JP2004176032A5 - - Google Patents
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- JP2004176032A5 JP2004176032A5 JP2003026332A JP2003026332A JP2004176032A5 JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5 JP 2003026332 A JP2003026332 A JP 2003026332A JP 2003026332 A JP2003026332 A JP 2003026332A JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5
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- Prior art keywords
- resin composition
- expansion coefficient
- temperature
- resin
- linear expansion
- Prior art date
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Claims (33)
樹脂組成物のガラス転移温度よりも10℃高い温度から、樹脂組成物のガラス転移温度よりも50℃高い温度までの平均線膨張率(α2)が3.0×10The average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 3.0 × 10 -3-3 [℃[℃ -1-1 ]以下であることを特徴とする樹脂組成物。] The resin composition characterized by the following.
樹脂組成物のガラス転移温度よりも10℃高い温度から、樹脂組成物のガラス転移温度よりも50℃高い温度までの平均線膨張率(α2)が3.0×10-3[℃-1]以下であることを特徴とする樹脂組成物。A resin composition for electronic materials or optical circuit forming, having transparency, comprising 100 parts by weight of a thermoplastic resin and 0.1 to 65 parts by weight of an inorganic compound,
Average linear expansion coefficient (α2) from a temperature 10 ° C. higher than the glass transition temperature of the resin composition to a temperature 50 ° C. higher than the glass transition temperature of the resin composition is 3.0 × 10 −3 [° C. −1 ]. The resin composition characterized by the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003026332A JP4167909B2 (en) | 2002-02-06 | 2003-02-03 | Resin composition |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002029783 | 2002-02-06 | ||
JP2002139090 | 2002-05-14 | ||
JP2002158210 | 2002-05-30 | ||
JP2002287005 | 2002-09-30 | ||
JP2003026332A JP4167909B2 (en) | 2002-02-06 | 2003-02-03 | Resin composition |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005244645A Division JP5010124B2 (en) | 2002-02-06 | 2005-08-25 | Thermoplastic resin composition, sheet, copper foil with resin, printed circuit board, and prepreg |
JP2006147192A Division JP2006312745A (en) | 2002-02-06 | 2006-05-26 | Resin composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004176032A JP2004176032A (en) | 2004-06-24 |
JP2004176032A5 true JP2004176032A5 (en) | 2005-09-22 |
JP4167909B2 JP4167909B2 (en) | 2008-10-22 |
Family
ID=32719576
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003026332A Expired - Fee Related JP4167909B2 (en) | 2002-02-06 | 2003-02-03 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4167909B2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4369134B2 (en) * | 2003-01-31 | 2009-11-18 | 株式会社フジクラ | Substrate and molded product |
GB2430678B (en) * | 2004-06-25 | 2009-05-06 | Sumitomo Chemical Co | Substrate for flexible displays |
JP4830365B2 (en) * | 2004-06-25 | 2011-12-07 | 住友化学株式会社 | Flexible display substrate |
JP4534094B2 (en) * | 2004-07-12 | 2010-09-01 | オンキヨー株式会社 | Speaker diaphragm and manufacturing method thereof |
TWI402541B (en) * | 2005-06-21 | 2013-07-21 | Zeon Corp | Protective film for polarizing plate (1) |
JP4693615B2 (en) * | 2005-12-13 | 2011-06-01 | 積水化学工業株式会社 | Steel fireproof coating sheet |
JP2007211182A (en) * | 2006-02-10 | 2007-08-23 | Kyocera Chemical Corp | Resin composition, pre-preg, laminated board and metal-plated lamianted board and printed wiring board |
KR20110027641A (en) * | 2008-02-26 | 2011-03-16 | 덴끼 가가꾸 고교 가부시키가이샤 | Probe inspecting method and curable resin composition |
JP2010129964A (en) * | 2008-12-01 | 2010-06-10 | Kurabo Ind Ltd | Sheet for flexible printed wiring board reinforcement, and flexible printed wiring board using the same |
JP5919989B2 (en) * | 2011-04-19 | 2016-05-18 | 宇部興産株式会社 | Polyimide precursor composition, and electrode mixture paste, electrode and paint using the same |
JP7344789B2 (en) * | 2019-12-26 | 2023-09-14 | 信越ポリマー株式会社 | High frequency circuit board and its manufacturing method |
TW202138873A (en) * | 2020-03-13 | 2021-10-16 | 日商三菱化學股份有限公司 | Light-guiding plate and AR display |
JP2023039829A (en) * | 2021-09-09 | 2023-03-22 | 日東電工株式会社 | Adhesive sheet for temporarily fixing electronic component |
-
2003
- 2003-02-03 JP JP2003026332A patent/JP4167909B2/en not_active Expired - Fee Related
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