JP2004123775A - 感光性熱硬化性ペースト組成物 - Google Patents

感光性熱硬化性ペースト組成物 Download PDF

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Publication number
JP2004123775A
JP2004123775A JP2002285548A JP2002285548A JP2004123775A JP 2004123775 A JP2004123775 A JP 2004123775A JP 2002285548 A JP2002285548 A JP 2002285548A JP 2002285548 A JP2002285548 A JP 2002285548A JP 2004123775 A JP2004123775 A JP 2004123775A
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JP
Japan
Prior art keywords
ethylenically unsaturated
paste composition
pattern
unsaturated bond
photosensitive thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002285548A
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English (en)
Japanese (ja)
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JP2004123775A5 (https=
Inventor
Hideaki Kojima
小島 秀明
Masahisa Kakinuma
柿沼 正久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Priority to JP2002285548A priority Critical patent/JP2004123775A/ja
Priority to TW092126506A priority patent/TW200407669A/zh
Priority to CN031603955A priority patent/CN1497345B/zh
Priority to KR1020030067318A priority patent/KR20040028570A/ko
Publication of JP2004123775A publication Critical patent/JP2004123775A/ja
Publication of JP2004123775A5 publication Critical patent/JP2004123775A5/ja
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/34Filling pastes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/582Recycling of unreacted starting or intermediate materials

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Inorganic Insulating Materials (AREA)
JP2002285548A 2002-09-30 2002-09-30 感光性熱硬化性ペースト組成物 Pending JP2004123775A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002285548A JP2004123775A (ja) 2002-09-30 2002-09-30 感光性熱硬化性ペースト組成物
TW092126506A TW200407669A (en) 2002-09-30 2003-09-25 Photosensitive curable paste composition and sintered article pattern using the same
CN031603955A CN1497345B (zh) 2002-09-30 2003-09-29 感光性热固性糊状组合物以及使用其得到的烧成物图案
KR1020030067318A KR20040028570A (ko) 2002-09-30 2003-09-29 감광성 열경화성 페이스트 조성물, 및 그것을 이용하여얻어지는 소성물 패턴

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002285548A JP2004123775A (ja) 2002-09-30 2002-09-30 感光性熱硬化性ペースト組成物

Publications (2)

Publication Number Publication Date
JP2004123775A true JP2004123775A (ja) 2004-04-22
JP2004123775A5 JP2004123775A5 (https=) 2005-11-17

Family

ID=32278821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002285548A Pending JP2004123775A (ja) 2002-09-30 2002-09-30 感光性熱硬化性ペースト組成物

Country Status (4)

Country Link
JP (1) JP2004123775A (https=)
KR (1) KR20040028570A (https=)
CN (1) CN1497345B (https=)
TW (1) TW200407669A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040891A (ja) * 2004-07-22 2006-02-09 Lg Electron Inc プラズマディスプレイパネル製造用の隔壁形成用組成物
WO2007077900A1 (ja) 2005-12-28 2007-07-12 Kaneka Corporation 光ラジカル硬化/熱ラジカル硬化併用硬化性組成物
JP2017052822A (ja) * 2015-09-07 2017-03-16 三菱レイヨン株式会社 アクリル系樹脂組成物およびその製造方法
JPWO2022210785A1 (https=) * 2021-03-31 2022-10-06

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006038999A (ja) * 2004-07-23 2006-02-09 Sumitomo Electric Ind Ltd レーザ照射を用いた導電性回路形成方法と導電性回路
KR100709186B1 (ko) * 2005-06-29 2007-04-18 삼성에스디아이 주식회사 플라즈마 디스플레이 패널용 전극 형성용 조성물, 이로부터제조되는 전극 및 상기 전극을 포함하는 플라즈마디스플레이 패널
KR20070002554A (ko) * 2005-06-30 2007-01-05 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
KR100895352B1 (ko) * 2006-11-15 2009-04-29 다이요 잉키 세이조 가부시키가이샤 흑색 페이스트 조성물, 및 그것을 이용한 블랙 매트릭스패턴의 형성 방법, 및 그 블랙 매트릭스 패턴
KR100871060B1 (ko) * 2007-05-11 2008-11-27 주식회사 두산 감광성 페이스트 및 이의 이용
KR100934078B1 (ko) * 2007-12-28 2009-12-24 주식회사 두산 오프셋 인쇄용 감광성 페이스트 및 이의 이용
JP5600488B2 (ja) * 2009-08-04 2014-10-01 積水化学工業株式会社 無機微粒子分散ペースト
KR101358254B1 (ko) * 2012-02-06 2014-02-06 하나마이크로(주) 기판 상에 기능성 조성물의 패턴을 형성하는 방법 및 그 방법에 의하여 형성된 기능성 패턴을 구비한 전자 장치
CN104170021B (zh) * 2012-05-22 2017-09-15 太阳控股株式会社 导电性组合物及由其形成有导电膜的电路基板
TWI472877B (zh) * 2012-11-20 2015-02-11 Chi Mei Corp 感光性樹脂組成物、彩色濾光片及其液晶顯示元件
JP6857125B2 (ja) * 2014-12-26 2021-04-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンHenkel AG & Co. KGaA 焼結性接合材料およびそれを用いた半導体装置
CN104808441A (zh) * 2015-04-20 2015-07-29 北京欣奕华科技有限公司 组合物、黑矩阵及制备方法、显示装置
CN115119410A (zh) * 2022-06-21 2022-09-27 深圳市百柔新材料技术有限公司 一种高精密单面电路互联制作miniLED背光板的方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114183A (ja) * 1993-10-15 1995-05-02 Sony Corp 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法
US5565302A (en) * 1995-04-21 1996-10-15 W. R. Grace & Co.-Conn. Process for preparing photosensitive resin composition
US5853957A (en) * 1995-05-08 1998-12-29 Tamura Kaken Co., Ltd Photosensitive resin compositions, cured films thereof, and circuit boards
JPH08328248A (ja) * 1995-06-02 1996-12-13 Nippon Paint Co Ltd 水現像性感光性樹脂組成物
US5874197A (en) * 1997-09-18 1999-02-23 E. I. Du Pont De Nemours And Company Thermal assisted photosensitive composition and method thereof
US6458509B1 (en) * 1999-04-30 2002-10-01 Toagosei Co., Ltd. Resist compositions
TW522435B (en) * 2000-05-23 2003-03-01 Toray Industries Slurry, display component and process for producing the display component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006040891A (ja) * 2004-07-22 2006-02-09 Lg Electron Inc プラズマディスプレイパネル製造用の隔壁形成用組成物
WO2007077900A1 (ja) 2005-12-28 2007-07-12 Kaneka Corporation 光ラジカル硬化/熱ラジカル硬化併用硬化性組成物
EP2586804A2 (en) 2005-12-28 2013-05-01 Kaneka Corporation Photoradically and thermally radically curable composition
EP2586804A3 (en) * 2005-12-28 2013-07-24 Kaneka Corporation Photoradically and thermally radically curable composition
JP2017052822A (ja) * 2015-09-07 2017-03-16 三菱レイヨン株式会社 アクリル系樹脂組成物およびその製造方法
JPWO2022210785A1 (https=) * 2021-03-31 2022-10-06
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機el表示装置
CN116249722A (zh) * 2021-03-31 2023-06-09 电化株式会社 组合物、固化体及有机el显示装置
JP7671842B2 (ja) 2021-03-31 2025-05-02 デンカ株式会社 組成物、硬化体及び有機el表示装置

Also Published As

Publication number Publication date
TW200407669A (en) 2004-05-16
CN1497345B (zh) 2010-04-21
KR20040028570A (ko) 2004-04-03
TWI326394B (https=) 2010-06-21
CN1497345A (zh) 2004-05-19

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