JP2004048037A5 - - Google Patents
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- Publication number
- JP2004048037A5 JP2004048037A5 JP2003297773A JP2003297773A JP2004048037A5 JP 2004048037 A5 JP2004048037 A5 JP 2004048037A5 JP 2003297773 A JP2003297773 A JP 2003297773A JP 2003297773 A JP2003297773 A JP 2003297773A JP 2004048037 A5 JP2004048037 A5 JP 2004048037A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electronic component
- electrode layer
- mounting body
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000605 extraction Methods 0.000 claims description 55
- 239000003990 capacitor Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 20
- 230000000149 penetrating Effects 0.000 claims description 3
- 239000010409 thin film Substances 0.000 description 43
- 239000000463 material Substances 0.000 description 41
- 239000003921 oil Substances 0.000 description 35
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 239000010408 film Substances 0.000 description 24
- 239000012212 insulator Substances 0.000 description 21
- 230000000873 masking Effects 0.000 description 16
- 239000000969 carrier Substances 0.000 description 15
- 239000011347 resin Substances 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000011737 fluorine Substances 0.000 description 8
- 229910052731 fluorine Inorganic materials 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 8
- 238000005755 formation reaction Methods 0.000 description 8
- 239000011224 oxide ceramic Substances 0.000 description 8
- 238000000059 patterning Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 229910010293 ceramic material Inorganic materials 0.000 description 7
- 238000001704 evaporation Methods 0.000 description 7
- 238000010329 laser etching Methods 0.000 description 7
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000002480 mineral oil Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000000427 thin-film deposition Methods 0.000 description 6
- 229920001940 conductive polymer Polymers 0.000 description 5
- 239000003989 dielectric material Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- HPCHGGAMBXTKGB-UHFFFAOYSA-N $l^{1}-alumanyloxysilicon Chemical compound [Al]O[Si] HPCHGGAMBXTKGB-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- VEALVRVVWBQVSL-UHFFFAOYSA-N Strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N TiO Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- VKJLWXGJGDEGSO-UHFFFAOYSA-N barium(2+);oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[Ti+4].[Ba+2] VKJLWXGJGDEGSO-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 150000002344 gold compounds Chemical class 0.000 description 4
- 150000002736 metal compounds Chemical class 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 229910052752 metalloid Inorganic materials 0.000 description 4
- 150000002738 metalloids Chemical class 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 229910001929 titanium oxide Inorganic materials 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 210000002381 Plasma Anatomy 0.000 description 3
- 235000020127 ayran Nutrition 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 238000001771 vacuum deposition Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- -1 titanium oxide Metal oxides Chemical class 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003297773A JP3793186B2 (ja) | 2003-08-21 | 2003-08-21 | 電子部品実装体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003297773A JP3793186B2 (ja) | 2003-08-21 | 2003-08-21 | 電子部品実装体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11567399A Division JP3701138B2 (ja) | 1999-04-23 | 1999-04-23 | 電子部品の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004048037A JP2004048037A (ja) | 2004-02-12 |
| JP2004048037A5 true JP2004048037A5 (ko) | 2005-05-26 |
| JP3793186B2 JP3793186B2 (ja) | 2006-07-05 |
Family
ID=31712626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003297773A Expired - Fee Related JP3793186B2 (ja) | 2003-08-21 | 2003-08-21 | 電子部品実装体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3793186B2 (ko) |
-
2003
- 2003-08-21 JP JP2003297773A patent/JP3793186B2/ja not_active Expired - Fee Related
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