JP2004349696A5 - - Google Patents

Download PDF

Info

Publication number
JP2004349696A5
JP2004349696A5 JP2004145277A JP2004145277A JP2004349696A5 JP 2004349696 A5 JP2004349696 A5 JP 2004349696A5 JP 2004145277 A JP2004145277 A JP 2004145277A JP 2004145277 A JP2004145277 A JP 2004145277A JP 2004349696 A5 JP2004349696 A5 JP 2004349696A5
Authority
JP
Japan
Prior art keywords
test
identification data
recycle
boards
read
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004145277A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004349696A (ja
Filing date
Publication date
Priority claimed from US10/440,937 external-priority patent/US6954711B2/en
Application filed filed Critical
Publication of JP2004349696A publication Critical patent/JP2004349696A/ja
Publication of JP2004349696A5 publication Critical patent/JP2004349696A5/ja
Pending legal-status Critical Current

Links

JP2004145277A 2003-05-19 2004-05-14 テスト基板の再生利用方法及び装置 Pending JP2004349696A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/440,937 US6954711B2 (en) 2003-05-19 2003-05-19 Test substrate reclamation method and apparatus

Publications (2)

Publication Number Publication Date
JP2004349696A JP2004349696A (ja) 2004-12-09
JP2004349696A5 true JP2004349696A5 (https=) 2007-06-28

Family

ID=33131519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004145277A Pending JP2004349696A (ja) 2003-05-19 2004-05-14 テスト基板の再生利用方法及び装置

Country Status (6)

Country Link
US (1) US6954711B2 (https=)
EP (1) EP1482538A3 (https=)
JP (1) JP2004349696A (https=)
KR (1) KR20040100996A (https=)
CN (1) CN100337305C (https=)
TW (1) TWI282137B (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8639365B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US8639489B2 (en) 2003-11-10 2014-01-28 Brooks Automation, Inc. Methods and systems for controlling a semiconductor fabrication process
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070282480A1 (en) * 2003-11-10 2007-12-06 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
US20080134076A1 (en) * 2003-11-10 2008-06-05 Pannese Patrick D Methods and systems for controlling a semiconductor fabrication process
JP4444154B2 (ja) * 2005-05-02 2010-03-31 大日本スクリーン製造株式会社 基板処理装置
US7657390B2 (en) * 2005-11-02 2010-02-02 Applied Materials, Inc. Reclaiming substrates having defects and contaminants
US20080293329A1 (en) * 2007-05-21 2008-11-27 Applied Materials, Inc. Methods and apparatus for identifying a substrate edge profile and adjusting the processing of the substrate according to the identified edge profile
US8668725B2 (en) 2007-07-13 2014-03-11 Southern Spine, Llc Bone screw
US8210904B2 (en) * 2008-04-29 2012-07-03 International Business Machines Corporation Slurryless mechanical planarization for substrate reclamation
JP5418071B2 (ja) * 2009-08-28 2014-02-19 東京エレクトロン株式会社 ダミー基板の使用方法
JP2011054619A (ja) * 2009-08-31 2011-03-17 Hitachi Kokusai Electric Inc 基板処理装置
CN102593285B (zh) * 2012-03-06 2014-07-09 华灿光电股份有限公司 一种回收图形化蓝宝石衬底的方法
JP6144924B2 (ja) 2012-03-21 2017-06-07 株式会社日立国際電気 基板処理装置、メンテナンス方法及びプログラム
EP3982134B1 (en) * 2020-10-12 2024-09-18 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Automated quality testing of component carrier structure after removing material

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3583561A (en) * 1968-12-19 1971-06-08 Transistor Automation Corp Die sorting system
US4510673A (en) * 1983-06-23 1985-04-16 International Business Machines Corporation Laser written chip identification method
EP0165364B1 (fr) * 1984-06-20 1988-09-07 International Business Machines Corporation Procédé de standardisation et de stabilisation de tranches semiconductrices
US5625816A (en) * 1994-04-05 1997-04-29 Advanced Micro Devices, Inc. Method and system for generating product performance history
US5432702A (en) * 1994-06-17 1995-07-11 Advanced Micro Devices Inc. Bar code recipe selection system using workstation controllers
US5654204A (en) * 1994-07-20 1997-08-05 Anderson; James C. Die sorter
US5751581A (en) * 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
JP3226780B2 (ja) * 1996-02-27 2001-11-05 東芝マイクロエレクトロニクス株式会社 半導体装置のテストハンドラ
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
US20010014884A1 (en) * 1996-07-12 2001-08-16 Kelly Eugene Dillard Copy protection for database updates transmitted via the internet
US6138256A (en) 1998-03-27 2000-10-24 Micron Technology, Inc. Intelligent binning for electrically repairable semiconductor chips
US6100486A (en) * 1998-08-13 2000-08-08 Micron Technology, Inc. Method for sorting integrated circuit devices
US5856923A (en) * 1997-03-24 1999-01-05 Micron Technology, Inc. Method for continuous, non lot-based integrated circuit manufacturing
US5949584A (en) * 1997-05-13 1999-09-07 Northeast Robotics Llc Wafer
JP3048956B2 (ja) * 1997-05-21 2000-06-05 九州日本電気株式会社 非製品ウェハ管理装置
US5907492A (en) 1997-06-06 1999-05-25 Micron Technology, Inc. Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
US5966459A (en) * 1997-07-17 1999-10-12 Advanced Micro Devices, Inc. Automatic defect classification (ADC) reclassification engine
JPH1165644A (ja) * 1997-08-12 1999-03-09 Handotai Sentan Technol:Kk データ分類方法及びこれによるデータ管理方法、データベース及びデータ記録媒体
JPH11121577A (ja) * 1997-10-08 1999-04-30 Mecs Corp 半導体ウェハの検査システム
US5999003A (en) * 1997-12-12 1999-12-07 Advanced Micro Devices, Inc. Intelligent usage of first pass defect data for improved statistical accuracy of wafer level classification
JP4077951B2 (ja) * 1998-01-14 2008-04-23 株式会社ルネサステクノロジ 欠陥解析方法、記録媒体及び工程管理方法
US6203617B1 (en) * 1998-03-26 2001-03-20 Tokyo Electron Limited Conveying unit and substrate processing unit
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
DE19840200A1 (de) * 1998-09-03 2000-03-09 Wacker Chemie Gmbh Klassiervorrichtung
JP4013350B2 (ja) * 1998-09-18 2007-11-28 株式会社日立製作所 廃工業製品のリサイクルシステム
US6449522B1 (en) * 1998-11-17 2002-09-10 Micro Devices, Inc. Managing a semiconductor fabrication facility using wafer lot and cassette attributes
JP2000206480A (ja) * 1999-01-14 2000-07-28 Advanced Display Inc 液晶表示装置の修復支援装置およびその方法
US6563070B2 (en) 1999-03-30 2003-05-13 Micron Technology, Inc. Enhanced grading and sorting of semiconductor devices using modular “plug-in” sort algorithms
JP2000311930A (ja) * 1999-04-28 2000-11-07 Agilent Technologies Japan Ltd 半導体検査装置と半導体検査装置におけるウエハ上の各ダイの属性を指定する方法
US6265684B1 (en) * 1999-10-28 2001-07-24 Promos Technologies Inc. Wafer ID optical sorting system
US6431814B1 (en) * 2000-02-02 2002-08-13 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter with integrity verification system
US6470231B1 (en) * 2000-04-21 2002-10-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for auto dispatching wafer
US6303398B1 (en) * 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
US6530734B2 (en) * 2000-12-08 2003-03-11 Adept Technology, Inc. Methods and apparatus for positive wafer process status identification during semiconductor wafer processing
JP4071476B2 (ja) * 2001-03-21 2008-04-02 株式会社東芝 半導体ウェーハ及び半導体ウェーハの製造方法
US6500261B1 (en) * 2001-12-21 2002-12-31 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus for preventing misplacement of a cassette pod onto a process machine
US6807455B2 (en) * 2002-06-26 2004-10-19 Dainippon Screen Mfg. Co. Ltd. System for and method of processing substrate

Similar Documents

Publication Publication Date Title
JP2004349696A5 (https=)
IL253189A0 (en) System and method for assigning classifications to defects detected on a wafer
DE602005012673D1 (de) Schnelles Verfahren zum Detektieren von Objekten durch statistischen Mustervergleich
FI20041524L (fi) Menetelmä elektroniikkamoduulin valmistamiseksi
WO2005111796A3 (en) Defect location identification for microdevice manufacturing and test
ATE533179T1 (de) Herstellungsverfahren für ein nichtflüchtiges speicherbauelement
EP1986217A4 (en) METHOD FOR PRODUCING A SEMICONDUCTOR SUBSTRATE
DE602005019524D1 (de) Herstellungsverfahren eines integrierten Chip-Substrat
FI20031341L (fi) Menetelmä elektroniikkamoduulin valmistamiseksi
DE602006018234D1 (de) Sockelstruktur für eine Speicherkarte
DE602006000256D1 (de) Kennzeichnungsverfahren für ein Substrat, Verfahren zur Kennzeichnung eines Arbeitsganges, Geräteherstellungsverfahren und Computerprogramm
WO2005112534A3 (en) Component mounting order deciding method and component mounting order deciding apparatus
DE602006009045D1 (de) Sockelstruktur für eine Speicherkarte
DE60123570D1 (de) Herstellungsverfahren für ein elektronisches Medium
EP4395490A4 (en) SEMICONDUCTOR MEMORY DEVICE AND ASSOCIATED MANUFACTURING METHOD AND READ/WRITE METHOD, AS WELL AS ELECTRONIC DEVICE AND MEMORY CIRCUIT
SE0303534L (sv) Metod att återvinna data för en utrustning, anläggning eller process
WO2007056013A3 (en) High density three dimensional semiconductor die package
JP2010257164A5 (ja) 半導体集積回路装置の設計方法
TW200802630A (en) Structure model description and use for scattermetry-based semiconductor manufacturing process metrology
DE60323804D1 (de) Herstellungsverfahren eines Präzisions-Kondensators für eine integrierte Schaltung
ATE444556T1 (de) Informationsträger sowie system und verfahren zum lesen eines derartigen informationsträgers
DE602006001652D1 (de) Verfahren zur bildung von spiegeln auf einem leitfähigen substrat
JP2011523139A5 (https=)
DE502005002108D1 (de) Verfahren zur funktionalisierung von biosensor-chips
WO2006127408A3 (en) Method and system for increased accuracy for extraction of electrical parameters