JP2004250665A - 耐熱性熱伝導性材料 - Google Patents

耐熱性熱伝導性材料 Download PDF

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Publication number
JP2004250665A
JP2004250665A JP2003310797A JP2003310797A JP2004250665A JP 2004250665 A JP2004250665 A JP 2004250665A JP 2003310797 A JP2003310797 A JP 2003310797A JP 2003310797 A JP2003310797 A JP 2003310797A JP 2004250665 A JP2004250665 A JP 2004250665A
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JP
Japan
Prior art keywords
heat
metal
conductive material
organic
resistant
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Pending
Application number
JP2003310797A
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English (en)
Japanese (ja)
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JP2004250665A5 (enExample
Inventor
Takuya Shindo
卓也 信藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzuka Fuji Xerox Manufacturing Co Ltd
Original Assignee
Suzuka Fuji Xerox Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzuka Fuji Xerox Manufacturing Co Ltd filed Critical Suzuka Fuji Xerox Manufacturing Co Ltd
Priority to JP2003310797A priority Critical patent/JP2004250665A/ja
Priority to PCT/JP2004/000007 priority patent/WO2004067606A1/ja
Priority to US10/544,168 priority patent/US20060142471A1/en
Publication of JP2004250665A publication Critical patent/JP2004250665A/ja
Publication of JP2004250665A5 publication Critical patent/JP2004250665A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/58—Metal-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/56—Boron-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C08K5/057—Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
JP2003310797A 2003-01-30 2003-09-03 耐熱性熱伝導性材料 Pending JP2004250665A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003310797A JP2004250665A (ja) 2003-01-30 2003-09-03 耐熱性熱伝導性材料
PCT/JP2004/000007 WO2004067606A1 (ja) 2003-01-30 2004-01-05 耐熱性熱伝導性材料
US10/544,168 US20060142471A1 (en) 2003-01-30 2004-01-05 Heat resistant thermally conductive material

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003022454 2003-01-30
JP2003310797A JP2004250665A (ja) 2003-01-30 2003-09-03 耐熱性熱伝導性材料

Publications (2)

Publication Number Publication Date
JP2004250665A true JP2004250665A (ja) 2004-09-09
JP2004250665A5 JP2004250665A5 (enExample) 2006-03-23

Family

ID=32828914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003310797A Pending JP2004250665A (ja) 2003-01-30 2003-09-03 耐熱性熱伝導性材料

Country Status (3)

Country Link
US (1) US20060142471A1 (enExample)
JP (1) JP2004250665A (enExample)
WO (1) WO2004067606A1 (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
JP2006213761A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用の樹脂組成物
JP2006213763A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用の樹脂組成物、発光部品及び該発光部品を用いた表示機器
JP2006213760A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物
JP2009292970A (ja) * 2008-06-06 2009-12-17 Suzuka Fuji Xerox Co Ltd ハイブリッド組成物
JP2010037458A (ja) * 2008-08-06 2010-02-18 Nitto Denko Corp 金属酸化物微粒子を含有してなる樹脂組成物
WO2010055628A1 (ja) * 2008-11-13 2010-05-20 国立大学法人信州大学 ポリオルガノシロキサン組成物、該組成物の硬化体および該組成物の製造方法
WO2012023618A1 (ja) * 2010-08-20 2012-02-23 日本山村硝子株式会社 フェニル基含有有機－無機ハイブリッドプレポリマー及び耐熱性有機－無機ハイブリッド材料並びに素子封止構造
WO2013125714A1 (ja) * 2012-02-22 2013-08-29 日本山村硝子株式会社 フェニル基含有有機－無機ハイブリッドプレポリマー、耐熱性有機－無機ハイブリッド材料、及び耐熱構造体

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7781063B2 (en) 2003-07-11 2010-08-24 Siemens Energy, Inc. High thermal conductivity materials with grafted surface functional groups
US7033670B2 (en) * 2003-07-11 2006-04-25 Siemens Power Generation, Inc. LCT-epoxy polymers with HTC-oligomers and method for making the same
US8216672B2 (en) * 2004-06-15 2012-07-10 Siemens Energy, Inc. Structured resin systems with high thermal conductivity fillers
US7553781B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Fabrics with high thermal conductivity coatings
US20080050580A1 (en) * 2004-06-15 2008-02-28 Stevens Gary C High Thermal Conductivity Mica Paper Tape
US7776392B2 (en) * 2005-04-15 2010-08-17 Siemens Energy, Inc. Composite insulation tape with loaded HTC materials
US20050274774A1 (en) * 2004-06-15 2005-12-15 Smith James D Insulation paper with high thermal conductivity materials
US7592045B2 (en) 2004-06-15 2009-09-22 Siemens Energy, Inc. Seeding of HTC fillers to form dendritic structures
US20050277721A1 (en) 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials aligned within resins
US7553438B2 (en) * 2004-06-15 2009-06-30 Siemens Energy, Inc. Compression of resin impregnated insulating tapes
US20050277349A1 (en) * 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials incorporated into resins
US8030818B2 (en) 2004-06-15 2011-10-04 Siemens Energy, Inc. Stator coil with improved heat dissipation
US7846853B2 (en) 2005-04-15 2010-12-07 Siemens Energy, Inc. Multi-layered platelet structure
US7651963B2 (en) * 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
US8357433B2 (en) 2005-06-14 2013-01-22 Siemens Energy, Inc. Polymer brushes
US7851059B2 (en) * 2005-06-14 2010-12-14 Siemens Energy, Inc. Nano and meso shell-core control of physical properties and performance of electrically insulating composites
US7955661B2 (en) 2005-06-14 2011-06-07 Siemens Energy, Inc. Treatment of micropores in mica materials
US20070026221A1 (en) * 2005-06-14 2007-02-01 Siemens Power Generation, Inc. Morphological forms of fillers for electrical insulation
US7781057B2 (en) 2005-06-14 2010-08-24 Siemens Energy, Inc. Seeding resins for enhancing the crystallinity of polymeric substructures
US7655295B2 (en) 2005-06-14 2010-02-02 Siemens Energy, Inc. Mix of grafted and non-grafted particles in a resin
US7547847B2 (en) * 2006-09-19 2009-06-16 Siemens Energy, Inc. High thermal conductivity dielectric tape
US20140061235A1 (en) * 2008-08-14 2014-03-06 Vladimir Ankudinov Package for paste-like products
JP5102179B2 (ja) * 2008-11-12 2012-12-19 日東電工株式会社 熱伝導性組成物およびその製造方法
US20160059998A1 (en) * 2011-02-03 2016-03-03 Vladimir Ankudinov Package for paste-like products
WO2014160112A1 (en) * 2013-03-14 2014-10-02 Dow Corning Corporation Metal thermal stabilization of polydiethylsiloxane and copolymers thereof
TW201801793A (zh) * 2016-06-15 2018-01-16 布里斯本材料科技私人有限公司 自固化混合金屬氧化物
US10633556B2 (en) 2017-12-28 2020-04-28 Flora Coatings Llc Method of producing ambient curing sprayable transparent smart quasi-ceramic coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6381176A (ja) * 1986-09-24 1988-04-12 Yoshio Ichikawa コ−テイング用組成物
JPH07278311A (ja) * 1994-04-12 1995-10-24 Nippon Steel Corp 無機・有機融合体およびその製造方法
JP3930591B2 (ja) * 1995-12-22 2007-06-13 東陶機器株式会社 光触媒性親水性コーティング組成物、親水性被膜の形成方法および被覆物品
JPH10245490A (ja) * 1997-03-06 1998-09-14 Nippon Steel Corp 粒子分散無機・有機ハイブリッド型エラストマー
JP2000038508A (ja) * 1998-07-23 2000-02-08 Ge Toshiba Silicones Co Ltd 熱伝導性の室温硬化性ポリオルガノシロキサン組成物

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006213762A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物、発光部品及び該発光部品を用いた表示機器
JP2006213761A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用の樹脂組成物
JP2006213763A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用の樹脂組成物、発光部品及び該発光部品を用いた表示機器
JP2006213760A (ja) * 2005-02-01 2006-08-17 Asahi Kasei Corp 発光素子封止用樹脂組成物
JP2009292970A (ja) * 2008-06-06 2009-12-17 Suzuka Fuji Xerox Co Ltd ハイブリッド組成物
JP2010037458A (ja) * 2008-08-06 2010-02-18 Nitto Denko Corp 金属酸化物微粒子を含有してなる樹脂組成物
WO2010055628A1 (ja) * 2008-11-13 2010-05-20 国立大学法人信州大学 ポリオルガノシロキサン組成物、該組成物の硬化体および該組成物の製造方法
US8440848B2 (en) 2008-11-13 2013-05-14 Mie University Polyorganosiloxane composition, cured product of the composition, and method for producing the composition
WO2012023618A1 (ja) * 2010-08-20 2012-02-23 日本山村硝子株式会社 フェニル基含有有機－無機ハイブリッドプレポリマー及び耐熱性有機－無機ハイブリッド材料並びに素子封止構造
WO2013125714A1 (ja) * 2012-02-22 2013-08-29 日本山村硝子株式会社 フェニル基含有有機－無機ハイブリッドプレポリマー、耐熱性有機－無機ハイブリッド材料、及び耐熱構造体

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WO2004067606A1 (ja) 2004-08-12
US20060142471A1 (en) 2006-06-29

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