JP2004256876A - メッキ成形品の製造方法 - Google Patents

メッキ成形品の製造方法 Download PDF

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Publication number
JP2004256876A
JP2004256876A JP2003050092A JP2003050092A JP2004256876A JP 2004256876 A JP2004256876 A JP 2004256876A JP 2003050092 A JP2003050092 A JP 2003050092A JP 2003050092 A JP2003050092 A JP 2003050092A JP 2004256876 A JP2004256876 A JP 2004256876A
Authority
JP
Japan
Prior art keywords
nickel
plating
plating layer
bath
nickel plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003050092A
Other languages
English (en)
Japanese (ja)
Inventor
Ichiro Hayashi
一郎 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAIYO Manufacturing CO Ltd
Taiho Kogyo Co Ltd
Original Assignee
TAIYO Manufacturing CO Ltd
Taiho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAIYO Manufacturing CO Ltd, Taiho Kogyo Co Ltd filed Critical TAIYO Manufacturing CO Ltd
Priority to JP2003050092A priority Critical patent/JP2004256876A/ja
Priority to TW093102299A priority patent/TWI278538B/zh
Priority to KR1020040012227A priority patent/KR100638329B1/ko
Priority to CNB2004100082949A priority patent/CN1297693C/zh
Publication of JP2004256876A publication Critical patent/JP2004256876A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
JP2003050092A 2003-02-26 2003-02-26 メッキ成形品の製造方法 Pending JP2004256876A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003050092A JP2004256876A (ja) 2003-02-26 2003-02-26 メッキ成形品の製造方法
TW093102299A TWI278538B (en) 2003-02-26 2004-02-02 Method for producing plated molded products
KR1020040012227A KR100638329B1 (ko) 2003-02-26 2004-02-24 도금 성형품의 제조방법
CNB2004100082949A CN1297693C (zh) 2003-02-26 2004-02-26 生产电镀模制产品的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003050092A JP2004256876A (ja) 2003-02-26 2003-02-26 メッキ成形品の製造方法

Publications (1)

Publication Number Publication Date
JP2004256876A true JP2004256876A (ja) 2004-09-16

Family

ID=33115603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003050092A Pending JP2004256876A (ja) 2003-02-26 2003-02-26 メッキ成形品の製造方法

Country Status (4)

Country Link
JP (1) JP2004256876A (zh)
KR (1) KR100638329B1 (zh)
CN (1) CN1297693C (zh)
TW (1) TWI278538B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007198483A (ja) * 2006-01-26 2007-08-09 Kyocera Corp メッキ付樹脂部材の固定構造、電子機器及びメッキ付樹脂部材の固定方法
JP2008156738A (ja) * 2006-12-26 2008-07-10 Tokai Rubber Ind Ltd ニッケル電気めっき膜およびその製法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102330133A (zh) * 2011-07-27 2012-01-25 太仓市金鹿电镀有限公司 一种均匀连续镀镍的工艺
CN102719868B (zh) * 2012-07-20 2015-07-29 滨中元川金属制品（昆山）有限公司 一种不锈钢紧固件的镀镍工艺
CN106130218B (zh) * 2016-07-05 2018-03-30 扬州市新港电机有限公司 一种电动车用磁通切换永磁电机
KR102154931B1 (ko) * 2019-06-05 2020-09-10 한국내쇼날주식회사 엠블럼 전기 주조 방법 및 이를 통해 제작된 엠블럼
TWI806422B (zh) * 2022-02-14 2023-06-21 翔名科技股份有限公司 高耐蝕層狀結構及其製備方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63203786A (ja) * 1987-02-19 1988-08-23 Daido Steel Co Ltd 金属箔の電解製造方法
JPH03264686A (ja) * 1990-03-14 1991-11-25 Kobe Steel Ltd 光沢性に優れた表面処理金属材料の製造方法
CN1021237C (zh) * 1991-05-14 1993-06-16 沈阳电镀厂 稀土永磁体电镀多层镍的方法
JPH051396A (ja) * 1991-06-19 1993-01-08 Matsushita Electric Works Ltd プリント回路板の製法
CN1042843C (zh) * 1994-06-18 1999-04-07 东北大学 电镀金刚石磨具的制备方法
TW554086B (en) * 2001-02-16 2003-09-21 Taiyo Mfg Co Ltd Method for producing plated molded product

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007198483A (ja) * 2006-01-26 2007-08-09 Kyocera Corp メッキ付樹脂部材の固定構造、電子機器及びメッキ付樹脂部材の固定方法
JP2008156738A (ja) * 2006-12-26 2008-07-10 Tokai Rubber Ind Ltd ニッケル電気めっき膜およびその製法

Also Published As

Publication number Publication date
CN1530464A (zh) 2004-09-22
TWI278538B (en) 2007-04-11
KR20040076626A (ko) 2004-09-01
CN1297693C (zh) 2007-01-31
KR100638329B1 (ko) 2006-10-25
TW200500505A (en) 2005-01-01

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