JP2004176032A5 - - Google Patents

Claims (33)

A resin composition for electronic materials containing 100 parts by weight of a thermoplastic resin containing at least a thermoplastic polyimide and 0.1 to 65 parts by weight of an inorganic compound,
The average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 3.0 × 10 ^-3 [℃ ^-1 ] The resin composition characterized by the following. A resin composition for electronic materials or optical circuit forming, having transparency, comprising 100 parts by weight of a thermoplastic resin and 0.1 to 65 parts by weight of an inorganic compound,
Average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 3.0 × 10 ⁻³ [° C. ⁻¹ ]. The resin composition characterized by the following. The average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 1.0 × 10 ⁻³ [° C. ⁻¹ ]. The resin composition according to claim 1 or 2, wherein: The average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 50 ° C. higher than the glass transition temperature of the resin composition. An average linear expansion coefficient ratio (α2 / α1) obtained by dividing by an average linear expansion coefficient (α1) from a low temperature to a temperature 10 ° C. lower than the glass transition temperature of the resin composition is 70 or less. The resin composition according to any one of claims 1 to 3 . The average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 50 ° C. higher than the glass transition temperature of the resin composition. An average linear expansion coefficient ratio (α2 / α1) obtained by dividing by an average linear expansion coefficient (α1) from a low temperature to a temperature 10 ° C. lower than the glass transition temperature of the resin composition is 15 or less. The resin composition according to any one of claims 1 to 3 . The average linear expansion coefficient at 50 to 100 ° C. is 4.5 × 10 ⁻⁵ [° C. ⁻¹ ] or less, and the average linear expansion coefficient at 200 to 240 ° C. is 7 × 10 ⁻⁵ [° C. ⁻¹ ]. It is the following, The resin composition in any one of Claims 1-5 characterized by the above-mentioned. The average linear expansion coefficient ratio (1) obtained by dividing the average linear expansion coefficient at 150 to 200 ° C. by the average linear expansion coefficient at 50 to 100 ° C. is 2.0 or less, and 250 to 300 ° C. The average linear expansion coefficient ratio (2) obtained by dividing the average linear expansion coefficient by the average linear expansion coefficient at 50 to 100 ° C. is 20 or less . the resin composition according to. The rate of change obtained by dividing the amount of change in the length of the resin piece made of the resin composition from 25 ° C. to 300 ° C. by the length of the resin piece made of the resin composition at 25 ° C. is 7 % Or less, The resin composition according to any one of claims 1 to 7 . The resin composition according to any one of claims 1 to 8, wherein an average linear expansion coefficient ratio (3) represented by the following formula (1) is 1.5 or less.

However, (alpha) (degreeC) is 50 degreeC or more and 400 degrees C or less, and excludes when calculating | requiring average linear expansion coefficient ratio (3) across Tg. The average linear expansion coefficient of the resin composition from a temperature 10 ° C higher than the glass transition temperature of the resin composition to a temperature 50 ° C higher than the glass transition temperature of the resin composition is 10 ° C higher than the glass transition temperature of the resin. from a high temperature, it claims 1-9 where the mean line divided by seeking the improvement rate in the expansion coefficient of the resin to a temperature higher 50 ° C. than the glass transition temperature of the resin is characterized in that 0.50 or less The resin composition in any one of. The tensile elasticity modulus is 6 GPa or more, and the dielectric constant in 1 MHz is 3.3 or less, The resin composition in any one of Claims 1-10 characterized by the above-mentioned. The resin composition according to any one of claims 1 to 11, wherein the resin composition has a water absorption rate of 1.0% or less and a linear expansion coefficient of humidity of 1.5 x ^10-5 [% RH- ¹ ] or less. The resin according to any one of claims 1 to 12, wherein the resin has a water absorption of 1.0% or less, a dielectric constant at 1 MHz of 3.3 or less, and a dielectric constant after water absorption of 3.4 or less. Composition. The resin composition according to any one of claims 1 to 13 having a glass transition temperature, characterized in that at 100 ° C. or higher. The resin composition according to any one of claims 1 to 13, wherein the thermoplastic resin has a glass transition temperature of 100 ° C or higher and a dielectric constant at 1 MHz of 3.3 or lower. Thermoplastic resins include polyphenylene ether resins, functional group-modified polyphenylene ether resins, polyphenylene ether resins or mixtures of functional group-modified polyphenylene ether resins and polystyrene resins, alicyclic hydrocarbon resins, thermoplastic polyimide resins, ether ketone resin, a polyester imide resin, polyetherimide resin, and, according to claim 1 to 15, characterized in that at least one member selected from the group consisting of thermoplastic polybenzimidazole resin according to any one Resin composition. The resin composition according to any one of claims 1 to 16, wherein the thermoplastic resin has a solubility parameter of 42 [J / cm ³ ] ^1/2 or more determined using a Fedors formula. Thermoplastic resin, when performing thermogravimetric measurement in a nitrogen atmosphere, to claim 1-17, characterized in that 10% by weight reduction temperature to the weight at 25 ° C. is 400 ° C. or higher The resin composition as described. Inorganic compound, the resin composition according to any one of claims 1-18, characterized in that the layered silicate. The resin composition according to any one of claims 1 to 18, wherein the inorganic compound comprises at least one of whiskers and / or silica and a layered silicate. Layered silicate, montmorillonite, hectorite, swelling mica, and the resin composition according to claim 19 or 20, characterized in that at least one member selected from the group consisting of vermiculite. The layered silicate contains an alkylammonium ion having 6 or more carbon atoms, an aromatic quaternary ammonium ion, or a heterocyclic quaternary ammonium ion, according to any one of claims 19 to 21 . An average interlayer distance of (001) plane measured by wide-angle X-ray diffraction measurement method is 3 nm or more, and a layered silicate in which some or all of the laminates are 5 layers or less is dispersed. The resin composition according to any one of claims 19 to 22 . A substrate material comprising the resin composition according to any one of claims 1 to 23 . A sheet comprising the resin composition according to any one of claims 1 to 23 . A laminate comprising the resin composition according to any one of claims 1 to 23 . A resin-coated copper foil comprising the resin composition according to any one of claims 1 to 23 . A copper-clad laminate comprising the resin composition according to any one of claims 1 to 23 . A tape for TAB comprising the resin composition according to any one of claims 1 to 23 . A printed circuit board comprising the resin composition according to any one of claims 1 to 23 . Prepreg characterized by using a resin composition according to any one of claims 1 to 23. An adhesive sheet comprising the resin composition according to any one of claims 1 to 23 . An optical circuit forming material comprising the resin composition according to any one of claims 2 to 23 .