TW200407669A - Photosensitive curable paste composition and sintered article pattern using the same - Google Patents
Photosensitive curable paste composition and sintered article pattern using the same Download PDFInfo
- Publication number
- TW200407669A TW200407669A TW092126506A TW92126506A TW200407669A TW 200407669 A TW200407669 A TW 200407669A TW 092126506 A TW092126506 A TW 092126506A TW 92126506 A TW92126506 A TW 92126506A TW 200407669 A TW200407669 A TW 200407669A
- Authority
- TW
- Taiwan
- Prior art keywords
- paste composition
- ethylenically unsaturated
- pattern
- unsaturated bond
- photosensitive thermosetting
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 87
- 150000001875 compounds Chemical class 0.000 claims abstract description 44
- 229920000642 polymer Polymers 0.000 claims abstract description 35
- 239000011230 binding agent Substances 0.000 claims abstract description 24
- 239000010419 fine particle Substances 0.000 claims description 49
- 229920001187 thermosetting polymer Polymers 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- -1 azo compound Chemical class 0.000 claims description 28
- 238000010304 firing Methods 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 8
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 150000002978 peroxides Chemical class 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 239000004615 ingredient Substances 0.000 claims description 3
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims 1
- 238000011049 filling Methods 0.000 abstract description 15
- 239000011859 microparticle Substances 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000005977 Ethylene Substances 0.000 abstract description 2
- 239000003999 initiator Substances 0.000 abstract 2
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- 239000000758 substrate Substances 0.000 description 63
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- 239000000178 monomer Substances 0.000 description 18
- 150000003254 radicals Chemical class 0.000 description 18
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- 239000002184 metal Substances 0.000 description 17
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- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
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- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
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- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 3
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 3
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- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
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- 150000001412 amines Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
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- 238000001723 curing Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
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- 238000002844 melting Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
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- 238000007650 screen-printing Methods 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- STFXXRRQKFUYEU-UHFFFAOYSA-N 16-methylheptadecyl prop-2-enoate Chemical compound CC(C)CCCCCCCCCCCCCCCOC(=O)C=C STFXXRRQKFUYEU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
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- ZZOVOEQLYMCZDY-UHFFFAOYSA-N (1-tert-butylcyclohexyl) (1-tert-butylcyclohexyl)oxy carbonate Chemical class C1CCCCC1(C(C)(C)C)OC(=O)OOC1(C(C)(C)C)CCCCC1 ZZOVOEQLYMCZDY-UHFFFAOYSA-N 0.000 description 1
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- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 description 1
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- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920000379 polypropylene carbonate Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- WXNYILVTTOXAFR-UHFFFAOYSA-N prop-2-en-1-ol;styrene Chemical compound OCC=C.C=CC1=CC=CC=C1 WXNYILVTTOXAFR-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- YWWDBCBWQNCYNR-UHFFFAOYSA-N trimethylphosphine Substances CP(C)C YWWDBCBWQNCYNR-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/34—Filling pastes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
- Y02P20/50—Improvements relating to the production of bulk chemicals
- Y02P20/582—Recycling of unreacted starting or intermediate materials
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Gas-Filled Discharge Tubes (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Inorganic Insulating Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002285548A JP2004123775A (ja) | 2002-09-30 | 2002-09-30 | 感光性熱硬化性ペースト組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200407669A true TW200407669A (en) | 2004-05-16 |
| TWI326394B TWI326394B (https=) | 2010-06-21 |
Family
ID=32278821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092126506A TW200407669A (en) | 2002-09-30 | 2003-09-25 | Photosensitive curable paste composition and sintered article pattern using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004123775A (https=) |
| KR (1) | KR20040028570A (https=) |
| CN (1) | CN1497345B (https=) |
| TW (1) | TW200407669A (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI381781B (zh) * | 2004-07-23 | 2013-01-01 | Sumitomo Electric Industries | 用雷射照射之導電性電路形成方法及導電性電路 |
| TWI483977B (zh) * | 2009-08-04 | 2015-05-11 | Sekisui Chemical Co Ltd | Inorganic fine particle dispersion paste |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100730474B1 (ko) * | 2004-07-22 | 2007-06-19 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널 제조용의 격벽형성 조성물 |
| KR100709186B1 (ko) * | 2005-06-29 | 2007-04-18 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널용 전극 형성용 조성물, 이로부터제조되는 전극 및 상기 전극을 포함하는 플라즈마디스플레이 패널 |
| KR20070002554A (ko) * | 2005-06-30 | 2007-01-05 | 엘지.필립스 엘시디 주식회사 | 액정표시장치 및 그 제조방법 |
| EP2586804B1 (en) | 2005-12-28 | 2014-04-02 | Kaneka Corporation | Photoradically and thermally radically curable composition |
| KR100895352B1 (ko) * | 2006-11-15 | 2009-04-29 | 다이요 잉키 세이조 가부시키가이샤 | 흑색 페이스트 조성물, 및 그것을 이용한 블랙 매트릭스패턴의 형성 방법, 및 그 블랙 매트릭스 패턴 |
| KR100871060B1 (ko) * | 2007-05-11 | 2008-11-27 | 주식회사 두산 | 감광성 페이스트 및 이의 이용 |
| KR100934078B1 (ko) * | 2007-12-28 | 2009-12-24 | 주식회사 두산 | 오프셋 인쇄용 감광성 페이스트 및 이의 이용 |
| KR101358254B1 (ko) * | 2012-02-06 | 2014-02-06 | 하나마이크로(주) | 기판 상에 기능성 조성물의 패턴을 형성하는 방법 및 그 방법에 의하여 형성된 기능성 패턴을 구비한 전자 장치 |
| CN104170021B (zh) * | 2012-05-22 | 2017-09-15 | 太阳控股株式会社 | 导电性组合物及由其形成有导电膜的电路基板 |
| TWI472877B (zh) * | 2012-11-20 | 2015-02-11 | Chi Mei Corp | 感光性樹脂組成物、彩色濾光片及其液晶顯示元件 |
| JP6857125B2 (ja) * | 2014-12-26 | 2021-04-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ． ＫＧａＡ | 焼結性接合材料およびそれを用いた半導体装置 |
| CN104808441A (zh) * | 2015-04-20 | 2015-07-29 | 北京欣奕华科技有限公司 | 组合物、黑矩阵及制备方法、显示装置 |
| JP2017052822A (ja) * | 2015-09-07 | 2017-03-16 | 三菱レイヨン株式会社 | アクリル系樹脂組成物およびその製造方法 |
| WO2022210785A1 (ja) * | 2021-03-31 | 2022-10-06 | デンカ株式会社 | 組成物、硬化体及び有機ｅｌ表示装置 |
| CN115119410A (zh) * | 2022-06-21 | 2022-09-27 | 深圳市百柔新材料技术有限公司 | 一种高精密单面电路互联制作miniLED背光板的方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07114183A (ja) * | 1993-10-15 | 1995-05-02 | Sony Corp | 光重合性組成物及びこれを用いた硬化塗膜パターンの形成方法 |
| US5565302A (en) * | 1995-04-21 | 1996-10-15 | W. R. Grace & Co.-Conn. | Process for preparing photosensitive resin composition |
| US5853957A (en) * | 1995-05-08 | 1998-12-29 | Tamura Kaken Co., Ltd | Photosensitive resin compositions, cured films thereof, and circuit boards |
| JPH08328248A (ja) * | 1995-06-02 | 1996-12-13 | Nippon Paint Co Ltd | 水現像性感光性樹脂組成物 |
| US5874197A (en) * | 1997-09-18 | 1999-02-23 | E. I. Du Pont De Nemours And Company | Thermal assisted photosensitive composition and method thereof |
| US6458509B1 (en) * | 1999-04-30 | 2002-10-01 | Toagosei Co., Ltd. | Resist compositions |
| TW522435B (en) * | 2000-05-23 | 2003-03-01 | Toray Industries | Slurry, display component and process for producing the display component |
-
2002
- 2002-09-30 JP JP2002285548A patent/JP2004123775A/ja active Pending
-
2003
- 2003-09-25 TW TW092126506A patent/TW200407669A/zh not_active IP Right Cessation
- 2003-09-29 KR KR1020030067318A patent/KR20040028570A/ko not_active Ceased
- 2003-09-29 CN CN031603955A patent/CN1497345B/zh not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI381781B (zh) * | 2004-07-23 | 2013-01-01 | Sumitomo Electric Industries | 用雷射照射之導電性電路形成方法及導電性電路 |
| TWI483977B (zh) * | 2009-08-04 | 2015-05-11 | Sekisui Chemical Co Ltd | Inorganic fine particle dispersion paste |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1497345B (zh) | 2010-04-21 |
| KR20040028570A (ko) | 2004-04-03 |
| JP2004123775A (ja) | 2004-04-22 |
| TWI326394B (https=) | 2010-06-21 |
| CN1497345A (zh) | 2004-05-19 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |