JP2004219318A - 放射線検出器 - Google Patents

放射線検出器 Download PDF

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Publication number
JP2004219318A
JP2004219318A JP2003008507A JP2003008507A JP2004219318A JP 2004219318 A JP2004219318 A JP 2004219318A JP 2003008507 A JP2003008507 A JP 2003008507A JP 2003008507 A JP2003008507 A JP 2003008507A JP 2004219318 A JP2004219318 A JP 2004219318A
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JP
Japan
Prior art keywords
core layer
chip
radiation
metal core
radiation detector
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2003008507A
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English (en)
Japanese (ja)
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JP2004219318A5 (https=
Inventor
Yoshihisa Kotooka
義久 琴岡
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2003008507A priority Critical patent/JP2004219318A/ja
Publication of JP2004219318A publication Critical patent/JP2004219318A/ja
Publication of JP2004219318A5 publication Critical patent/JP2004219318A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2003008507A 2003-01-16 2003-01-16 放射線検出器 Pending JP2004219318A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Publications (2)

Publication Number Publication Date
JP2004219318A true JP2004219318A (ja) 2004-08-05
JP2004219318A5 JP2004219318A5 (https=) 2005-11-24

Family

ID=32898277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003008507A Pending JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Country Status (1)

Country Link
JP (1) JP2004219318A (https=)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155562A (ja) * 2005-12-07 2007-06-21 Acrorad Co Ltd 放射線画像検出モジュールおよび放射線画像検出装置
WO2008007613A1 (fr) * 2006-07-11 2008-01-17 Hamamatsu Photonics K.K. Tableau de connexions et dispositif d'imagerie à semi-conducteurs
JP2008073522A (ja) * 2006-09-18 2008-04-03 General Electric Co <Ge> インタフェイス・アセンブリ、及びセンサ・アレイにデータ取得システムを一体形成する方法
JP2009076726A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009074964A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009112667A (ja) * 2007-11-09 2009-05-28 Fujifilm Corp 放射線画像撮影装置
JP2009268900A (ja) * 2008-04-30 2009-11-19 General Electric Co <Ge> 計算機式断層写真法検出器装置
US7626155B2 (en) 2004-10-26 2009-12-01 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
WO2010038877A1 (ja) * 2008-10-03 2010-04-08 株式会社 東芝 放射線検出装置及び放射線撮影装置
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
JP2015503096A (ja) * 2011-11-29 2015-01-29 コーニンクレッカ フィリップス エヌ ヴェ Ｘ線吸収封止部を含むシンチレータパックおよびかかるシンチレータパックを有するｘ線検出器アレイ
WO2016174939A1 (ja) * 2015-04-27 2016-11-03 ソニー株式会社 放射線検出装置、撮像装置、および撮像システム
CN111522052A (zh) * 2020-05-13 2020-08-11 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136298A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd プリント回路基板の製造方法
JPH0367471U (https=) * 1989-11-02 1991-07-01
JPH07209430A (ja) * 1993-12-06 1995-08-11 Minnesota Mining & Mfg Co <3M> 放射線固体検出パネル
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JPH11345956A (ja) * 1998-03-16 1999-12-14 Canon Inc 撮像装置
JP2001099942A (ja) * 1999-09-29 2001-04-13 Toshiba Corp Ｘ線平面検出装置
JP2001215281A (ja) * 2000-02-02 2001-08-10 Toshiba Corp Ｘ線ｃｔ用二次元検出器
JP2001318155A (ja) * 2000-02-28 2001-11-16 Toshiba Corp 放射線検出器、およびｘ線ｃｔ装置
JP2002034968A (ja) * 2000-07-25 2002-02-05 Toshiba Corp Ｘ線ｃｔ装置
JP2002116261A (ja) * 2000-07-04 2002-04-19 Canon Inc 放射線撮像装置及びシステム
JP2002214352A (ja) * 2001-01-19 2002-07-31 Canon Inc 放射線画像撮影装置
JP2002359476A (ja) * 2001-02-28 2002-12-13 Siemens Ag プリント板装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136298A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd プリント回路基板の製造方法
JPH0367471U (https=) * 1989-11-02 1991-07-01
JPH07209430A (ja) * 1993-12-06 1995-08-11 Minnesota Mining & Mfg Co <3M> 放射線固体検出パネル
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JPH11345956A (ja) * 1998-03-16 1999-12-14 Canon Inc 撮像装置
JP2001099942A (ja) * 1999-09-29 2001-04-13 Toshiba Corp Ｘ線平面検出装置
JP2001215281A (ja) * 2000-02-02 2001-08-10 Toshiba Corp Ｘ線ｃｔ用二次元検出器
JP2001318155A (ja) * 2000-02-28 2001-11-16 Toshiba Corp 放射線検出器、およびｘ線ｃｔ装置
JP2002116261A (ja) * 2000-07-04 2002-04-19 Canon Inc 放射線撮像装置及びシステム
JP2002034968A (ja) * 2000-07-25 2002-02-05 Toshiba Corp Ｘ線ｃｔ装置
JP2002214352A (ja) * 2001-01-19 2002-07-31 Canon Inc 放射線画像撮影装置
JP2002359476A (ja) * 2001-02-28 2002-12-13 Siemens Ag プリント板装置

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122344B1 (ko) * 2004-10-26 2012-03-27 소니 주식회사 반도체 이미지 센서 모듈, 반도체 이미지 센서 모듈의 제조방법, 카메라 및 카메라의 제조 방법
US10930694B2 (en) 2004-10-26 2021-02-23 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US7626155B2 (en) 2004-10-26 2009-12-01 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US10319772B2 (en) 2004-10-26 2019-06-11 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US9269736B2 (en) 2004-10-26 2016-02-23 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
JP2007155562A (ja) * 2005-12-07 2007-06-21 Acrorad Co Ltd 放射線画像検出モジュールおよび放射線画像検出装置
WO2008007613A1 (fr) * 2006-07-11 2008-01-17 Hamamatsu Photonics K.K. Tableau de connexions et dispositif d'imagerie à semi-conducteurs
JP2008073522A (ja) * 2006-09-18 2008-04-03 General Electric Co <Ge> インタフェイス・アセンブリ、及びセンサ・アレイにデータ取得システムを一体形成する方法
JP2009076726A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009074964A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009112667A (ja) * 2007-11-09 2009-05-28 Fujifilm Corp 放射線画像撮影装置
JP2009268900A (ja) * 2008-04-30 2009-11-19 General Electric Co <Ge> 計算機式断層写真法検出器装置
US8366319B2 (en) 2008-10-03 2013-02-05 Kabushiki Kaisha Toshiba Radiation detection apparatus and radiographic apparatus
JPWO2010038877A1 (ja) * 2008-10-03 2012-03-01 株式会社東芝 放射線検出装置及び放射線撮影装置
WO2010038877A1 (ja) * 2008-10-03 2010-04-08 株式会社 東芝 放射線検出装置及び放射線撮影装置
JP2015503096A (ja) * 2011-11-29 2015-01-29 コーニンクレッカ フィリップス エヌ ヴェ Ｘ線吸収封止部を含むシンチレータパックおよびかかるシンチレータパックを有するｘ線検出器アレイ
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
WO2016174939A1 (ja) * 2015-04-27 2016-11-03 ソニー株式会社 放射線検出装置、撮像装置、および撮像システム
CN111522052A (zh) * 2020-05-13 2020-08-11 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法
CN111522052B (zh) * 2020-05-13 2022-03-25 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法

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