JP2004063996A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004063996A5 JP2004063996A5 JP2002223484A JP2002223484A JP2004063996A5 JP 2004063996 A5 JP2004063996 A5 JP 2004063996A5 JP 2002223484 A JP2002223484 A JP 2002223484A JP 2002223484 A JP2002223484 A JP 2002223484A JP 2004063996 A5 JP2004063996 A5 JP 2004063996A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulating film
- semiconductor device
- trench
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- 239000004020 conductor Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 8
- 238000009792 diffusion process Methods 0.000 claims 6
- 239000012535 impurity Substances 0.000 claims 6
- 238000000151 deposition Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 229910052721 tungsten Inorganic materials 0.000 claims 2
- 239000010937 tungsten Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052715 tantalum Inorganic materials 0.000 claims 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- -1 tungsten nitride Chemical class 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223484A JP2004063996A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002223484A JP2004063996A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004063996A JP2004063996A (ja) | 2004-02-26 |
| JP2004063996A5 true JP2004063996A5 (enExample) | 2005-10-20 |
Family
ID=31943223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002223484A Pending JP2004063996A (ja) | 2002-07-31 | 2002-07-31 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004063996A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7842614B2 (en) | 2007-01-04 | 2010-11-30 | Fujitsu Limited | Method for manufacturing semiconductor device and polisher used in the method for manufacturing semiconductor device |
| CN108520871B (zh) * | 2018-04-20 | 2020-09-08 | 北京智芯微电子科技有限公司 | 晶圆级芯片中的嵌入式焊盘及其制作方法 |
| CN108511350B (zh) * | 2018-05-14 | 2020-09-01 | 南京溧水高新创业投资管理有限公司 | 一种功率器件的封装方法及功率器件 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1140564A (ja) * | 1997-07-18 | 1999-02-12 | Nec Corp | 半導体装置およびその製造方法 |
| US6169664B1 (en) * | 1998-01-05 | 2001-01-02 | Texas Instruments Incorporated | Selective performance enhancements for interconnect conducting paths |
| JP3727818B2 (ja) * | 1999-03-19 | 2005-12-21 | 株式会社東芝 | 半導体装置の配線構造及びその形成方法 |
| JP2001196413A (ja) * | 2000-01-12 | 2001-07-19 | Mitsubishi Electric Corp | 半導体装置、該半導体装置の製造方法、ｃｍｐ装置、及びｃｍｐ方法 |
| JP3523189B2 (ja) * | 2000-12-27 | 2004-04-26 | 株式会社東芝 | 半導体装置 |
| JP3418615B2 (ja) * | 2001-06-12 | 2003-06-23 | 沖電気工業株式会社 | 半導体素子およびその製造方法 |
-
2002
- 2002-07-31 JP JP2002223484A patent/JP2004063996A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6548377B2 (ja) | 集積回路素子及びその製造方法 | |
| US8446003B2 (en) | Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate | |
| CN101325167B (zh) | 制造具有均匀涂层厚度的半导体器件的方法及相关器件 | |
| US6424036B1 (en) | Semiconductor device and method for manufacturing the same | |
| US7812457B2 (en) | Semiconductor device and semiconductor wafer and a method for manufacturing the same | |
| JP2003031730A5 (enExample) | ||
| JP2005520342A5 (enExample) | ||
| JP2009152583A (ja) | 半導体素子及びその製造方法 | |
| WO2002078082A3 (en) | Electronic structure | |
| US10504861B2 (en) | Semiconductor device with over pad metal electrode and method for manufacturing the same | |
| TW201519383A (zh) | 半導體裝置，製造其之方法，包含其之記憶卡以及包含其之電子系統 | |
| JP2003520417A5 (enExample) | ||
| WO2006003760A1 (ja) | 半導体装置及びその製造方法 | |
| TW200427058A (en) | Semiconductor device including metal interconnection and metal resistor and method of manufacturing the same | |
| JP2016021497A (ja) | 半導体装置およびその製造方法 | |
| US20030227091A1 (en) | Plating metal caps on conductive interconnect for wirebonding | |
| KR970077573A (ko) | 도금된 구리 상부 표면 레벨 상호 접속을 갖는 집적 회로를 위한 플라스틱 캡슐화 | |
| JP2005197602A5 (enExample) | ||
| JP2004063996A5 (enExample) | ||
| TWI329346B (en) | Method of manufacturing electronic circuit device | |
| JP2004153260A5 (enExample) | ||
| JP3647631B2 (ja) | 半導体装置及びその製造方法 | |
| JP2005159326A5 (enExample) | ||
| TWI237890B (en) | Integrated semiconductor structure | |
| JP2005260079A5 (enExample) |