JP4167909B2 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
JP4167909B2
JP4167909B2 JP2003026332A JP2003026332A JP4167909B2 JP 4167909 B2 JP4167909 B2 JP 4167909B2 JP 2003026332 A JP2003026332 A JP 2003026332A JP 2003026332 A JP2003026332 A JP 2003026332A JP 4167909 B2 JP4167909 B2 JP 4167909B2
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JP
Japan
Prior art keywords
resin composition
resin
temperature
glass transition
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003026332A
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English (en)
Japanese (ja)
Other versions
JP2004176032A (ja
JP2004176032A5 (cg-RX-API-DMAC7.html
Inventor
昭彦 藤原
晃一 柴山
英寛 出口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2003026332A priority Critical patent/JP4167909B2/ja
Publication of JP2004176032A publication Critical patent/JP2004176032A/ja
Publication of JP2004176032A5 publication Critical patent/JP2004176032A5/ja
Application granted granted Critical
Publication of JP4167909B2 publication Critical patent/JP4167909B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2003026332A 2002-02-06 2003-02-03 樹脂組成物 Expired - Fee Related JP4167909B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003026332A JP4167909B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002029783 2002-02-06
JP2002139090 2002-05-14
JP2002158210 2002-05-30
JP2002287005 2002-09-30
JP2003026332A JP4167909B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2005244645A Division JP5010124B2 (ja) 2002-02-06 2005-08-25 熱可塑性樹脂組成物、シート、樹脂付き銅箔、プリント基板及びプリプレグ
JP2006147192A Division JP2006312745A (ja) 2002-02-06 2006-05-26 樹脂組成物

Publications (3)

Publication Number Publication Date
JP2004176032A JP2004176032A (ja) 2004-06-24
JP2004176032A5 JP2004176032A5 (cg-RX-API-DMAC7.html) 2005-09-22
JP4167909B2 true JP4167909B2 (ja) 2008-10-22

Family

ID=32719576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003026332A Expired - Fee Related JP4167909B2 (ja) 2002-02-06 2003-02-03 樹脂組成物

Country Status (1)

Country Link
JP (1) JP4167909B2 (cg-RX-API-DMAC7.html)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4369134B2 (ja) * 2003-01-31 2009-11-18 株式会社フジクラ 基板及び成形品
KR101079552B1 (ko) * 2004-06-25 2011-11-04 스미또모 가가꾸 가부시끼가이샤 플렉시블 디스플레이용 기판
JP4830365B2 (ja) * 2004-06-25 2011-12-07 住友化学株式会社 フレキシブルディスプレイ用基板
JP4534094B2 (ja) * 2004-07-12 2010-09-01 オンキヨー株式会社 スピーカー振動板およびその製造方法
KR101293328B1 (ko) * 2005-06-21 2013-08-06 니폰 제온 가부시키가이샤 편광판용 보호필름
JP4693615B2 (ja) * 2005-12-13 2011-06-01 積水化学工業株式会社 鉄骨用耐火被覆シート
JP2007211182A (ja) * 2006-02-10 2007-08-23 Kyocera Chemical Corp 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板
JPWO2009107558A1 (ja) * 2008-02-26 2011-06-30 電気化学工業株式会社 プローブの検査方法及び硬化性樹脂組成物
JP2010129964A (ja) * 2008-12-01 2010-06-10 Kurabo Ind Ltd フレキシブルプリント配線板補強用シート及びそれを用いたフレキシブルプリント配線板
JP5919989B2 (ja) * 2011-04-19 2016-05-18 宇部興産株式会社 ポリイミド前駆体組成物、並びにそれを用いた電極合剤ペースト、電極および塗料
JP7344789B2 (ja) * 2019-12-26 2023-09-14 信越ポリマー株式会社 高周波回路基板及びその製造方法
CN115244449A (zh) * 2020-03-13 2022-10-25 三菱化学株式会社 导光板以及ar显示器
JP7584837B2 (ja) * 2020-08-21 2024-11-18 エルジー・ケム・リミテッド ポリイミド又はその前駆体を含む組成物及びその硬化物、硬化物を含むポリイミドフィルム、ポリイミドフィルムを備える積層体、並びに積層体を備えるデバイス
JP7776954B2 (ja) * 2021-09-09 2025-11-27 日東電工株式会社 電子部品仮固定用粘着シート
JP7617563B2 (ja) * 2021-10-27 2025-01-20 信越ポリマー株式会社 樹脂フィルム、銅張積層板、及び回路基板
WO2025013937A1 (ja) * 2023-07-12 2025-01-16 デンカ株式会社 積層体、回路基板及び回路基板の製造方法

Also Published As

Publication number Publication date
JP2004176032A (ja) 2004-06-24

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