
KR (1) KR100523826B1 (https=)
DE (1) DE60130896T2 (https=)
TW (1) TW503501B (https=)
WO (1) WO2002015235A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7894174B2 (en) * 2004-08-23 2011-02-22 Monolithic Power Systems, Inc. Method and apparatus for fault detection scheme for cold cathode fluorescent lamp (CCFL) integrated circuits
CN101453818B (zh) * 2007-11-29 2014-03-19 杭州茂力半导体技术有限公司 放电灯的电路保护和调节装置
US7826914B2 (en) * 2008-06-27 2010-11-02 International Business Machines Corporation System and method for tracking transports in a production process
US20110153660A1 (en) * 2008-10-15 2011-06-23 Inotera Memories, Inc. Method of searching for key semiconductor operation with randomization for wafer position
JP6525500B2 (ja) * 2014-02-03 2019-06-05 キヤノン株式会社 パターン形成方法、リソグラフィ装置及び物品の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5761065A (en) * 1995-03-30 1998-06-02 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing
JP3185595B2 (ja) * 1995-04-03 2001-07-11 株式会社ダイフク 基板仕分け装置を備えた荷保管設備
US5716856A (en) * 1995-08-22 1998-02-10 Advanced Micro Devices, Inc. Arrangement and method for detecting sequential processing effects in manufacturing using predetermined sequences within runs
US6259960B1 (en) * 1996-11-01 2001-07-10 Joel Ltd. Part-inspecting system
US6300584B1 (en) * 1998-12-23 2001-10-09 Mirae Corporation Loading/unloading control apparatus of semiconductor device and control method thereof
TW426872B (en) * 1999-10-08 2001-03-21 Taiwan Semiconductor Mfg Method of preventing contamination in process
US6684125B2 (en) * 2000-12-31 2004-01-27 Texas Instruments Incorporated In-situ randomization and recording of wafer processing order at process tools
JP3870052B2 (ja) * 2001-09-20 2007-01-17 株式会社日立製作所 半導体装置の製造方法及び欠陥検査データ処理方法

Also Published As

Publication number Publication date
EP1309988A1 (en) 2003-05-14
JP2004507082A (ja) 2004-03-04
KR100523826B1 (ko) 2005-10-25
EP1180788A1 (en) 2002-02-20
WO2002015235A1 (en) 2002-02-21
DE60130896D1 (de) 2007-11-22
US6909932B2 (en) 2005-06-21
EP1309988B1 (en) 2007-10-10
DE60130896T2 (de) 2008-08-21
US20030144757A1 (en) 2003-07-31
KR20030064375A (ko) 2003-07-31

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