JP2004176032A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004176032A5 JP2004176032A5 JP2003026332A JP2003026332A JP2004176032A5 JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5 JP 2003026332 A JP2003026332 A JP 2003026332A JP 2003026332 A JP2003026332 A JP 2003026332A JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- expansion coefficient
- temperature
- resin
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 53
- 230000009477 glass transition Effects 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 16
- 229920005992 thermoplastic resin Polymers 0.000 claims 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 5
- 150000002484 inorganic compounds Chemical class 0.000 claims 4
- 229910010272 inorganic material Inorganic materials 0.000 claims 4
- 229920001955 polyphenylene ether Polymers 0.000 claims 4
- 238000010521 absorption reaction Methods 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000012776 electronic material Substances 0.000 claims 2
- -1 ether ketone Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 229920006259 thermoplastic polyimide Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000013032 Hydrocarbon resin Substances 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims 1
- 229910000271 hectorite Inorganic materials 0.000 claims 1
- 229920006270 hydrocarbon resin Polymers 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 239000012299 nitrogen atmosphere Substances 0.000 claims 1
- 229920003055 poly(ester-imide) Polymers 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920005990 polystyrene resin Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000010455 vermiculite Substances 0.000 claims 1
- 229910052902 vermiculite Inorganic materials 0.000 claims 1
- 235000019354 vermiculite Nutrition 0.000 claims 1
- 239000013585 weight reducing agent Substances 0.000 claims 1
- 238000004736 wide-angle X-ray diffraction Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003026332A JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029783 | 2002-02-06 | ||
| JP2002139090 | 2002-05-14 | ||
| JP2002158210 | 2002-05-30 | ||
| JP2002287005 | 2002-09-30 | ||
| JP2003026332A JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005244645A Division JP5010124B2 (ja) | 2002-02-06 | 2005-08-25 | 熱可塑性樹脂組成物、シート、樹脂付き銅箔、プリント基板及びプリプレグ |
| JP2006147192A Division JP2006312745A (ja) | 2002-02-06 | 2006-05-26 | 樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004176032A JP2004176032A (ja) | 2004-06-24 |
| JP2004176032A5 true JP2004176032A5 (cg-RX-API-DMAC7.html) | 2005-09-22 |
| JP4167909B2 JP4167909B2 (ja) | 2008-10-22 |
Family
ID=32719576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003026332A Expired - Fee Related JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4167909B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4369134B2 (ja) * | 2003-01-31 | 2009-11-18 | 株式会社フジクラ | 基板及び成形品 |
| KR101079552B1 (ko) * | 2004-06-25 | 2011-11-04 | 스미또모 가가꾸 가부시끼가이샤 | 플렉시블 디스플레이용 기판 |
| JP4830365B2 (ja) * | 2004-06-25 | 2011-12-07 | 住友化学株式会社 | フレキシブルディスプレイ用基板 |
| JP4534094B2 (ja) * | 2004-07-12 | 2010-09-01 | オンキヨー株式会社 | スピーカー振動板およびその製造方法 |
| KR101293328B1 (ko) * | 2005-06-21 | 2013-08-06 | 니폰 제온 가부시키가이샤 | 편광판용 보호필름 |
| JP4693615B2 (ja) * | 2005-12-13 | 2011-06-01 | 積水化学工業株式会社 | 鉄骨用耐火被覆シート |
| JP2007211182A (ja) * | 2006-02-10 | 2007-08-23 | Kyocera Chemical Corp | 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 |
| JPWO2009107558A1 (ja) * | 2008-02-26 | 2011-06-30 | 電気化学工業株式会社 | プローブの検査方法及び硬化性樹脂組成物 |
| JP2010129964A (ja) * | 2008-12-01 | 2010-06-10 | Kurabo Ind Ltd | フレキシブルプリント配線板補強用シート及びそれを用いたフレキシブルプリント配線板 |
| JP5919989B2 (ja) * | 2011-04-19 | 2016-05-18 | 宇部興産株式会社 | ポリイミド前駆体組成物、並びにそれを用いた電極合剤ペースト、電極および塗料 |
| JP7344789B2 (ja) * | 2019-12-26 | 2023-09-14 | 信越ポリマー株式会社 | 高周波回路基板及びその製造方法 |
| CN115244449A (zh) * | 2020-03-13 | 2022-10-25 | 三菱化学株式会社 | 导光板以及ar显示器 |
| JP7584837B2 (ja) * | 2020-08-21 | 2024-11-18 | エルジー・ケム・リミテッド | ポリイミド又はその前駆体を含む組成物及びその硬化物、硬化物を含むポリイミドフィルム、ポリイミドフィルムを備える積層体、並びに積層体を備えるデバイス |
| JP7776954B2 (ja) * | 2021-09-09 | 2025-11-27 | 日東電工株式会社 | 電子部品仮固定用粘着シート |
| JP7617563B2 (ja) * | 2021-10-27 | 2025-01-20 | 信越ポリマー株式会社 | 樹脂フィルム、銅張積層板、及び回路基板 |
| WO2025013937A1 (ja) * | 2023-07-12 | 2025-01-16 | デンカ株式会社 | 積層体、回路基板及び回路基板の製造方法 |
-
2003
- 2003-02-03 JP JP2003026332A patent/JP4167909B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004176032A5 (cg-RX-API-DMAC7.html) | ||
| CN102576585B (zh) | 绝缘片、电路基板和绝缘片的制造方法 | |
| US7658988B2 (en) | Printed circuits prepared from filled epoxy compositions | |
| JP2010248473A5 (cg-RX-API-DMAC7.html) | ||
| JP6309264B2 (ja) | 絶縁材料、これを含む絶縁層組成物及び該絶縁層組成物を用いる基板 | |
| CN114181652B (zh) | 一种低介电损耗的绝缘胶膜及其制备方法和应用 | |
| JP2004176031A5 (cg-RX-API-DMAC7.html) | ||
| WO2003066740A1 (en) | Resin composition | |
| US6459047B1 (en) | Laminate circuit structure and method of fabricating | |
| CN101735456A (zh) | 高耐热的热固性树脂组合物及采用其制作的半固化片及覆铜箔层压板 | |
| CN105315615A (zh) | 一种环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 | |
| JP7457645B2 (ja) | 積層体及びその製造方法 | |
| JP4986725B2 (ja) | 複合材料 | |
| KR20070100263A (ko) | 경화성 수지 조성물 | |
| CN106433407B (zh) | 树脂组合物 | |
| JP4167909B2 (ja) | 樹脂組成物 | |
| CN101942178B (zh) | 热固性树脂组成以及铜箔层合板 | |
| JP2007138095A (ja) | 樹脂組成物及び板状体 | |
| CN103105732A (zh) | 聚酰亚胺前体组合物和使用其的布线电路基板 | |
| Brownlee et al. | Liquid crystal polymers (LCP) for high performance SOP applications | |
| JP5276152B2 (ja) | 樹脂組成物及び板状体 | |
| WO2017122820A1 (ja) | Ｆｒｐ前駆体、積層板、金属張積層板、プリント配線板、半導体パッケージ、及びそれらの製造方法 | |
| JP2008177463A (ja) | フレキシブル配線板用接着剤組成物、フレキシブル配線板用カバーレイ、および電磁波シールド層付フレキシブル配線板 | |
| JP6248390B2 (ja) | 積層体、積層板、多層積層板、プリント配線板、多層プリント配線板及び積層板の製造方法 | |
| TWI424021B (zh) | 熱固性樹脂組成以及銅箔層合板 |